HSEC8-113-01-L-RA-L2

HIGH-SPEED EDGE CARD SYSTEMS 0.60 mm, 0.80 mm and 1.00 mm PITCH FEATURES & BENEFITS 56 Gbps PAM4 performance PCI Express 3.0, 4.0 and 5.0 Edge Rate contacts optimized for signal integrity performance and cycle life Up to 200 positions available Vertical, right-angle, edge mount, pass-through orientations Power/signal combo, press-fit tails, rugged weld tabs, locks and latches Mating cable assemblies available Rugged tucked Differential pair for Custom designs allow beam technology increased speed for misalignment in (HTEC8) (HSEC8-DP) the X-Y axes (HSEC1) KEY SPECIFICATIONS TOTAL INSULATOR CONTACT OPERATING CURRENT VOLTAGE LEAD-FREE SERIES PITCH POSITIONS MATERIAL MATERIAL TEMP RANGE RATING RATING SOLDERABLE HSEC6 0.60 mm 56-168 Black LCP Copper Alloy -55 to +125 0.8 A (12 pins) 300 VAC Yes HTEC8 0.80 mm 40-200 Black LCP Copper Alloy -55 to +125 3.0 A (2 pins) 215 VAC Yes HSEC8 0.80 mm 18-200 Black LCP BeCu -55 to +125 2.8 A (2 pins) 240 VAC Yes HSEC1 1.00 mm 20-140 Black LCP Phosphor Bronze -55 to +125 2.2 A (2 pins) 215 VAC Yes View complete specifications at: samtec.com HSEC6-DV F-221 samtec.com/EdgeCard samtec.com/EdgeCard Unless otherwise approved in writing by Samtec, all parts and components are designed and built according to Samtecs specifications which are subject to change without notice. (0.80 mm) .0315 PITCH RIGHT-ANGLE & EDGE MOUNT SOCKET POSITIONS CARD PLATING OTHER HSEC8 1 RAR - PER ROW - THICKNESS - OPTION - - OPTIONS - Leave blank for 09, 10, 13, 20, 01 L BL Tray Packaging = (1.60 mm) .062 = 10 (0.25 m) = Board Locks (09, 13, 25, 30, 40, 49, thick card Gold on contact area, 25, 40, 49, 50, 60 only) 50, 60 TR Matte Tin on tail = Tape & Reel L2 S = ECDP Latching FR = 30 (0.76 m) (09, 13, 25, 49 only) = Full Reel Gold on contact area, Tape & Reel Packaging Matte Tin on tail (must order max. quantity per reel (9.30) contact Samtec for .366 HSEC8-RA quantity breaks) POSITIONS PER ROW A B C Card Mates: 40 (43.80) 1.724 (18.90) .744 (36.60) 1.441 No. of Positions x (1.60 mm) .062 (0.80) .0315 + (5.38) .212 50 (51.80) 2.039 (22.90) .902 (44.60) 1.756 thick card, 60 (59.80) 2.354 (26.90) 1.059 (52.60) 2.071 HSC8 No. of Positions x (0.80) .0315 + (8.61) .339 (12.05) 40-BL (51.30) 2.020 (18.9.4740) .744 (36.60) 1.441 Cable Mates: (5.20) 50-BL (59.30) 2.335 (22.90) .902 (44.60) 1.756 .205 ECDP 60-BL (67.30) 2.650 (26.90) 1.059 (52.60) 2.071 A C B (9.30)(9.30) .366.366 40, 50, & 60 POSITIONS -BL OPTIONNo. Noof P. of Positions x ositions x (0.80) .0315 + (5.38) .212(0.80) .0315 + (5.38) .212 No. Noof P. of Positions x (0.80) .0315 + (8.61) .339ositions x (0.80) .0315 + (8.61) .339 (12.05)(12.05) (9.30) .474.474 .366 (5.20) (5.20) .205.205 No. of Positions x (0.80) .0315 + (5.38) .212 A A C C 10, 20 & 30 POSITIONS B B No. of Positions x (0.80) .0315 + (8.61) .339 (12.05) View complete specifications at: samtec.com .474 HSEC8-RA (5.20) .205 POSITIONS PLATING HSEC8 1 01 D EM2 - PER ROW - - OPTION - - A C B 10, 20, 30, 40, L EM2 = 10 (0.25 m) =(1.60 mm) .062 50, 60 Gold on contact area, thick PCB Matte Tin on tail S = 30 (0.76 m) Gold on contact area, No. of Positions x (0.80) .0315 + (18.40) .724 Matte Tin on tail No. of Positions x (0.80) .0315 + (7.80) .307 B A No. of Positions x (0.80) .0315 + (18.40) .724 HSEC8-EM No. of Positions x (0.80) .0315 + (7.80) .307 POSITIONS PER ROW A B B Card Mates: No. of Positions x (0.80) .0315 + (18.40) .724 A No. of Positions x (0.80) .0315 + (7.80) .307 (1.60 mm) .062 40 (18.90) .744 (36.60) 1.441 B No. of Positions x (0.80) .0315 + (15.20) .598 thick card, A 50 (22.90) .902 (44.60) 1.756 HSC8 (7.00) 60 (26.90) 1.059 (52.60) 2.071 No. of P40,ositions x (0.80) .0315 + (15.20) .598 50 & 60 POSITIONS Cable Mates: .276 ECDP No. of Positions x (0.80) .0315 + (15.20) .598 (7.00) .276 No. of Positions x (0.80) .0315 + (4.60) .181 (7.00) .276 No. of Positions x (0.80) .0315 + (4.60) .181 10, 20 & 30 POSITIONS No. of Positions x (0.80) .0315 + (4.60) .181 Note: Some sizes, styles and options are non-standard, non-returnable. View complete specifications at: samtec.com HSEC8-EM F-221 samtec.com/EdgeCard Unless otherwise approved in writing by Samtec, all parts and components are designed and built according to Samtecs specifications which are subject to change without notice.