Light Touch Switches/EVQPH/EVQQH/EVQQG Surface Mount Light Touch Switches Japan with Knob for Reflow Soldering Type: EVQPH/EVQQH/EVQQG Features Easy operation type with knob Reflow soldering applicable Wide product variety: With or without ground termi- nal, Height, Operation force Dimensions in mm (not to scale) No. 1 Registered by EIAJ-SMD Outline Registration System Japan With knob Surface mount For reflow soldering Without ground terminal Notes: 1. Non-washable in solvents 2. Types with ground terminal available Part No. Operating Force EVQPHC, PHP 1.3 N (130 gf) This land not necessary when a ground terminal is not used. EVQPHF, PHV 1.6 N (160 gf) EVQPHQ, PHU 2.6 N (260 gf) No. 2 Registered by EIAJ-SMD Outline Registration System Japan With knob Surface mount For reflow soldering Without ground terminal Notes: 1. Non-washable in solvents 2. Types with ground terminal available Part No. Operating Force Part No. L EVQQG2, QG3 1.3 N (130 gf) 01 2.0 This land not necessary when a ground terminal is not used. EVQQH1 02 2.5 EVQQH0, QH3 1.6 N (160 gf) 03 3.1 EVQQG4, QG5 2.6 N (260 gf) Design and Specifications are subject to change without notice. Ask factory for technical specifications before purchase and/or use. Whenever a doubt about safety issues arises from this product, please inform us immediately for technical consultation.Panasonic Light Touch Switches/EVQPQ Recommended Reflow Soldering Conditions Item Conditions Set the surface of PWB at 180 C in 2.50.3 minutes after put into the preheat or cham- Preheat ber oven. Set the surface of switches at 240 C in Soldering 100.5 seconds after put into soldering oven. Embossed Carrier Taping Unit: mm Part No. Height A B W F E P1 P2 P0 D0 Dia. t1 t2 EVQPQ 00.55 0.650.20 EVQPL 0.8/1.5 1.0/1.70.2 EVQQF 2.0 2.20.2 +0.1 2.0 7.00.2 7.50.2 12.00.30 5.50.1 1.750.10 8.00.1 2.00.1 4.00.1 1.5 0.300.05 2.20.2 EVQQH 0 2.5/3.1 3.20.2 EVQPH 3.1 3.20.2 EVQPJ 4.3/5.0 4.450.20 7.250.20 4.5/5.20.2 Standard Reel Dimensions in mm (not to scale) Item A B C D E (mm) f3702 50 min. 13.00.5 f211 2.00.5 Item W T t r (mm) 14.01.5 1.0 to 2.00.5 1.00.5 Recommended Shape of Test Pole Recommended Operating Conditions Recommended Flow Soldering Conditions (Applied to EVQQFV and EVQQFY) Item Soldering Conditions K322V (by Tamura) Specific gravity : 0.84 Application Time : 20.5 s flux Temperature : normal temperature Flux method : Foam flux Preheat 100 to 120 C, 60 s Temperature : 2505 C Soldering Time : 5 s max. Design and Specifications are subject to change without notice. Ask factory for technical specifications before purchase and/or use. Whenever a doubt about safety issues arises from this product, please inform us immediately for technical consultation. Soldering process