MC74AC245, MC74ACT245 Octal Bidirectional Transceiver with 3-State Inputs/Outputs The MC74AC245/74ACT245 contains eight noninverting bidirectional buffers with 3state outputs and is intended for www.onsemi.com busoriented applications. Current sinking capability is 24 mA at both the A and B ports. The Transmit/Receive (T/R) input determines the direction of data flow through the bidirectional transceiver. Transmit SOIC20W (activeHIGH) enables data from A ports to B ports Receive DW SUFFIX (activeLOW) enables data from B ports to A ports. The Output CASE 751D 1 Enable input, when HIGH, disables both A and B ports by placing them in a High Z condition. Features Noninverting Buffers TSSOP20 DT SUFFIX Bidirectional Data Path CASE 948E A and B Outputs Source/Sink 24 mA 1 ACT245 has TTL Compatible Inputs These are PbFree Devices ORDERING INFORMATION See detailed ordering and shipping information in the package PIN ASSIGNMENT dimensions section on page 6 of this data sheet. PIN FUNCTION OE Output Enable Input DEVICE MARKING INFORMATION T/R Transmit/Receive Input See general marking information in the device marking A A Side A 3State Inputs or 3State Outputs 0 7 section on page 7 of this data sheet. B B Side B 3State Inputs or 3State Outputs 0 7 TRUTH TABLES Inputs Outputs OE T/R L L Bus B Data to Bus A L H Bus A Data to Bus B H X High Z State H = HIGH Voltage Level L = LOW Voltage Level X = Immaterial V OE B B B B B B B B CC 0 1 2 3 4 5 6 7 20 19 18 17 16 15 14 13 12 11 1 2 3 4567 8 9 10 T/R A A A A A A A A GND 0 1 2 3 4 5 6 7 Figure 1. Semiconductor Components Industries, LLC, 2015 1 Publication Order Number: February, 2015 Rev. 8 MC74AC245/DMC74AC245, MC74ACT245 MAXIMUM RATINGS Symbol Parameter Value Unit V DC Supply Voltage (Referenced to GND) 0.5 to +7.0 V CC V DC Input Voltage (Referenced to GND) 0.5 to V +0.5 V IN CC V DC Output Voltage (Referenced to GND) (Note 1) 0.5 to V +0.5 V OUT CC I DC Input Diode Current 20 mA IK I DC Output Diode Current 50 mA OK I DC Output Sink/Source Current 50 mA OUT I DC Supply Current, per Output Pin 50 mA CC I DC Ground Current, per Output Pin 100 mA GND T Storage Temperature Range 65 to 150 C STG T Lead temperature, 1 mm from Case for 10 Seconds 260 C L T Junction Temperature Under Bias 140 C J Thermal Resistance (Note 2) SOIC 65.8 C/W JA TSSOP 110.7 MSL Moisture Sensitivity Level 1 F Flammability Rating Oxygen Index: 30% 35% UL 94 V0 0.125 in R V ESD Withstand Voltage Human Body Model (Note 3) > 2000 V ESD Machine Model (Note 4) > 200 Charged Device Model (Note 5) > 1000 I Latchup Performance Above V and Below GND at 85 C (Note 6) 100 mA Latchup CC Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. I absolute maximum rating must be observed. OUT 2. The package thermal impedance is calculated in accordance with JESD 517. 3. Tested to EIA/JESD22A114A. 4. Tested to EIA/JESD22A115A. 5. Tested to JESD22C101A. 6. Tested to EIA/JESD78. RECOMMENDED OPERATING CONDITIONS Symbol Parameter Min Typ Max Unit AC 2.0 5.0 6.0 V Supply Voltage V CC ACT 4.5 5.0 5.5 V , V DC Input Voltage, Output Voltage (Ref. to GND) 0 V V IN OUT CC V 3.0 V 150 CC Input Rise and Fall Time (Note 7) t , t V 4.5 V 40 ns/V r f CC AC Devices except Schmitt Inputs V 5.5 V 25 CC V 4.5 V 10 CC Input Rise and Fall Time (Note 8) t , t ns/V r f ACT Devices except Schmitt Inputs V 5.5 V 8.0 CC T Operating Ambient Temperature Range 40 25 85 C A I Output Current High 24 mA OH I Output Current Low 24 mA OL Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. 7. V from 30% to 70% V see individual Data Sheets for devices that differ from the typical input rise and fall times. IN CC 8. V from 0.8 V to 2.0 V see individual Data Sheets for devices that differ from the typical input rise and fall times. IN www.onsemi.com 2