DATA SHEET www.onsemi.com Voltage Regulator - Low LOW DROPOUT MICROPOWER VOLTAGE Dropout REGULATOR 300 mA MARKING DIAGRAMS MC33275, NCV33275 The MC33275 series are micropower low dropout voltage 4 SOT223 AYW regulators available in a wide variety of output voltages as well as ST SUFFIX 275xx 1 packages, SOT223, SOP 8, DPAK, and DFN 4x4 surface mount CASE 318E 3 packages. These devices feature a very low quiescent current and are 1 capable of supplying output currents up to 300 mA. Internal current and thermal limiting protection are provided by the presence of a short 8 circuit at the output and an internal thermal shutdown circuit. SOIC8 275xx 8 Due to the low inputtooutput voltage differential and bias current D SUFFIX ALYW CASE 751 specifications, these devices are ideally suited for battery powered 1 1 computer, consumer, and industrial equipment where an extension of useful battery life is desirable. Features 4 275xxG DPAK Low InputtoOutput Voltage Differential of 25 mV at I = 10 mA, O ALYWW DT SUFFIX and 260 mV at I = 300 mA 2 O 1 CASE 369C 3 Extremely Tight Line and Load Regulation Stable with Output Capacitance of only 0.33 F for 2.5 V Output Voltage 1 Internal Current and Thermal Limiting 275xx DFN8, 4x4 MN SUFFIX ALYW NCV Prefix for Automotive and Other Applications Requiring CASE 488AF 1 Unique Site and Control Change Requirements AECQ100 Qualified and PPAP Capable xx = Voltage Version These are PbFree Devices A = Assembly Location L = Wafer Lot Applications Y = Year Battery Powered Consumer Products W, WW = Work Week or G = PbFree Device HandHeld Instruments (Note: Microdot may be in either location) Camcorders and Cameras ORDERING INFORMATION V V in out See detailed ordering and shipping information on page 10 of this data sheet. Thermal & Antisat Protection Rint 1.23 V V. Ref. 54 K GND This device contains 41 active transistors Figure 1. Simplified Block Diagram Semiconductor Components Industries, LLC, 2015 1 Publication Order Number: January, 2022 Rev. 21 MC33275/DMC33275, NCV33275 PIN CONNECTIONS GND GND 4 4 1 8 Input Output Input 8 2 7 1 Output GND GND Input N/C 2 7 3 6 GND GND Input3 GND 6 12 3 4 5 12 3 N/C N/C N/C 4 5 N/C V GND V GND in out V V in out Pins 4 and 5 Not Connected MC33275ST MC33275DT MC33275D MC33275MN MAXIMUM RATINGS Rating Symbol Value Unit Input Voltage V 13 Vdc CC Power Dissipation and Thermal Characteristics T = 25C A Maximum Power Dissipation P Internally Limited W D Case 751 (SOIC8) D Suffix R 160 C/W Thermal Resistance, JunctiontoAmbient JA R 25 C/W Thermal Resistance, JunctiontoCase JC Case 318E (SOT223) ST Suffix R 245 C/W Thermal Resistance, JunctiontoAir JA R 15 C/W Thermal Resistance, Junction toCase JC Case 369A (DPAK3) DT Suffix Thermal Resistance, JunctiontoAir R 92 C/W JA 6.0 C/W Thermal Resistance, Junction toCase R JC Case 488AF (DFN8, 4x4) MN Suffix 183 C/W Thermal Resistance, JunctiontoAir (with 1.0 oz PCB cu area) R JA 93 C/W Thermal Resistance, JunctiontoAir (with 1.8 oz PCB cu area) R JA 9.0 C/W Thermal Resistance, JunctiontoCase psiJC* Output Current I 300 mA O Maximum Junction Temperature T 150 C J Operating Ambient Temperature Range T 40 to +125 C A Storage Temperature Range T 65 to +150 C stg Electrostatic Discharge Sensitivity (ESD) ESD V Human Body Model (HBM) 4000 Machine Model (MM) 400 Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. *C (case) is defined as the solderattach interface between the center of the exposed pad on the bottom of the package, and the board to which it is attached. www.onsemi.com 2