PACDN1404 ESD Protection Diode Arrays Chip Scale Package Product Description The PACDN1404 and PACDN1408 are 4 and 8channel surge protection arrays that provide a very high level of protection for www.onsemi.com sensitive electronic components that may be subjected to ESD. These devices are designed and characterized to safely dissipate ESD strikes at levels well beyond the maximum requirements set forth in the IEC 6100042 international standard (Level 4, 8 kV contact discharge). All I/Os are rated at 25 kV using the IEC 6100042 WLCSP6 WLCSP10 contact discharge method. Using the MILSTD883D (Method 3015) CG SUFFIX CG SUFFIX specification for Human Body Model (HBM) ESD, all pins are CASE 567BD CASE 567BM protected for contact discharges to greater than 30 kV. ELECTRICAL SCHEMATIC The Chip Scale Package format of these devices provide extremely small footprints that are necessary in portable electronics such as B1 B2 B3 cellular phones, PDAs, internet appliances and PCs. The large solder bumps allow for standard attachments to laminate boards without the use of underfill. The PACDN1404 and PACDN1408 are packaged in RoHScompliant, leadfree finishing. Features A1 A2 A3 Four or Eight surge protection in a Single Package PACDN1404 InSystem Electrostatic Discharge (ESD) Protection to 25 kV Contact Discharge per IEC 6100042 International Standard B1 B2 B3 B4 B5 Compact Chip Scale Package (CSP) in a 0.65 mm Pitch Format Saves Board Space and Eases Layout in Space Critical Applications Compared to Discrete Solutions and Traditional Wire Bonded Packages 6 and 10Bump WLCSPs A1 A2 A3 A4 A5 These Devices are PbFree and are RoHS Compliant PACDN1408 Applications MARKING DIAGRAM ESD Protection for Sensitive Electronic Equipment I/O Port, Keypad and Button Circuitry Protection for Portable Devices D14 DN1408 Wireless Handsets Handheld PCs / PDAs D14 = PACDN1404CG MP3 Players DN1408 = PACDN1408CG Digital Cameras and Camcorders Notebooks ORDERING INFORMATION Desktop PCs Device Package Shipping PACDN1404CG WLCSP6 3500/Tape & Reel (PbFree) PACDN1408CG WLCSP10 3500/Tape & Reel (PbFree) For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. Semiconductor Components Industries, LLC, 2011 1 Publication Order Number: November, 2017 Rev. 5 PACDN1404/DPACDN1404 PACKAGE / PINOUT DIAGRAMS Top View Bottom View (Bumps Down View) (Bumps Up View) Orientation 12 3 Marking + A B1 B2 B3 D14 A1 A2 A3 B PACDN1404 6Bump WLCSP Package Top View Bottom View (Bumps Down View) (Bumps Up View) Orientation 12 3 45 Marking + A B1 B2 B3 B4 B5 DN1408 B A1 A2 A3 A4 A5 PACDN1408 10Bump WLCSP Package SPECIFICATIONS Table 1. ABSOLUTE MAXIMUM RATINGS Parameter Rating Units Storage Temperature Range 65 to +150 C Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. Table 2. STANDARD OPERATING CONDITIONS Parameter Rating Units Operating Temperature Range 40 to +85 C Table 3. ELECTRICAL OPERATING CHARACTERISTICS (Note 1) Symbol Parameter Conditions Min Typ Max Units V Reverse Standoff Voltage I = 10 A 5.5 V REV DIODE I Leakage Current V = 3.3 V DC 100 nA LEAK IN V Signal Clamp Voltage I = 10 mA V SIG LOAD Positive Clamp 5.6 6.8 8.0 Negative Clamp 1.2 0.8 0.4 V Insystem ESD Withstand Voltage (Note 2) kV ESD a) Human Body Model, MILSTD883, 30 Method 3015 b) Contact Discharge per 25 IEC 6100042 Level 4 V Clamping Voltage during ESD Discharge (Note 2) V CL MILSTD883 (Method 3015), 8 kV Positive Transients +12 Negative Transients 8 C Channel Capacitance 39 47 pF At 2.5 V DC, f = 1 MHz 1. T = 25C unless otherwise specified. GND in this document refers to the lower supply voltage. A 2. ESD applied to channel pins with respect to GND, one at a time. All other channels are open. All GND pins tied to ground. www.onsemi.com 2