Product Information

BD71837AMWV-E2

BD71837AMWV-E2 electronic component of ROHM

Datasheet
Power Management Specialized - PMIC SYSTEM PMIC FOR I.MX 8M FAMILY

Manufacturer: ROHM
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 7.0764 ea
Line Total: USD 7.08

1761 - Global Stock
Ships to you between
Wed. 29 May to Fri. 31 May
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
4 - WHS 1


Ships to you between
Thu. 30 May to Tue. 04 Jun

MOQ : 1
Multiples : 1
1 : USD 9.9967
10 : USD 8.7704
30 : USD 8.0211
100 : USD 7.3949

1761 - WHS 2


Ships to you between Wed. 29 May to Fri. 31 May

MOQ : 1
Multiples : 1
1 : USD 7.0764
10 : USD 6.5157
25 : USD 6.0796
100 : USD 5.5315
250 : USD 5.2824
500 : USD 4.8837
1000 : USD 4.4351
2000 : USD 4.4351
5000 : USD 4.2981

     
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Type
Mounting Style
Package / Case
Output Current
Minimum Operating Temperature
Maximum Operating Temperature
Packaging
Input Voltage Range
Output Voltage Range
Product
Brand
Moisture Sensitive
Operating Supply Current
Operating Supply Voltage
Product Type
Factory Pack Quantity :
Subcategory
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Datasheet Power Management Integrated Circuit BD71837AMWV General Description Key Specifications BD71837AMWV is a programmable Power Input Voltage Range (VSYS): 2.7 V to 5.5 V Management IC (PMIC) for powering single-core, SNVS State Current: 30 A(Typ) dual-core, and quad-core SoCs such as NXP-i.MX 8M. SUSPEND State Current: 137 A(Typ) It is optimized for low BOM cost and compact solution IDLE State Current: 167 A(Typ) footprint. It integrates 8 Buck regulators and 7 LDOs to RUN State Current: 197 A(Typ) provide all the power rails required by the SoC and the Operating Temperature Range: -40 C to +105 C commonly used peripherals. QFN package and pinout support low cost Type 3 Applications (non-HDI) PCB. Programmable power sequencing Streaming Media Boxes and Dongles and output voltages, flexible power state control for AV Receivers and Wireless Sound Bars easier system design and supports a wide variety of Industrial HMI, SBC, IPC and Panel Computer processors and system implementations. Package W(Typ) x D(Typ) x H(Max) Features UQFN68CV8080 8.00mm x 8.00mm x 1.00mm 8 Buck Regulators 2.0 MHz Switching Frequency. (BUCK1, BUCK2, BUCK3, BUCK4, BUCK5, BUCK7, and BUCK8). 1.5MHz Switching Frequency. (BUCK6) Target Efficiency: 83% to 95%. Output Current & Voltage. BUCK1: 3.6 A, 0.7 V to 1.3 V/10 mV step, DVS BUCK2: 4.0 A, 0.7 V to 1.3 V/10 mV step, DVS BUCK3: 2.1 A, 0.7 V to 1.3 V/10 mV step, DVS BUCK4: 1.0 A, 0.7 V to 1.3 V/10 mV step, DVS BUCK5: 2.5 A, 0.70 V to 1.35 V/8steps BUCK6: 3.0 A, 3.0 V to 3.3 V/100 mV step BUCK7: 1.5 A, 1.605 V to 1.995 V/8steps BUCK8: 3.0 A, 0.8 V to 1.4 V/10 mV step 7ch Linear Regulators(7 LDOs) LDO1: 10 mA, 3.0 V to 3.3 V, 1.6 V to 1.9 V LDO2: 10 mA, 0.9 V, 0.8 V LDO3: 300 mA, 1.8 V to 3.3 V LDO4: 250 mA, 0.9 V to 1.8 V LDO5: 300 mA, 1.8 V to 3.3 V LDO6: 300 mA, 0.9 V to 1.8 V LDO7: 150 mA, 1.8 V to 3.3 V Power Mux Switch 1.8V Input: 200 m(Max) 3.3V Input: 280 m(Max) 32.768 kHz Crystal Oscillator Driver Power Button Detector Protection and Monitoring: Soft Start, Power Rails Fault Detection, UVLO, OVP and TSD OTP Configurable Power Sequencing OTP and Software Programmable Output Voltage, Ramp rates. Hardware Signaling with SoC for Transition into or out of Low Power States Interfaces: I2C: 100 kHz/400 kHz, 1 MHz Power-on Reset Output: POR B, RTC RESET B, Watchdog Reset Input: WDOG B: Power State Control: PMIC STBY REQ, PMIC ON REQ, PWRON B Interrupt to SoC: IRQ B Type3 PCB Applicable Product structure : Silicon integrated circuit. This product has no designed protection against radioactive rays www.rohm.com TSZ02201-0Q2Q0A500630-1-2 2019 ROHM Co., Ltd. All rights reserved. 1/126 16.Mar.2020 Rev.003 TSZ2211114001 BD71837AMWV Contents 1. Introduction ............................................................................................................................................................................. 7 1.1. Terminology .................................................................................................................................................................... 7 1.2. System Power Map & Typical Application Circuit ........................................................................................................... 8 1.3. Pin Configuration .......................................................................................................................................................... 10 1.4. Pin Description ............................................................................................................................................................. 11 1.5. I/O Equivalence Circuit ................................................................................................................................................. 12 1.6. Power Rail .................................................................................................................................................................... 14 1.7. Register Map ................................................................................................................................................................ 15 1.8. ESD .............................................................................................................................................................................. 17 2. Operating Conditions ............................................................................................................................................................ 18 2.1. Absolute Maximum Ratings (Ta=25 C)........................................................................................................................ 18 2.2. Thermal Resistance ..................................................................................................................................................... 18 2.3. Recommended Operating Conditions .......................................................................................................................... 19 2.4. Current Consumption ................................................................................................................................................... 19 2.5. Power Reference and Detectors (UVLO) ..................................................................................................................... 20 3. Power State Control ............................................................................................................................................................. 21 3.1. Power Control Signals .................................................................................................................................................. 21 3.1.1. PWRON B ........................................................................................................................................................... 22 3.1.2. PMIC ON REQ ................................................................................................................................................... 22 3.1.3. PMIC STBY REQ ............................................................................................................................................... 22 3.1.4. WDOG B ............................................................................................................................................................. 22 3.1.5. RTC RESET B ................................................................................................................................................... 23 3.1.6. POR B................................................................................................................................................................. 23 3.2. Power States ................................................................................................................................................................ 