Product Information

MVGSF1N02LT1G

MVGSF1N02LT1G electronic component of ON Semiconductor

Datasheet
ON Semiconductor MOSFET

Manufacturer: ON Semiconductor
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 0.7119 ea
Line Total: USD 0.71

4696 - Global Stock
Ships to you between
Thu. 30 May to Mon. 03 Jun
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
4696 - WHS 1


Ships to you between Thu. 30 May to Mon. 03 Jun

MOQ : 1
Multiples : 1

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MVGSF1N02LT1G
ON Semiconductor

1 : USD 0.69
10 : USD 0.6107
100 : USD 0.422
500 : USD 0.3531
1000 : USD 0.3002
3000 : USD 0.2668
6000 : USD 0.2657

     
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Id - Continuous Drain Current
Vds - Drain-Source Breakdown Voltage
Rds On - Drain-Source Resistance
Transistor Polarity
Minimum Operating Temperature
Maximum Operating Temperature
Pd - Power Dissipation
Mounting Style
Package / Case
Packaging
Technology
Qualification
Series
Brand
Factory Pack Quantity :
Cnhts
Hts Code
Mxhts
Product Type
Subcategory
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MGSF1N02L, MVGSF1N02L MOSFET - Power: 750 mAmps, 20 Volts NChannel SOT23 These miniature surface mount MOSFETs low R assure DS(on) www.onsemi.com minimal power loss and conserve energy, making these devices ideal for use in space sensitive power management circuitry. Typical 750 mAMPS, 20 VOLTS applications are dcdc converters and power management in portable R = 90 m and batterypowered products such as computers, printers, PCMCIA DS(on) cards, cellular and cordless telephones. NChannel Features 3 Low R Provides Higher Efficiency and Extends Battery Life DS(on) Miniature SOT23 Surface Mount Package Saves Board Space MVGSF Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements AECQ101 1 Qualified and PPAP Capable* These Devices are PbFree and are RoHS Compliant 2 MAXIMUM RATINGS (T = 25C unless otherwise noted) J MARKING DIAGRAM/ PIN ASSIGNMENT Rating Symbol Value Unit DraintoSource Voltage V 20 Vdc DSS 3 Drain GatetoSource Voltage Continuous V 20 Vdc GS 1 Drain Current SOT23 N2 M I 750 mA Continuous T = 25C D A CASE 318 I 2000 Pulsed Drain Current (t 10 s) DM p STYLE 21 Total Power Dissipation T = 25C P 400 mW A D 1 2 Gate Source Operating and Storage Temperature Range T , T 55 to 150 C J stg Thermal Resistance, JunctiontoAmbient 300 C/W R JA N2 = Device Code M = Date Code* Maximum Lead Temperature for Soldering T 260 C L = PbFree Package Purposes, 1/8 from case for 10 seconds (Note: Microdot may be in either location) Stresses exceeding those listed in the Maximum Ratings table may damage the *Date Code orientation and overbar may vary device. If any of these limits are exceeded, device functionality should not be depending upon manufacturing location. assumed, damage may occur and reliability may be affected. ORDERING INFORMATION Device Package Shipping MGSF1N02LT1G SOT23 3000 / Tape & (PbFree) Reel MVGSF1N02LT1G* SOT23 3000 / Tape & (PbFree) Reel For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Semiconductor Components Industries, LLC, 1996 1 Publication Order Number: May, 2019 Rev. 7 MGSF1N02LT1/DMGSF1N02L, MVGSF1N02L ELECTRICAL CHARACTERISTICS (T = 25C unless otherwise noted) A Characteristic Symbol Min Typ Max Unit OFF CHARACTERISTICS DraintoSource Breakdown Voltage V 20 Vdc (BR)DSS (V = 0 Vdc, I = 10 Adc) GS D Zero Gate Voltage Drain Current I Adc DSS (V = 20 Vdc, V = 0 Vdc) 1.0 DS GS (V = 20 Vdc, V = 0 Vdc, T = 125C) 10 DS GS J GateBody Leakage Current (V = 20 Vdc, V = 0 Vdc) I 100 nAdc GS DS GSS ON CHARACTERISTICS (Note 1) Gate Threshold Voltage V 1.0 1.7 2.4 Vdc GS(th) (V = V , I = 250 Adc) DS GS D Static DraintoSource OnResistance r DS(on) (V = 10 Vdc, I = 1.2 Adc) 0.075 0.090 GS D (V = 4.5 Vdc, I = 1.0 Adc) 0.115 0.130 GS D DYNAMIC CHARACTERISTICS Input Capacitance (V = 5.0 Vdc) C 125 pF DS iss Output Capacitance (V = 5.0 Vdc) C 120 DS oss Transfer Capacitance (V = 5.0 Vdc) C 45 DG rss SWITCHING CHARACTERISTICS (Note 2) TurnOn Delay Time t 2.5 ns d(on) Rise Time t 1.0 (V = 15 Vdc, I = 1.0 Adc, r DD D R = 50 ) L TurnOff Delay Time t 16 d(off) Fall Time t 8.0 f Gate Charge (See Figure 6) Q 6000 pC T SOURCEDRAIN DIODE CHARACTERISTICS Continuous Current I 0.6 A S Pulsed Current I 0.75 SM Forward Voltage (Note 2) V 0.8 V SD Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 1. Pulse Test: Pulse Width 300 s, Duty Cycle 2%. 2. Switching characteristics are independent of operating junction temperature. TYPICAL ELECTRICAL CHARACTERISTICS 2.5 3 V = 10 V DS 4 V 3.25 V 2.5 3.5 V 2 2 -55C 1.5 V = 3.0 V GS 1.5 T = 150C 1 J 2.75 V 1 0.5 2.5 V 0.5 25C 2.25 V 0 0 1 1.5 2 2.5 3 3.5 02134576 8910 V , GATE-TO-SOURCE VOLTAGE (VOLTS) V , DRAIN-TO-SOURCE VOLTAGE (VOLTS) GS DS Figure 1. Transfer Characteristics Figure 2. OnRegion Characteristics www.onsemi.com 2 I , DRAIN CURRENT (AMPS) D I , DRAIN CURRENT (AMPS) D

Tariff Desc

8541.21.00 16 No - - With a dissipation rate of less than 1 W Free

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