Product Information

J211-D74Z

J211-D74Z electronic component of ON Semiconductor

Datasheet
RF JFET Transistors NCh RF Transistor

Manufacturer: ON Semiconductor
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 0.5218 ea
Line Total: USD 0.52

420 - Global Stock
Ships to you between
Fri. 03 May to Thu. 09 May
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
191 - Global Stock


Ships to you between Fri. 03 May to Thu. 09 May

MOQ : 1
Multiples : 1

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J211-D74Z
ON Semiconductor

1 : USD 0.1652
10 : USD 0.1408
100 : USD 0.1297
1000 : USD 0.1196
2000 : USD 0.1172
10000 : USD 0.1172
50000 : USD 0.1172

     
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Number Of Elements Per Chip
Maximum Gate Source Voltage V
Typical Forward Transconductance S
Maximum Power Dissipation Mw
Minimum Operating Temperature °C
Maximum Operating Temperature °C
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J211 / MMBFJ211 N-Channel RF Amplifier J211 / MMBFJ211 N-Channel RF Amplifier Description This device is designed for HF/VHF mixer/amplifier and applications where process 50 is not adequate. Sufficient gain and low-noise for sensitive receivers. Sourced from process 90. G TO-92 S 1. Drain Note: Source & Drain SOT-23 2. Source D are interchangeable 1 1 3. Gate 2 3 2 3 Straight Lead Bent Lead Bulk Packing Tape & Reel Ammo Packing Figure 1. J211 Device Package Figure 2. MMBFJ211 Device Package Ordering Information Part Number Top Mark Package Packing Method J211-D74Z J211 TO-92 3L Ammo MMBFJ211 62W SOT-23 3L Tape and Reel 1997 Semiconductor Components Industries, LLC. Publication Order Number: J211-D74Z/D September-2017, Rev. 2J211 / MMBFJ211 N-Channel RF Amplifier (1), (2) Absolute Maximum Ratings Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be opera- ble above the recommended operating conditions and stressing the parts to these levels is not recommended. In addi- tion, extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings are stress ratings only. Values are at T = 25C unless otherwise noted. A Symbol Parameter Value Unit V Drain-Gate Voltage 25 V DG V Gate-Source Voltage -25 V GS I Forward Gate Current 10 mA GF T , T Operating and Storage Junction Temperature Range -55 to 150 C J STG Notes: 1. These ratings are based on a maximum junction temperature of 150C. 2. These are steady-state limits. ON Semiconductor should be consulted on applications involving pulsed or low- duty-cycle operations. Thermal Characteristics Values are at T = 25C unless otherwise noted. A Max. Symbol Parameter Unit (3) (3) J211 MMBFJ211 Total Device Dissipation 350 225 mW P D Derate Above 25C 2.8 1.8 mW/C R Thermal Resistance, Junction-to-Case 125 C/W JC R Thermal Resistance, Junction-to-Ambient 357 556 C/W JA Note: 2 . 3. Device mounted on FR-4 PCB 36mm 18mm 1.5mm; mounting pad for the collector lead minimum 6cm Electrical Characteristics Values are at T = 25C unless otherwise noted. A Symbol Parameter Conditions Min. Max. Unit Off Characteristics V Gate-Source Breakdown Voltage I = 1.0 A, V = 0 -25 V (BR)GSS G DS I Gate Reverse Current V = 15 V, V = 0 -100 pA GSS GS DS V (off) Gate-Source Cut-Off Voltage V = 15 V, I = 1.0 nA -2.5 -4.5 V GS DS D On Characteristics (4) I Zero-Gate Voltage Drain Current V = 15 V, V = 0 7.0 20 mA DSS DS GS Small Signal Characteristics Common Source Forward V = 15 V, V = 0, DS GS g 7000 12000 mhos fs Transconductance f = 1.0 kHz Common Source Output V = 15 V, V = 0, DS GS g 200 mhos oss Conductance f = 1.0 kHz Note: 4. Pulse test: pulse width 300 s www.onsemi.com 2

Tariff Desc

8541.21.00 16 No - - With a dissipation rate of less than 1 W Free

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