SL2ICS2001DW/V1D,3 NXP

INTEGRATED CIRCUITS ICODE SLI Smart Label IC SL2 ICS20 Functional Specification Product Specification July 2001 February 2005 Revision 3.1 Public Philips SemiconductorsPhilips Semiconductors Product Specification Rev. 3.1 February 2005 Functional Specification Standard Label IC SL2 ICS20 CONTENTS 1 FEATURES.................................................................................................................................4 1.1 ICODE SLI RF Interface (ISO/IEC 15693)....................................................................................4 1.2 EEPROM....................................................................................................................................4 1.3 Security ......................................................................................................................................4 2 GENERAL DESCRIPTION...........................................................................................................5 2.1 Contactless Energy and Data Transfer..........................................................................................5 2.2 Anticollision.................................................................................................................................5 2.3 Security ......................................................................................................................................5 3 FUNCTIONAL DESCRIP TION .....................................................................................................6 3.1 Block Description.........................................................................................................................6 3.2 Memory Organisation ..................................................................................................................7 3.2.1 Unique Identifier..........................................................................................................................8 3.2.2 EAS Function..............................................................................................................................8 3.2.3 Application Family Identifier..........................................................................................................9 3.2.4 Data Storage Format Identifier......................................................................................................9 3.2.5 Write Access Conditions ............................................................................................................ 10 3.2.6 Configuration of delivered ICs .................................................................................................... 11 3.3 Communication Principle ........................................................................................................... 11 3.4 Supported Commands ............................................................................................................... 11 3.4.1 Mandatory commands ............................................................................................................... 11 3.4.2 Optional commands................................................................................................................... 11 3.4.3 Custom commands.................................................................................................................... 14 3.5 Error handling ........................................................................................................................... 19 3.5.1 Transmission errors ................................................................................................................... 19 3.5.2 Not supported commands or options........................................................................................... 19 3.5.3 Parameter out of range .............................................................................................................. 19 3.6 Data Integrity ............................................................................................................................ 20 3.7 RF Interface.............................................................................................................................. 20 4 INLET/LABEL CHARACTERISATION AND TEST....................................................................... 21 5 DEFINITIONS ........................................................................................................................... 22 6 DISCLAIMERS.......................................................................................................................... 22 6.1 Life Support Applications ........................................................................................................... 22 6.2 Licence Policy........................................................................................................................... 22 2