24 3.2.1. Power State Diagram ........................................................................................................................................... 24 3.2.2. Power State Register ........................................................................................................................................... 25 3.2.3. Power State Definition ......................................................................................................................................... 27 3.2.4. Power State Control Events ................................................................................................................................. 28 3.2.4.1. Reset Event ................................................................................................................................................. 28 3.2.4.2. Emergency Shutdown Event ....................................................................................................................... 30 3.2.5. Power State Transitions ....................................................................................................................................... 30 3.2.5.1. OFF to READY ............................................................................................................................................ 30 3.2.5.2. READY to SNVS ......................................................................................................................................... 31 3.2.5.3. SNVS to RUN .............................................................................................................................................. 34 3.2.5.4. RUN to IDLE ................................................................................................................................................ 36 3.2.5.5. IDLE to RUN ................................................................................................................................................ 36 3.2.5.6. RUN to SUSPEND ...................................................................................................................................... 36 3.2.5.7. SUSPEND to RUN ...................................................................................................................................... 36 3.2.5.8. IDLE to SUSPEND ...................................................................................................................................... 37 3.2.5.9. Emergency Shutdown ................................................................................................................................. 37 3.2.5.10. VR Fault ...................................................................................................................................................... 38 3.2.5.11. EMG to OFF ................................................................................................................................................ 42 3.2.5.12. EMG to READY ........................................................................................................................................... 43 3.2.5.13. EMG STAY Condition ................................................................................................................................. 44 3.2.5.14. Warm Reset ................................................................................................................................................. 44 3.2.5.15. PWROFF ..................................................................................................................................................... 45 3.2.5.16. PWROFF to READY.................................................................................................................................... 47 3.2.5.17. PWROFF to SNVS ...................................................................................................................................... 47 3.2.5.18. PWRON B Functionality ............................................................................................................................. 47 3.3. Power Sequence .......................................................................................................................................................... 49 3.3.1. Power ON Sequence ........................................................................................................................................... 49 3.3.2. Power OFF Sequence ......................................................................................................................................... 51 3.3.3. RUN to IDLE ........................................................................................................................................................ 55 3.3.4. IDLE to RUN ........................................................................................................................................................ 56 3.3.5. RUN to SUSPEND ............................................................................................................................................... 57 3.3.6. SUSPEND to RUN ............................................................................................................................................... 58 3.3.7. IDLE to SUSPEND .............................................................................................................................................. 59 3.3.8. Emergency Shutdown .......................................................................................................................................... 60 3.3.9. Warm Reset ......................................................................................................................................................... 61 3.3.10. Reset Source Indicators....................................................................................................................................... 62 4. I2C and Interrupt .................................................................................................................................................................. 63 4.1. I2C Bus Interface ......................................................................................................................................................... 63 4.1.1. I2C Bus Interface Overview ................................................................................................................................. 63 4.1.2. I2C Bus Interface Electrical Characteristics ......................................................................................................... 64 4.1.3. Device Addressing ............................................................................................................................................... 66 4.1.4. Write / Read Operation ........................................................................................................................................ 67 4.2. Interrupt ........................................................................................................................................................................ 68 4.2.1. Interrupt Overview ............................................................................................................................................... 68 5. Power Rails .......................................................................................................................................................................... 71 www.rohm.com TSZ02201-0Q2Q0A500630-1-2 2019 ROHM Co., Ltd. All rights reserved. 2/126 16.Mar.2020 Rev.003 TSZ22111 15 001

Tariff Desc

8542.31.00 51 No ..Application Specific (Digital) Integrated Circuits (ASIC)

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits:
LAPIS Semiconductor
RHE
RHM
ROHM Semicon
ROHM Semiconductor

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