's Die Bonding System
The Die Bonding System is an innovative and automated production system produced, developed and manufactured by Semikron. It is tailored to meet the precise requirements of high-performance and packed with huge manufacturing potential.
The system is made up of six to twelve parts, depending on the configuration and specific requirements of the customer. These parts include a die bonding tool, an operator console, a die attach machine, a robotic die handling system, a pick and place system, wire bonding machines, a thermal processing unit, an automated ribbon stripping and cutting system, dicing blocks, a tape and reel system and an integrated trace system.
The die bonding tool ensures precise die attach with an alignment accuracy of 0.03mm or better. The operator console allows for easy programing and setup of the machine. The die attach machine is capable of attaching multiple dies at the same time, maximizing production capacity and reducing the time needed for the task. The robotic die handling system deploys die to the die attach machine. The pick and place system allows for precise die handling and component positioning. The wire bonding machines attach wires to the devices with minimized handling time. The thermal processing unit provides a controlled environment and atmosphere for attaching components. The automated ribbon stripping and cutting system enables easy, precise striping and cutting of ribbon wire. The dicing blocks are used in conjunction with the pick and place system to provide separation of components in the process. The tape and reel system feeds components to the die attach machine and the integrated trace system provides real-time monitoring over the entire production run.