RC3216J132CS Samsung

RC3216J132CS electronic component of Samsung Images are for reference only, See Product Specifications

X-On Electronics has gained recognition as a prominent supplier of RC3216J132CS across the USA, India, Europe, Australia, and various other global locations. RC3216J132CS are a product manufactured by Samsung. We provide cost-effective solutions for RC3216J132CS, ensuring timely deliveries around the world.

Part No. RC3216J132CS
Manufacturer: Samsung
Category: Unclassified
Description: RC3216J132CS
1.5-cu. ft. capacity over-the-range microwave with Sensor Cooking.
Datasheet:
Price (USD)
5000: USD 0.0095 ea
Line Total: USD 47.5 
Availability : 0
  
QtyUnit Price
5000$ 0.0095
20000$ 0.0082
50000$ 0.007
105000$ 0.0064

Availability 0
Ship by Mon. 06 Oct to Fri. 10 Oct
MOQ : 5000
Multiples : 5000
QtyUnit Price
5000$ 0.0095
20000$ 0.0082
50000$ 0.007
105000$ 0.0064

   
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Packaging
Brand
Factory Pack Quantity :
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Notes:- Show Stocked Products With Similar Attributes.

We are delighted to provide the RC3216J132CS from our Samsung manufacturer, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the RC3216J132CS and other electronic components in the Samsung manufacturer and beyond.

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The RC3216J132CS is a Samsung passive component. It is a Multi-Layer Network Array (MLNA) chip that is used in a variety of applications such as mobile phones and other portable communication devices. It contains 32 resistors and 16 capacitors, which are pre-assembled in a miniature narrow-pitch package, providing fast assembly and reliable connections. The chip has a thickness of only 0.8 mm, making it suitable for size-critical applications. Additionally, the chip features an improved ESD protection structure for improved robustness.

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