ON Semiconductor Is Now To learn more about onsemi, please visit our website at www.onsemi.com onsemi andand other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba onsemi or its affiliates and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of onsemi product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. onsemi reserves the right to make changes at any time to any products or information herein, without notice. The information herein is provided as-is and onsemi makes no warranty, representation or guarantee regarding the accuracy of the information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by onsemi. Typical parameters which may be provided in onsemi data sheets and/ or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including Typicals must be validated for each customer application by customers technical experts. onsemi does not convey any license under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and holdo nsemi and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that onsemi was negligent regarding the design or manufacture of the part. onsemi is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. Other names and brands may be claimed as the property of others. FSA642 Low-Power, Three-Port, High-Speed MIPI Switch FSA642 Low-Power, Three-Port, High-Speed MIPI Switch Features Description The FSA642 is a bi-directional, low -pow er, high-speed Low On Capacitance: 7.0 pF Typical analog sw itch. The pin out is designed to ease Low On Resistance: 7.0 Typical differential signal layout and is configured as a triple- pole, double-throw sw itch (TPDT). The FSA642 is Wide -3db Bandw idth: 1 GHz Typical optimized for sw itching betw een tw o MIPI devices, such 24-Lead UMLP (2.5 x 3.4 mm) Package as cameras or LCD displays and on-board Multimedia Application Processors (MAP). 8 kV ESD Rating >16 kV Pow er/GND ESD Rating The FSA642 is compatible w ith the requirements of Applications Mobile Industry Processor Interface (MIPI). The low - capacitance design allow s the FSA642 to sw itch signals Dual Camera Applications for Cell Phones that exceed 500 MHz in frequency. Superior channel-to- channel crosstalk immunity minimizes interference and Dual LCD Applications for Cell Phones, allow s the transmission of high-speed differential signals Digital Camera Displays, and View finders and single-ended signals, as described by the MIPI specification. Ordering Information Part Number Top Mark Operating Temperature Range Package 24-Lead, Quad, Ultrathin Molded Leadless FSA642UMX JG -40 to +85C Package (UMLP), 2.5 x 3.4 mm Camera 1 Camera 2 LCD 1 LCD 2 D C D C D D C D D C FSA642 FSA642 D C D C MAP Processor MAP Processor Figure 1. Application Block Diagram 2008 Semiconductor Components Industries, LLC. Publication Order Number: December-2017, Rev. 2 FSA642/D