X-On Electronics has gained recognition as a prominent supplier of CIG22H3R3MNE Multilayer Ceramic Capacitors MLCC - SMD/SMT across the USA, India, Europe, Australia, and various other global locations. CIG22H3R3MNE Multilayer Ceramic Capacitors MLCC - SMD/SMT are a product manufactured by Samsung. We provide cost-effective solutions for Multilayer Ceramic Capacitors MLCC - SMD/SMT, ensuring timely deliveries around the world.

CIG22H3R3MNE Samsung

CIG22H3R3MNE electronic component of Samsung
CIG22H3R3MNE Samsung
CIG22H3R3MNE Multilayer Ceramic Capacitors MLCC - SMD/SMT
CIG22H3R3MNE  Passive Components

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See Product Specifications
Part No. CIG22H3R3MNE
Manufacturer: Samsung
Category: Multilayer Ceramic Capacitors MLCC - SMD/SMT
Description: Inductor Power Chip Shielded Multi-Layer 3.3uH 20% 1MHz Ferrite 1A 133mOhm DCR 1008 T/R
Datasheet: CIG22H3R3MNE Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
85: USD 0.3431 ea
Line Total: USD 29.16 
Availability - 0
MOQ: 85  Multiples: 1
Pack Size: 1
Availability Price Quantity
0
Ship by Thu. 05 Jun to Wed. 11 Jun
MOQ : 85
Multiples : 1
85 : USD 0.3431

   
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Tolerance
Product
Brand
Inductance
Maximum Dc Current
Self Resonant Frequency
Shielding
Operating Temp Range
Rad Hardened
Product Depth Mm
Core Material
Technology
Product Diameter Mm
Failure Rate
Packaging
Case Size
Military Standard
Type
LoadingGif
 
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We are delighted to provide the CIG22H3R3MNE from our Multilayer Ceramic Capacitors MLCC - SMD/SMT category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the CIG22H3R3MNE and other electronic components in the Multilayer Ceramic Capacitors MLCC - SMD/SMT category and beyond.

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Ver. 201306 Multilayer Power Inductor CIG22H Series (2520/ EIA 1008) APPLICATION Mobile phones, DSC, DVC, PDA etc. for DC-DC Converter FEATURES RECOMMENDED LAND PATTERN  High Current Type  Low DC resistance  Magnetically shielded structure  Free of all RoHS-regulated substances  Monolithic structure for high reliability DIMENSION Dimension [mm] TYPE L W T D 22 2.50.2 2.00.2 1.10.1 0.550.25 DESCRIPTION 2 1 Rated Current (A) Size Inductance DC Rated Current (A) Part no. inch/mm) uH)@1MHz Resistance( Typ. ( ( ) Max. Typ. CIG22H1R0MNE 1008/2520 1.0 20 % 0.08025 % 3.3 1.5 2.0 CIG22H1R2MNE 1008/2520 1.2 20 % 0.09420 % 2.8 1.5 1.9 CIG22H1R5MNE 1008/2520 1.5 20 % 0.10420 % 2.4 1.5 1.6 CIG22H2R2MNE 1008/2520 2.2 20 % 0.11620 % 1.8 1.2 1.6 CIG22H3R3MNE 1008/2520 3.3 20 % 0.13320 % 1.0 1.0 1.5 CIG22H4R7MNE 1008/2520 4.7 20 % 0.23320 % 0.95 0.8 1.0 1 Rated Current (A) : DC current value when Inductance drops to 30% of nominal Inductance value (ONLY REFERENCE) 2 Rated Current (A) : DC current value when the self-generation of heat rises to 40 (Reference ambient temperature:25 ) Operating temperature range: 40 to +125C ( Including self-temperature rise) Test equipment: Agilent :E4991A+16092A CHARACTERISTIC DATA Frequency characteristics Typ.) DC Bias characteristics Typ.) 1) ( 2) (Ver. 201306 PRODUCT IDENTIFICATION CI G 22 H 1R0 M N E (1) (2) (3) (4) (5) (6) (7) (8) Chip Inductor Power Inductor (1) (2) Dimension Product Series H:High Current Type) (3) (4) ( Inductance R0:1.0uH) Tolerance M: (5) (1 (6) ( 20%) Thickness option(N:Standard, A:Thinner than standard, B:Thicker than standard) (7) Packaging(C:paper tape, E:embossed tape) (8) RECOMMENDED SOLDERING CONDITION FLOW SOLDERING REFLOW SOLDERING PACKAGING Packaging Style Quantity(pcs/reel) Embossed Taping 2,500 Any data in this sheet are subject to change, modify or discontinue without notice. The data sheets include the typical data for design reference only. If there is any question regarding the data sheets, please contact our sales personnel or application engineers.

Tariff Desc

8532.24.00 43 no --Ceramic dielectric, multilayer Free

ELECTRICAL CAPACITORS, FIXED, VARIABLE OR ADJUSTABLE (PRE-SET)
Samsung ARTIK
SAMSUNG ELECTRO-MECH
Samsung Electro-Mechanics
Samsung Electro-Mechanics America, Inc.
SAMSUNG GVI
SAMSUNG LED
SAMSUNG PASSIVES
SAMSUNG SDI
SAMSUNG SEMI
Samsung Semiconductor
Samsung Semiconductor, Inc.
SMP
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