Metal Composite Power Inductor (wire wound) Specification Sheet CIGW252010GL1R0MNE (2520 / EIA 1008) APPLICATION Smart phones, Tablet, Wearable devices, Power converter modules, etc. FEATURES RECOMMENDED LAND PATTERN Small power inductor for mobile devices Unit : mm Low DCR structure and high efficiency inductor for power circuits. TYPE 2520 Monolithic structure for high reliability A1.2 Free of all RoHS-regulated substances B0.8 Halogen free C2.0 DIMENSION Dimension mm TYPE LW T D 2520 2.50.2 2.00.2 1.0 max 0.550.25 DESCRIPTION Rated DC Current (Irms) Inductance DC Resistance m Rated DC Current (Isat) A Size Thickness Inductance A Part no. tolerance inch/mm mm (max) uH Max. Typ. Max. Typ. Max. Typ. (%) CIGW252010GL1R0MNE 1008/2520 1.0 1 20 40 34 3.3 3.7 3.3 3.5 * Inductance : Measured with a LCR meter 4991A(Agilent) or equivalent (Test Freq. 1MHz, Level 0.1V) * DC Resistance : Measured with a Resistance HI-TESTER 3541(HIOKI) or equivalent * Maximum allowable DC current : Value defined when DC current flows and the initial value of inductance has decreased by 30% or when current flows and temperature has risen to 40 whichever is smaller. (Reference: ambient temperature is 2510) (Isat) : Allowable current in DC saturation : The DC saturation allowable current value is specified when the decrease of the initial inductance value at 30% (Reference: ambient temperature is 2510) (Irms) : Allowable current of temperature rise : The temperature rise allowable current value is specified when temperature of the inductor is raised 40 by DC current. (Reference: ambient temperature is 2510) * Absolute maximum voltage : Absolute maximum voltage DC 20V. * Operating temperature range : - 40 to +125C (Including self-temperature rise) PRODUCT IDENTIFICATION CIG W 2520 10 GL 1R0 M N E (1) (2) (3) (4) (5) (6) (7) (8) (9) (1) Power Inductor (2) Type (W: Metal Composite Wire Wound Type) (3) Dimension(2520: 2.5mm 2.0mm ) (4) Thickness (10: 1.0mm) (5) Remark (Characterization Code) (6) Inductance(1R0: 1 uH) (7) Toleranc (M:20%) (8) Internal Code (9) Packaging(C:paper tape, E:embossed tape) RECOMMENDED SOLDERING CONDITION REFLOW SOLDERING FLOW SOLDERING IRON SOLDERING Temperature of 280 max. Soldering Iron Tip Preheating 150 min. Temperature Temperature T130 Differential Soldering Time 3sec max. Wattage 50W max. PACKAGING Packaging Style Quantity(pcs/reel) Embossed Taping 3000 pcsReliability Test Item Specified Value Test Condition After being dipped in flux for 41 seconds, and preheated at More than 90% of terminal electrode should be Solderability 150180 for 23 min, the specimen shall be immersed in soldered newly. solder at 2455 for 41 seconds. No mechanical damage. After being dipped in flux for 41 seconds, and preheated at Resistance to Soldering Remaining terminal Electrode: 75% min. 150180 for 23 min, the specimen shall be immersed in Inductance change to be within 20% to the initial. solder at 2605 for 10 0.5 seconds. Thermal Shock No mechanical damage Repeat 100 cycles under the following conditions. (Temperature Cycle test) Inductance change to be within 20% to the initial. -403 for 30 min 853 for 30 min 852, 85%RH, for 50012 hours. High Temp. Humidity No mechanical damage Measure the test items after leaving at normal temperature and Resistance Test Inductance change to be within 20% to the initial humidity for 24 hours. Solder the sample on PCB. Exposure No mechanical damage at -552 for 50012 hours. Low Temperature Test Inductance change to be within 20% to the initial. Measure the test items after leaving at normal temperature and humidity for 24hours. Solder the sample on PCB. Exposure at 1252 for 50012 No mechanical damage hours. High Temperature Test Inductance change to be within 20% to the initial. Measure the test items after leaving at normal temperature and humidity for 24hours. 852, 85%RH, Rated Current for 50012 hours. High Temp. Humidity Resistance No mechanical damage Measure the test items after leaving at normal temperature and Loading Test Inductance change to be within 20% to the initial humidity for 24 hours. 852, Rated Current for 50012 hours. No mechanical damage High Temperature Loading Test Measure the test items after leaving at normal temperature and Inductance change to be within 20% to the initial humidity for 24 hours. No mechanical damage Reflow Test Peak 2605, 3 times Inductance change to be within 20% to the initial Solder the sample on PCB. Vibrate as apply 10~55Hz, 1.5mm No mechanical damage Vibration Test amplitude for 2 hours in each of three(X,Y,Z) axis (total 6 Inductance change to be within 20% to the initial. hours). Bending Limit 2mm Test Speed 1.0mm/sec. No mechanical damage Keep the test board at the limit point in 5 sec. PCB thickness : 1.6mm Bending Test W(kgf) TIME(sec) No indication of peeling shall occur on the terminal electrode. 0.5 101 Terminal Adhesion Test No mechanical damage Random Free Fall test on concrete plate. Drop Test Inductance change to be within 20% to the initial. 1 meter, 10 drops 852, 85%RH, Load(Ipeak) for 120 hours. (Frequncy:1MHz, Load(Ipeak):1.5hr on / 0.5hr off) Ipeak No mechanical damage Measure the test items after leaving at normal temperature and (AC+DC Load Life) Inductance change to be within 20% to the initial humidity for 24 hours. * Load(Ipeak) = Irms(max)1.4