SRDA3.3-4.TBT Semtech

SRDA3.3-4 RailClamp Low Capacitance TVS Array PROTECTION PRODUCTS Description Features RailClamp TVS arrays are low capacitance ESD protection Transient protection for high-speed data lines to devices designed to protect sensitive compoonents from IEC 61000-4-2 (ESD) 15kV (air), 8kV (contact) overvoltage caused by electrostatic discharge (ESD), IEC 61000-4-4 (EFT) 40A (5/50ns) electrical fast transients (EFT), and lightning surge. It IEC 61000-4-5 (Lightning) 25A (8/20s) Array of surge rated diodes with internal TVS diode offers desirable characteristics for board level protection Protects four I/O lines including fast response time, low operating and clamping Low capacitance (<15pF) voltage, and no device degradation. Low operating voltage: 3.3V Low clamping voltage The unique design incorporates surge rated, low Solid-state technology capacitance steering diodes and a TVS diode in a single package. During transient conditions, the steering diodes Mechanical Characteristics direct the transient current to ground via the internal low JEDEC SOIC-8 Package voltage TVS. The TVS diode clamps the transient voltage Pb-Free, Halogen Free, RoHS/WEEE Compliant to a safe level. The low capacitance array configuration Lead Finish: Matte Sn allows the user to protect up to four data lines. Marking : Marking Code Packaging : Tape and Reel The SRDA3.3-4 is constructed using Semtechs proprietary EPD process technology. The EPD process provides low Applications stand-off voltages with significant reductions in leakage current and capacitance over silicon avalanche diode T1/E1 secondary IC Side Protection processes. They feature a true operating voltage of 3.3 T3/E3 secondary IC Side Protection Analog Video Protection volts for superior protection. These devices are in a 8-pin Microcontroller Input Protection SOIC package. It measures 3.9 x 4.9mm. The high surge Base stations capability (I =25A, tp=8/20s) means it can be used in PP 2 I C Bus Protection high threat environments in applications such as CO/CPE equipment, telecommunication lines, and video lines. Circuit Diagram Schematic and Pin Configuration 2, 3 1 I/O 1 8 GND NC 2 7 I/O 4 I/O 1 I/O 2 I/O 3 I/O 4 NC 3 6 I/O 3 4 I/O 2 5 GND 5, 8 SO-8 (Top View) SRDA3.3-4 1 www.semtech.com Final Datasheet Rev 3.0 Semtech 01/08/2018Absolute Maximum Ratings Rating Symbol Value Units Peak Pulse Power (tp = 8/20s) P 500 W PK Peak Pulse Current (tp = 8/20s) I 25 A PP O Lead Soldering Temperature T 260 (10 sec.) C L O Operating Temperature T -40 to +85 C J O Storage Temperature T -55 to +150 C STG O Electrical Characteristics (T=25 C unless otherwise specified) Parameter Symbol Conditions Min. Typ. Max. Units Reverse Stand-Off Voltage V 3.3 V RWM Punch-Through Voltage V I = 2A 3.5 V PT PT Snap-Back Voltage V I = 50mA 2.8 V SB SB Reverse Leakage Current I V = 3.3V 1 A R RWM I = 1A 5.3 PP Clamping Voltage V tp = 8/20s I = 10A 10 V C PP I = 25A 15 PP I/O to GND 8 15 Junction Capacitance C V = 0V, f = 1MHz pF J R I/O to I/O 4 SRDA3.3-4 2 www.semtech.com Final Datasheet Rev 3.0 Semtech 01/08/2018