PCF8570T/F5,512 NXP

PCF8570T/F5,512 electronic component of NXP Images are for reference only, See Product Specifications

X-On Electronics has gained recognition as a prominent supplier of PCF8570T/F5,512 SRAM across the USA, India, Europe, Australia, and various other global locations. PCF8570T/F5,512 SRAM are a product manufactured by NXP. We provide cost-effective solutions for SRAM, ensuring timely deliveries around the world.

Part No. PCF8570T/F5,512
Manufacturer: NXP
Category: SRAM
Description: SRAM Chip Sync Single 3.3V/5V 2K-Bit 256 x 8 3.4us 8-Pin SO Tube
Datasheet: PCF8570T/F5,512 Datasheet (PDF)
Price (USD)
N/A


Availability 0
MOQ : 1
Multiples : 2560
QtyUnit Price
1$ 35.2646
N/A

   
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We are delighted to provide the PCF8570T/F5,512 from our SRAM category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the PCF8570T/F5,512 and other electronic components in the SRAM category and beyond.

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INTEGRATED CIRCUITS DATA SHEET PCF8570 256 8-bit static low-voltage RAM 2 with I C-bus interface 1999 Jan 06 Product specication Supersedes data of 1997 Sep 02 File under Integrated Circuits, IC12Philips Semiconductors Product specication 256 8-bit static low-voltage RAM with PCF8570 2 I C-bus interface CONTENTS 1 FEATURES 2 APPLICATIONS 3 GENERAL DESCRIPTION 4 QUICK REFERENCE DATA 5 ORDERING INFORMATION 6 BLOCK DIAGRAM 7 PINNING 2 8 CHARACTERISTICS OF THE I C-BUS 8.1 Bit transfer 8.2 Start and stop conditions 8.3 System configuration 8.4 Acknowledge 2 8.5 I C-bus protocol 9 LIMITING VALUES 10 HANDLING 11 DC CHARACTERISTICS 12 AC CHARACTERISTICS 13 APPLICATION INFORMATION 13.1 Application example 13.2 Slave address 13.3 Power-saving mode 14 PACKAGE OUTLINES 15 SOLDERING 15.1 Introduction 15.2 Through-hole mount packages 15.2.1 Soldering by dipping or by solder wave 15.2.2 Manual soldering 15.3 Surface mount packages 15.3.1 Reflow soldering 15.3.2 Wave soldering 15.3.3 Manual soldering 15.4 Suitability of IC packages for wave, reflow and dipping soldering methods 16 DEFINITIONS 17 LIFE SUPPORT APPLICATIONS 2 18 PURCHASE OF PHILIPS I C COMPONENTS 1999 Jan 06 2

Tariff Desc

8542.32.00 31 No ..Random Access Memory (RAM) including Single Inline Memory Modules (SIMMS), Dual Inline Memory Modules (DIMMS), Dynamic Random Access Memory (DRAM), Synchronous Dynamic Random Access Memory (SD RAM), Rambus Dynamic Random Access Memory (RD RAM) and other similar memory
Freescale
FREESCALE SEMI
Freescale Semicon
FREESCALE SEMICONDUC
Freescale Semiconductor
Freescale Semiconductor - NXP
NXP
NXP Freescale
NXP (FREESCALE)
NXP / Freescale
NXP SEMI
NXP Semicon
NXP SEMICONDUCTOR
NXP Semiconductors
NXP USA Inc.
PH3
PHI
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