ELG-TEA1R0NA

Power Inductors Multilayer Power Inductors Type: ELGTEA Features Superior DC current bias characteristics by the original laminating process technology Magnetic shielded structure Small and thin structure (2.01.251.0mm max.) RoHS compliant Recommended Applications DC/DC converter circuit use of the small portable device Smart phone, mobile phone, DSC . Standard Packing Quantity 4,000 pcs / Reel Explanation of Part Numbers 1 2 3 4 5 6 7 8 9 10 11 12 E L G T E A 1 R 0 N A Design Code Product Code Size T dimension Construction Nominal Inductance Inductance Tolerance Multilayer Code mm (inch) Code Height Code Multilayer Inductor Power Inductor 1.0mm max. A Code 2012 EX. T 30 (0805) R470.47 H 2R22.2 H Recommended land patterns in mm (not to scale) Dimensions in mm (not to scale) 0.8 0.20 0.45 0.20 0.8 to 1.2 1.25 0.20 2.00 0.20 2.4 to 3.0 Ratings and Characteristics DC Resistance Self-resonant 1 Inductance at 1 MHz Rated Current 2 at 20 C Part No. Frequency (H) Tol. () max. (A) (MHz) ELGTEAR47NA 0.47 30 0.10 1.2 126 ELGTEA1R0NA 1.0 30 0.15 1.0 80 ELGTEA1R5NA 1.5 30 0.18 1.0 80 ELGTEA2R2NA 2.2 30 0.20 0.8 55 ELGTEA3R3NA 3.3 30 0.25 0.8 50 ELGTEA4R7NA 4.7 30 0.30 0.8 33 Operating Temperature Range-40to125 C (Including self-temperature rise) 1 This indicates the value of current when temperature rise dt/t=40 C (at 20 C). 2 Reference data Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 1-Aug-20 1.1 to 1.3Power Inductors Inductance frequency characteristics DC current bias characteristics 10 6.0 9 5.0 8 4.7 H 7 4.0 6 3.3 H 4.7 H 5 3.0 4 2.2 H 3.3H 2.0 3 2.2H 1.5 H 2 1.5H 1.0 1.0 H 1 0.47 H 1.0H 0.47H 0 0 0.0 0.5 1.0 1.5 2.0 0.01 0.1 1 10 100 Frequency (MHz) DC Current (A) Packaging Methods (Taping) Punched Carrier Taping (Pitch 4mm) Taping Reel W 1 E t Feeding hole Chip pocket 1 D C 0 A D P P P W Tape running direction t 1 2 0 2 2 Chip component A Symbol A B W F E P P P D t t Symbol A B C D E W W 1 2 0 0 1 2 1 2 1.5 1.65 2.4 8.0 3.50 1.75 4.0 2.00 4.0 1.2 1.4 0 +1.0 +1.0 (mm) +0.1 (mm) 180 60.0 13.0 21.0 2.0 9.0 11.4 0.5 0.8 0.5 1.0 -3 0 0 0.20 0.2 0.2 0.05 0.10 0.1 0.05 0.1 max max 0 Leader Part and Taped End Tape end Leader part Cover tape 100 min. 160 min. Vacant position Vacant position 400 min. Unit (mm) Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 1-Aug-20 Inductance (H) B F E W Inductance (H) B