FC4T Series Metal Foil Low Value Chip The FC4T chip features four terminals, also known as a Kelvin configuration. This configuration enables current to be applied through two opposite terminals and a sensing voltage to be measured across the other two terminals, eliminating the resis- tance and temperature coefficient of the terminals for a more accurate current measurement. Ohmites proprietary Metal Foil technology offers an excellent Temperature Coefficient of Resistance (TCR) even for very low resistance values ( down to 50ppm). SerieS SpeCiFiCa TionS Power Resistance Pkg. Rating Range TCR Series Size (W 70C) () (ppm/C) Tolerance FC4T 1206 0.5W 0.005-0.100 50ppm 0.5%, 1% CharaCTeriSTiCS Resistance 0.005-0.100 Derating Operating Temp. Range -55C to +155C 100 0.5 watt Rated Power -55 70 80 Resistance Tolerance 0.5% and 1% standard Temperature Coefficient within 50ppm, 100ppm for 5m 60 Coating Material Epoxy resin 40 Terminals Cu/Ni/Sn 20 Max. Current (Max. power Resistance value) 155 0 <5m Res. of Electrodes -75-50 0 50 100 150175 Ambient Temperature, C Construction Peeling Strength of Seal Tape Epoxy resin marking Cu-alloy resistor F = Peel-back force: 0.1 - 0.7N (10 - 71gf) Alumina Substrate 165~180 F Epoxy resin Electrode (Cu+Ni+Sn) protection coat (continued) 12 1-866-9-OHMITE Intl 1-847-258-0300 Fax 1-847-574-7522 www.ohmite.com info ohmite.com Percent Rated PowerFC4T Series Metal Foil Low Value Chip perFormanCe CharaCTeriSTiCS Test Items Performance Test Methods Short time overload (1.0%+0.5m) P= 2.5Pr T=25 2C, t=5sec. IEC60115-1 4.13 (1.0%+0.5m) T=+170 2C t=1000h IEC60115-1 4.25 High Temp. Exposure Low Temp. Storage (1.0%+0.5m) T=-55 2C t=1000h IEC60115-1 4.25 Moisture Load Life (2.0%+0.5m) Vtest=Vmax T=60 2C RH=95% t= 90min ON, 30min OFF, 1000h IEC60115-1 4.25 (60, 95%RH) Thermal Shock (1.0%+0.5m) -55C 30min. / R.T. 3min. / +150C 30min. / R.T. 3min , 100cycles IEC60115-1 4.19 Load Life at 70C (2%+0.5m) Vtest=Vmax T=70 2C t=90min ON IEC60115-1 4.25 Solderability The covered area >95% Dip into solder at T=245 5C, t=3 0.5sec. IEC60115-1 4.17 Resistance to Solder Heat (1.0%+0.5m) Through Reflow T=275 5C, t=20 1sec. IEC60115-1 4.18 Mechanical Shock (1.0%+0.5m) a=100G, t=11ms, 5 times shock IEC60115-1 4.21 Substrate Bending (1.0%+0.5m) Span between fulcrums 90mm bend width 2mm test board glass-epoxy Thickness=1.6mm IEC60115-1 4.33 dimenSionS (mm 0.2) Schematic f L t b d VV Layout for illustration only, c e W II part can be rotated 180 V = sensing terminal without effect to (voltage) a g the circuit. I = current terminal Part L W a b c t d e f g FC4T 3.2 1.6 0.6 0.55 0.3 0.6 1.10 0.30 1.2 1.8 Tape and Reel P Direction T D P of feed 0 2 K E A 178 5 A N F N 60 2 W B W1 9 1 T D A 1 1 W 1 P Part W P P2 A B D0 F E T T1 K FC4T 8.00 0.30 4.00 0.10 2.00 0.10 2.05 0.20 3.65 0.20 1.50 0.10 3.50 0.10 1.75 0.10 0.20 0.10 Max. 0.1 0.85 0.20 orderinG inForma Tion RoHS Compliant Standard Part Numbers 1% 0.5% FC4TR010DE R FC4TR005FER FC4TR010DER Series Ohms Tolerance Tape & Reel FC4TR010FER FC4TR015DER F= 1% 5000/reel FC4TR015FER FC4TR050DER D= 0.5% FC4TR050FER FC4TR100DER FC4TR100FER rev 1/18-3 1-866-9-OHMITE Intl 1-847-258-0300 Fax 1-847-574-7522 www.ohmite.com info ohmite.com 13