X-On Electronics has gained recognition as a prominent supplier of NBSG53AMNG Flip-Flops across the USA, India, Europe, Australia, and various other global locations. NBSG53AMNG Flip-Flops are a product manufactured by ON Semiconductor. We provide cost-effective solutions for Flip-Flops, ensuring timely deliveries around the world.

NBSG53AMNG ON Semiconductor

NBSG53AMNG electronic component of ON Semiconductor
NBSG53AMNG ON Semiconductor
NBSG53AMNG Flip-Flops
NBSG53AMNG  Semiconductors

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See Product Specifications
Part No. NBSG53AMNG
Manufacturer: ON Semiconductor
Category: Flip-Flops
Description: Flip Flops 2.5V/3.3V SiGe Diff Clock/Divider
Datasheet: NBSG53AMNG Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
N/A

Obsolete
Availability Price Quantity
0
MOQ : 1
Multiples : 1
1 : USD 58.1627
10 : USD 49.9212
100 : USD 43.3944
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Obsolete
0
MOQ : 1
Multiples : 1
1 : USD 54.841
10 : USD 51.1626
25 : USD 49.0186
100 : USD 44.4231
N/A

Obsolete
0
MOQ : 1
Multiples : 1
1 : USD 54.2751
5 : USD 51.03
10 : USD 46.751
25 : USD 44.793
100 : USD 40.5896
250 : USD 39.1835
N/A

Obsolete
0

Multiples : 123
N/A

Obsolete
0
MOQ : 1
Multiples : 1
1 : USD 47.702
5 : USD 46.649
10 : USD 44.5176
25 : USD 44.4034
100 : USD 41.3713
250 : USD 40.775
500 : USD 38.7959
N/A

Obsolete
0
MOQ : 1
Multiples : 1
1 : USD 64.3989
N/A

Obsolete
   
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RoHS - XON
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We are delighted to provide the NBSG53AMNG from our Flip-Flops category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the NBSG53AMNG and other electronic components in the Flip-Flops category and beyond.

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NBSG53A 2.5 V/3.3 VSiGe Selectable Differential Clock and Data D Flip-Flop/Clock Divider with Reset and OLS* NBSG53A V R SEL OLS CC Exposed Pad 16 15 14 13 (EP) VTCLK 1 12 V EE CLK 2 11 Q NBSG53A CLK Q 3 10 VTCLK V 4 9 CC 56 7 8 VTD D D VTD Figure 1. QFN16 Pinout (Top View) Table 1. PIN DESCRIPTION Pin Name I/O Description 1 VTCLK Internal 50 Termination Pin. See Table 4. 2 CLK ECL, CML, Inverted Differential Input. LVCMOS, LVDS, LVTTL Input 3 CLK ECL, CML, Noninverted Differential Input. LVCMOS, LVDS, LVTTL Input 4 VTCLK Internal 50 Termination Pin. See Table 4. 5 VTD Internal 50 termination pin. See Table 4. 6 D ECL, CML, Inverted Differential Input. LVCMOS, LVDS, LVTTL Input 7 D ECL, CML, Noninverted Differential Input. LVCMOS, LVDS, LVTTL Input 8 VTD Internal 50 Termination Pin. See Table 4. 9,16 V Positive Supply Voltage CC 10 Q RSECL Output NonInverted Differential Output. Typically Terminated with 50 Resistor to V = V 2 V. TT CC 11 Q RSECL Output Inverted Differential Output. Typically Terminated with 50 Resistor to V = V 2 V. TT CC 12 V Negative Supply Voltage EE 13 OLS* Input Input Pin for the Output Level Select (OLS). See Table 2. 14 SEL LVECL, LVCMOS, Select Logic Input. Internal 75 k to V . EE LVTTL Input 15 R LVECL, LVCMOS, Reset D Flip-Flop. Internal 75 k to V . EE LVTTL Input EP The Exposed Pad (EP) on the QFN16 package bottom is thermally connected to the die for improved heat transfer out of package. The exposed pad must be attached to a heat-sinking conduit. The pad is not electrically connected to the die but may be electrically and thermally connected to V on the PC board. EE 1. All V and V pins must be externally connected to Power Supply to guarantee proper operation. The thermally exposed pad (EP) on CC EE package bottom (see case drawing) must be attached to a heat-sinking conduit. 2. In the differential configuration when the input termination pins (VTD, VTD, VTCLK, VTCLK) are connected to a common termination voltage, and if no signal is applied then the device will be susceptible to self-oscillation. 3. When an output level of 400 mV is desired and V V > 3.0 V, 2 k resistor should be connected from OLS pin to V . CC EE EE

Tariff Desc

8542.39.23 No ..Linear/analogue and peripheral integrated circuits, timers, voltage regulators, A/D and D/A converters, telecommunication and modem integrated circuits, other than board level products Free

Electronic integrated circuits- Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
FAIRCHILD
FAIRCHILD (ON SEMICONDUCTOR)
Fairchild Semiconductor
FS8
FSC
ON
ON SEMI
ON Semicon
ON SEMICONDUCTOR
ON SEMICONDUCTOR (FAIRCHILD)
ON Semiconductor / Fairchild
ON4
ON5
onsemi
ON-SEMI
onsemi / Fairchild
OOF
Xsens / Fairchild
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