Product Information

NVT4556BUKZ

NVT4556BUKZ electronic component of NXP

Datasheet
Translation - Voltage Levels Interface translator SIM card w I2C
Manufacturer: NXP
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
N/A

Obsolete

 More Buying Options & Price Grid(s)

Availability Price Quantity
0 - WHS 1

MOQ : 1
Multiples : 1
1 : USD 1.1941
30 : USD 1.1328
75 : USD 0.9585
150 : USD 0.8713
375 : USD 0.8038
750 : USD 0.6615
1500 : USD 0.648
N/A

Obsolete
0 - WHS 2

MOQ : 1
Multiples : 1
1 : USD 3.753
10 : USD 1.4062
25 : USD 1.2852
100 : USD 1.08
250 : USD 1.0087
500 : USD 0.904
1000 : USD 0.8986
3000 : USD 0.8986
N/A

Obsolete

Read More Specifications

     
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Type
Propagation Delay Time
Supply Voltage - Max
Supply Voltage - Min
Maximum Operating Temperature
Mounting Style
Minimum Operating Temperature
Mounting Style
Package / Case
Packaging
Input Type
Output Type
Brand
Operating Supply Current
Factory Pack Quantity :
Cnhts
Hts Code
Mxhts
Product Type
Subcategory
Taric
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Additional Infomation About Product

NVT4556 2 SIM card interface level translator with I C-bus control and LDO Rev. 1.1 25 August 2015 Product data sheet 1. General description The NVT4556 device is built for interfacing a SIM card with a single low-voltage host-side interface. The NVT4556 contains an LDO that can deliver two different voltages, 1.8 V or 3 V, from a typical mobile phone battery voltage, and three level translators to convert the data, RSTn and CLKn signals between a SIM card and a host microcontroller. The NVT4556 V pin provides power to the host side I/Os and doubles as an enable pin, CC for this reason it can be connected to a GPIO that matches the host side voltage. The total current draw from the V pin is only 100 A maximum. The NVT4556 also uses the CC 2 I C-bus interface to enable normal operation and to select either 1.8 V or 3 V for the SIM card power supply. The NVT4556 can also disable the LDO functionality while maintaining the level translator paths so that the user can use a system-controlled regulator to power the SIM card power supply. The NVT4556 can enable users to provide second and third SIM card functionality with a low-voltage one host SIM port, at the same time reducing the number of GPIOs used in the system. The NVT4556 is compliant with all ETSI, IMT-2000 and ISO-7816 SIM/Smart card interface requirements. The NVT4556 is available in a 12-pin WLCSP package and has three factory programmed slave address options. 2. Features and benefits Support SIM card supply voltages 1.8 V and 3 V Input voltage range to LDO: 2.5 V to 5.25 V Host microcontroller operating voltage range: 1.55 V to 3.6 V V input pin provides both host supply voltage and logic level hardware CC enable/disable pin: source through Host GPIO (I <100 A) CC RST HOST/EN pin can be programmed as a reset pin or as a device enable/disable pin Level translation of I/O, RSTn and CLKn between SIM card and host-side interface with capacitive isolation 2 I C-bus interface for device enable and LDO voltage selection Low current shutdown mode < 3 A Supports clock speed beyond 5 MHz clock Supports CLK stop mode Integrated EMI filters Incorporates ISO-7816-3 shutdown feature for the SIM card signals ETSI, IMT2000 and ISO-7816 compliant 8 kV IEC61000-4-2 ESD protected on all SIM card contact pinsNVT4556 NXP Semiconductors 2 SIM card interface level translator with I C-bus control and LDO Pb-free, Restriction of Hazardous Substances (RoHS) compliant and free of halogen and antimony (Dark Green compliant) Available in 12-pin WLCSP package (1.205 mm 1.605 mm 0.412 mm, 0.4 mm pitch) 3. Applications NVT4556 can be used with a range of SIM card attached devices including: Mobile and personal phones Wireless modems SIM card terminals 4. Ordering information Table 1. Ordering information Type number Topside Package mark Name Description Version NVT4556AUK 556A WLCSP12 wafer level chip-size package 12 balls NVT4556AUK body 1.205 1.605 0.412 mm (Backside coating included) NVT4556BUK 556B WLCSP12 wafer level chip-size package 12 balls NVT4556BUK body 1.205 1.605 0.412 mm (Backside coating included) 4.1 Ordering options Table 2. Ordering options Type number Orderable Package Packing method Minimum Temperature Slave part number order address quantity NVT4556AUK NVT4556AUKZ WLCSP12 Reel 7 Q1/T1 3000 T = 40 C to +85 C 1100 000xb amb *Special mark chips dry pack NVT4556BUK NVT4556BUKZ WLCSP12 Reel 7 Q1/T1 3000 T = 40 C to +85 C 1100 001xb amb *Special mark chips dry pack NVT4556 All information provided in this document is subject to legal disclaimers. NXP Semiconductors N.V. 2015. All rights reserved. Product data sheet Rev. 1.1 25 August 2015 2 of 27

HS Compliance

Tariff Desc

8542.39.23 No ..Linear/analogue and peripheral integrated circuits, timers, voltage regulators, A/D and D/A converters, telecommunication and modem integrated circuits, other than board level products Free

Electronic integrated circuits- Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits

NXP may also be referenced as

FR9
Freescale
FREESCALE SEMI
Freescale Semicon
FREESCALE SEMICONDUC
Freescale Semiconductor
Freescale Semiconductor - NXP
NXP
NXP Freescale
NXP (FREESCALE)
NXP / Freescale
NXP SEMI
NXP Semicon
NXP SEMICONDUCTOR
NXP Semiconductors
NXP USA Inc.
PH3
PHI

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