X-On Electronics has gained recognition as a prominent supplier of HSE-B18254-035H Heat Sinks across the USA, India, Europe, Australia, and various other global locations. HSE-B18254-035H Heat Sinks are a product manufactured by Same Sky. We provide cost-effective solutions for Heat Sinks, ensuring timely deliveries around the world.
We are delighted to provide the HSE-B18254-035H from our Heat Sinks category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the HSE-B18254-035H and other electronic components in the Heat Sinks category and beyond.
Additional Resources: Product Page 3D Model date 08/17/2020 page 1 of 7 SERIES: HSE-B18X-035H DESCRIPTION: HEAT SINK FEATURES TO-218 package placement pins for secure PCB attachment round hole for component attachment multiple available cut lengths 1 thermal resistance power MODEL 1 dissipation length 75C T, 1 W, 1 W, 1 W, 75C T, nat conv nat conv 200 LFM 400 LFM nat conv (mm) (C/W) (C/W) (C/W) (C/W) (W) HSE-B18254-035H 25.4 9.26 13.52 3.09 2.86 8.10 HSE-B18317-035H 31.75 7.65 10.96 3.63 2.80 9.80 HSE-B18381-035H 38.1 6.25 8.34 3.52 2.48 12.00 HSE-B18508-035H 50.8 5.86 8.63 2.98 2.21 12.80 HSE-B18635-035H 63.5 4.49 6.61 2.24 1.22 16.70 Note: 1. See performance curves for full thermal resistance details. 2. Custom cut to length options available. Thermal data not available on custom lengths. PERFORMANCE CURVES HSE-B18254-035H 100 Without Airflow Heatsink Temperature Rise Above 90 200 LFM Ambient (T = Ths - Ta) (C) 400 LFM 80 Power Natural 200 LFM 400 LFM (W) Conv. 70 0 0 0 0 60 1 13.52 3.09 2.86 2 24.58 6.19 4.94 50 3 33.71 9.47 7.42 40 4 42.65 12.64 9.60 30 5 51.54 15.85 12.11 6 58.98 18.94 14.54 20 7 67.25 22.34 16.84 10 8 74.76 25.54 19.31 0 9 82.16 28.87 21.66 01 2345 678 910 10 89.43 31.89 23.95 Dissipated Power (W) Ths: hot spot temperature measured on the heatsink Ta: ambient temperature cuidevices.com Mounting Surface Temperature Rise Above Ambient (C)Additional Resources: Product Page 3D Model CUI Devices SERIES: HSE-B18X-035H DESCRIPTION: HEAT SINK date 08/17/2020 page 2 of 7 PERFORMANCE CURVES (CONTINUED) HSE-B18317-035H 100 Without Airflow Heatsink Temperature Rise Above 90 200 LFM Ambient (T = Ths - Ta) (C) 400 LFM 80 Power Natural 200 LFM 400 LFM (W) Conv. 70 0 0 0 0 60 1 10.96 3.63 2.80 50 2 20.38 7.98 5.65 3 29.02 12.37 8.21 40 4 36.58 16.50 10.28 30 5 43.86 20.35 13.11 20 6 51.12 24.67 16.43 10 7 58.09 28.82 19.32 0 8 64.74 33.13 22.54 01 23 45 6 789 10 11 12 13 14 15 Dissipated Power (W) 9 70.97 37.07 25.55 10 76.83 41.01 28.51 11 83.01 45.19 31.32 12 88.74 49.10 33.54 13 94.93 53.11 35.98 14 100.86 57.05 39.63 15 106.26 61.16 42.76 Ths: hot spot temperature measured on the heatsink Ta: ambient temperature cuidevices.com Mounting Surface Temperature Rise Above Ambient (C)