Product Information

NTMFD5C446NLT1G

NTMFD5C446NLT1G electronic component of ON Semiconductor

Datasheet
MOSFET T6 40V LL S08FL DS

Manufacturer: ON Semiconductor
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 6.158 ea
Line Total: USD 6.16

5820 - Global Stock
Ships to you between
Fri. 31 May to Tue. 04 Jun
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
5820 - WHS 1


Ships to you between Fri. 31 May to Tue. 04 Jun

MOQ : 1
Multiples : 1

Stock Image

NTMFD5C446NLT1G
ON Semiconductor

1 : USD 2.2306
10 : USD 1.9103
25 : USD 1.8984
100 : USD 1.5662
500 : USD 1.2577
1000 : USD 1.2459
1500 : USD 1.1699
3000 : USD 1.1592

     
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Id - Continuous Drain Current
Vds - Drain-Source Breakdown Voltage
Rds On - Drain-Source Resistance
Transistor Polarity
Vgs th - Gate-Source Threshold Voltage
Minimum Operating Temperature
Maximum Operating Temperature
Pd - Power Dissipation
Mounting Style
Package / Case
Packaging
Technology
Number of Channels
Vgs - Gate-Source Voltage
Qg - Gate Charge
Channel Mode
Configuration
Brand
Forward Transconductance - Min
Fall Time
Product Type
Rise Time
Factory Pack Quantity :
Subcategory
Typical Turn-Off Delay Time
Typical Turn-On Delay Time
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NTMFD5C446NL MOSFET Power, Dual, N-Channel 40 V, 2.65 m , 145 A Features www.onsemi.com Small Footprint (5x6 mm) for Compact Design Low R to Minimize Conduction Losses DS(on) Low Q and Capacitance to Minimize Driver Losses G V R MAX I MAX (BR)DSS DS(ON) D These Devices are PbFree, Halogen Free/BFR Free and are RoHS 2.65 m 10 V 40 V Compliant 145 A 3.9 m 4.5 V MAXIMUM RATINGS (T = 25C unless otherwise noted) J Parameter Symbol Value Unit Dual NChannel DraintoSource Voltage V 40 V DSS D1 D2 GatetoSource Voltage V 20 V GS Continuous Drain T = 25C I 145 A D C Current R JC T = 100C 105 (Notes 1, 2, 3) C G1 G2 Steady State Power Dissipation P W T = 25C 125 C D R (Notes 1, 2) JC S1 S2 T = 100C 62 C Continuous Drain T = 25C I 25 A A D Current R JA T = 100C 18 (Notes 1, 2, 3) A Steady MARKING State Power Dissipation T = 25C P 3.5 W D DIAGRAM A R (Notes 1 & 2) JA D1 D1 T = 100C 1.8 A S1 D1 1 Pulsed Drain Current T = 25C, t = 10 s I 644 A A p DM G1 D1 XXXXXX DFN8 5x6 Operating Junction and Storage Temperature T , T 55 to C S2 AYWZZ D2 J stg (SO8FL) + 175 G2 D2 CASE 506BT D2 D2 Source Current (Body Diode) I 91 A S Single Pulse DraintoSource Avalanche E 171 mJ A = Assembly Location AS Energy (I = 11 A) Y = Year L(pk) W = Work Week Lead Temperature for Soldering Purposes T 260 C L ZZ = Lot Traceability (1/8 from case for 10 s) Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. ORDERING INFORMATION See detailed ordering, marking and shipping information in the THERMAL RESISTANCE MAXIMUM RATINGS package dimensions section on page 5 of this data sheet. Parameter Symbol Value Unit JunctiontoCase Steady State R 1.38 C/W JC JunctiontoAmbient Steady State (Note 2) R 46.9 JA 1. The entire application environment impacts the thermal resistance values shown, they are not constants and are only valid for the particular conditions noted. 2 2. Surfacemounted on FR4 board using a 650 mm , 2 oz. Cu pad. 3. Maximum current for pulses as long as 1 second is higher but is dependent on pulse duration and duty cycle. Semiconductor Components Industries, LLC, 2015 1 Publication Order Number: May, 2019 Rev. 0 NTMFD5C446NL/DNTMFD5C446NL ELECTRICAL CHARACTERISTICS (T = 25C unless otherwise specified) J Parameter Symbol Test Condition Min Typ Max Unit OFF CHARACTERISTICS DraintoSource Breakdown Voltage V V = 0 V, I = 250 A 40 V (BR)DSS GS D DraintoSource Breakdown Voltage V / 23 (BR)DSS mV/C Temperature Coefficient T J Zero Gate Voltage Drain Current I V = 0 V, T = 25 C 10 DSS GS J V = 40 V A DS T = 125C 100 J GatetoSource Leakage Current I V = 0 V, V = 20 V 100 nA GSS DS GS ON CHARACTERISTICS (Note 4) Gate Threshold Voltage V V = V , I = 90 A 1.2 2.2 V GS(TH) GS DS D Negative Threshold Temperature Coefficient V /T 5.2 mV/C GS(TH) J DraintoSource On Resistance R V = 10 V I = 20 A 2.2 2.65 DS(on) GS D m V = 4.5 V I = 20 A 3.0 3.9 GS D Forward Transconductance g V = 15 V, I = 50 A 138 S FS DS D CHARGES, CAPACITANCES & GATE RESISTANCE Input Capacitance C 3170 ISS Output Capacitance C 1270 V = 0 V, f = 1 MHz, V = 25 V pF OSS GS DS Reverse Transfer Capacitance C 48 RSS Total Gate Charge Q V = 4.5 V, V = 32 V I = 50 A 25 G(TOT) GS DS D Total Gate Charge Q V = 10 V, V = 32 V I = 50 A 54 G(TOT) GS DS D Threshold Gate Charge Q 5.7 nC G(TH) GatetoSource Charge Q 10.7 GS V = 4.5 V, V = 32 V I = 50 A GS DS D GatetoDrain Charge Q 7.0 GD Plateau Voltage V 5.7 V GP SWITCHING CHARACTERISTICS (Note 5) TurnOn Delay Time t 14.8 d(ON) Rise Time t 16.8 r V = 4.5 V, V = 32 V, GS DS ns I = 5 A, R = 1.0 D G TurnOff Delay Time t 34.9 d(OFF) Fall Time t 15.2 f DRAINSOURCE DIODE CHARACTERISTICS Forward Diode Voltage V T = 25C 0.8 SD J V = 0 V, GS V I = 20 A S T = 125C 0.7 J Reverse Recovery Time t 54 RR Charge Time t 24 ns a V = 0 V, dI /dt = 50 A/ s, GS S I = 5 A S Discharge Time t 30 b Reverse Recovery Charge Q 55 nC RR Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 4. Pulse Test: pulse width 300 s, duty cycle 2%. 5. Switching characteristics are independent of operating junction temperatures. www.onsemi.com 2

Tariff Desc

8541.21.00 16 No - - With a dissipation rate of less than 1 W Free

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