Product Information

SL2ICS2001DW/V1D,3

SL2ICS2001DW/V1D,3 electronic component of NXP

Datasheet
RF Wireless Misc I CODE SLI SMART LABEL IC

Manufacturer: NXP
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

32000: USD 0.1124 ea
Line Total: USD 3596.8

0 - Global Stock
MOQ: 32000  Multiples: 32000
Pack Size: 32000
Availability Price Quantity
0 - Global Stock


Ships to you between Fri. 03 May to Thu. 09 May

MOQ : 32000
Multiples : 32000
32000 : USD 0.2107

     
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RoHS - XON
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INTEGRATED CIRCUITS ICODE SLI Smart Label IC SL2 ICS20 Functional Specification Product Specification July 2001 February 2005 Revision 3.1 Public Philips SemiconductorsPhilips Semiconductors Product Specification Rev. 3.1 February 2005 Functional Specification Standard Label IC SL2 ICS20 CONTENTS 1 FEATURES.................................................................................................................................4 1.1 ICODE SLI RF Interface (ISO/IEC 15693)....................................................................................4 1.2 EEPROM....................................................................................................................................4 1.3 Security ......................................................................................................................................4 2 GENERAL DESCRIPTION...........................................................................................................5 2.1 Contactless Energy and Data Transfer..........................................................................................5 2.2 Anticollision.................................................................................................................................5 2.3 Security ......................................................................................................................................5 3 FUNCTIONAL DESCRIP TION .....................................................................................................6 3.1 Block Description.........................................................................................................................6 3.2 Memory Organisation ..................................................................................................................7 3.2.1 Unique Identifier..........................................................................................................................8 3.2.2 EAS Function..............................................................................................................................8 3.2.3 Application Family Identifier..........................................................................................................9 3.2.4 Data Storage Format Identifier......................................................................................................9 3.2.5 Write Access Conditions ............................................................................................................ 10 3.2.6 Configuration of delivered ICs .................................................................................................... 11 3.3 Communication Principle ........................................................................................................... 11 3.4 Supported Commands ............................................................................................................... 11 3.4.1 Mandatory commands ............................................................................................................... 11 3.4.2 Optional commands................................................................................................................... 11 3.4.3 Custom commands.................................................................................................................... 14 3.5 Error handling ........................................................................................................................... 19 3.5.1 Transmission errors ................................................................................................................... 19 3.5.2 Not supported commands or options........................................................................................... 19 3.5.3 Parameter out of range .............................................................................................................. 19 3.6 Data Integrity ............................................................................................................................ 20 3.7 RF Interface.............................................................................................................................. 20 4 INLET/LABEL CHARACTERISATION AND TEST....................................................................... 21 5 DEFINITIONS ........................................................................................................................... 22 6 DISCLAIMERS.......................................................................................................................... 22 6.1 Life Support Applications ........................................................................................................... 22 6.2 Licence Policy........................................................................................................................... 22 2

Tariff Desc

8542.31.00 51 No ..Application Specific (Digital) Integrated Circuits (ASIC)

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits:
FR9
Freescale
FREESCALE SEMI
Freescale Semicon
FREESCALE SEMICONDUC
Freescale Semiconductor
Freescale Semiconductor - NXP
NXP
NXP Freescale
NXP (FREESCALE)
NXP / Freescale
NXP SEMI
NXP Semicon
NXP SEMICONDUCTOR
NXP Semiconductors
NXP USA Inc.
PH3
PHI

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