Product Information

EYF-3CU

EYF-3CU electronic component of Panasonic

Datasheet
Current Sense Resistors - SMD 0603 Chip ring

Manufacturer: Panasonic
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 0.4746 ea
Line Total: USD 0.47

4170 - Global Stock
Ships to you between
Thu. 30 May to Mon. 03 Jun
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
4170 - WHS 1


Ships to you between Thu. 30 May to Mon. 03 Jun

MOQ : 1
Multiples : 1

Stock Image

EYF-3CU
Panasonic

1 : USD 0.46
10 : USD 0.3531
100 : USD 0.1495
1000 : USD 0.0828
2000 : USD 0.069
10000 : USD 0.0679
50000 : USD 0.0644
100000 : USD 0.0632

     
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Packaging
Termination Style
Brand
Factory Pack Quantity :
Application
Mounting Style
Cnhts
Hts Code
Mxhts
Product Type
Subcategory
Taric
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Chip Ring Chip Ring Type : EYF EYF8CU EYF6CU EYF3CU EYF3CU, 6CU, 8CU Features High reliability The folded metal sheet structure provides high robustness and a reliable connection suitable for a signal measuring terminal. Ease of placement The taping package supports automatic placement machines. Soldering Supports reflow and flow soldering. Recommended Applications To be mounted on printed circuit boards of general electronic equipment as a signal measuring terminal. Explanation of Part Numbers 1T ERJS02 ERJS1T 1 2 3 4 5 6 E Y F 3 C U Product Code Dimensions (mm) Packaging Methods Chip Ring 3C 1.6 0.8 U Embossed Carrier Taping 6C 2.0 1.2 8C 3.2 1.6 Ratings Construction Part Number Rated Current (A) Conductor (m) Metal Plate Electrode (Inner) EYF3CU EYF6CU 2 50 EYF8CU Electrode (Outer) The electrodes (internal and external electrodes) of EYF3CU are entirely formed on the outer surface by plating. The inner wall and the end surfaces are not plated. Dimensions in mm (not to scale) EYF3CU EYF6CU EYF8CU L L L Butted end Butted end Plating Plating Plating Plating Plating Plating Butted end Gap : 0.1 max. Gap : 0.1 max. Gap : 0.1 max. Aberration : 0.15 max. Aberration : 0.15 max. Aberration : 0.15 max. Dimensions (mm) Mass (Weight) Part Number L D H (mg/pc) EYF3CU 1.600.15/-0.10 0.800.10 1.150.15 6 EYF6CU 2.000.20/-0.10 1.250.15 1.450.15 12 EYF8CU 3.200.20 1.600.20 1.250.15 18 Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 1-Aug-20 H D H D H DChip Ring Packaging Methods (Taping) Standard Quantity Part Number Kind of Taping Pitch(P ) Quantity 1 EYF3CU EYF6CU Embossed Carrier Taping 4 mm 2,000 pcs / reel EYF8CU Embossed Carrier Taping Taping Reel T Sprocket hole Compartment T D C 0 A Tape running direction P P P 1 2 0 Chip component 2 A W Embossed Carrier Taping (mm) Part Number A B W F E P P P D t t 1 2 0 0 1 2 EYF3CU 1.200.10 1.800.10 1.600.10 +0.1 8.000.20 3.500.05 1.750.10 4.00.1 2.000.05 4.000.10 1.5 0.270.05 1.650.10 2.200.10 1.900.10 EYF6CU 0 EYF8CU 1.850.10 3.450.10 1.800.10 Taping Reel (mm) Part Number A B C W T EYF3CU 0 EYF6CU 180.0 60 min. 13.01.0 9.01.0 11.42.0 -3.0 EYF8CU Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 1-Aug-20 B E F W B

Tariff Desc

8533.10.00 17 No Fixed carbon resistors, composition or film types Free

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