Product Information

RNCP1206FTD221R

RNCP1206FTD221R electronic component of Stackpole

Datasheet
Res Thin Film 1206 221 Ohm 1% 1/2W ±100ppm/°C Molded SMD Paper T/R

Manufacturer: Stackpole
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

5000: USD 0.0118 ea
Line Total: USD 59

0 - Global Stock
MOQ: 5000  Multiples: 5000
Pack Size: 5000
Availability Price Quantity
0 - WHS 1


Ships to you between Mon. 27 May to Fri. 31 May

MOQ : 5000
Multiples : 5000

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RNCP1206FTD221R
Stackpole

5000 : USD 0.0116

     
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RNCP Series Stackpole Electronics, Inc. High Power Anti-Sulfur Thin Film Chip Resistor Resistive Product Solutions Higher power ratings than standard thick film chips Features: Absolute TCRs to 100 ppm/C Impervious to Sulfur contamination, no silver present in terminations Absolute Tolerances to 1% Completely lead free and RoHS compliant without exemptions does not use lead containing glass Comparable in cost to standard thick film chip resistors Electrical Specifications Ohmic Range () and Resistance (1) Maximum Working Maximum Overload Power Rating Tolerance Type / Code Temperature (2) Voltage (Watts) 70C Voltage Coefficient 1%, 5% RNCP0402 0.1W 50V 100V 1 - 10K 1 - 47K RNCP0603 0.125W 150V 300V 100 ppm/C RNCP0805 0.25W 200V 400V 1 - 100K RNCP1206 0.5W (1) Power rating for each package size is valid if ambient temp 80C and terminal temp 105C (2) Lesser of PR or maximum working voltage Certain resistance values will require a high minimum order quantity. Contact Stackpole Customer Service for details. Please refer to the High Power Resistor Application Note (page 5) for more information on designing and implementing high power resistor types. Mechanical Specifications L W H a b Type / Code Unit Body Length Body Width Body Height Top Termination Bottom Termination 0.039 0.004 0.020 0.002 0.012 0.002 0.010 0.006 0.012 0.006 inches RNCP0402 1.00 0.10 0.50 0.05 0.30 0.05 0.25 0.15 0.30 0.15 mm 0.059 0.004 0.031 0.004 0.016 0.004 0.012 0.008 0.016 0.008 inches RNCP0603 1.50 0.10 0.80 0.10 0.40 0.10 0.30 0.20 0.40 0.20 mm 0.079 0.006 0.049 0.006 0.020 0.004 0.016 0.008 0.024 0.008 inches RNCP0805 2.00 0.15 1.25 0.15 0.50 0.10 0.40 0.20 0.60 0.20 mm 0.122 0.008 0.059 0.008 0.020 0.004 0.020 0.012 0.028 0.008 inches RNCP1206 3.10 0.20 1.50 0.20 0.50 0.10 0.50 0.30 0.70 0.20 mm Rev Date: 07/05/2017 1 www.seielect.com This specification may be changed at any time without prior notice marketing seielect.com Please confirm technical specifications before you order and/or use. RNCP Series Stackpole Electronics, Inc. High Power Anti-Sulfur Thin Film Chip Resistor Resistive Product Solutions Performance Characteristics Test Items Reference Standard Condition of Test Test Limits ( R) Temperature Coefficient MIL-STD-202F Method 304 +25~ +125C 100 ppm/C of Resistance JIS-C5201-1-4.8 MIL-R-55342D Paragraph 4.7.5 F: (1% + 0.1) Short Time Overload 2.5 X rated voltage for 5 s. JIS-C5201-1-4.13 J: (2% + 0.1) 1000 h. T=125C. Unpowered. High Temperature MIL-STD-202 F: (2% + 0.1) Measurement at 24 2 hours after test Exposure (Storage) Method 108 J: (2% + 0.1) conclusion. F: (0.5% + 0.05) JESD22 1000 cycles (-55C to +125C) Measurement Temperature Cycling J: (1% + 0.1) Method JA-104 at 24 2 hours after test conclusion Remark: R10: F/J: (1% + 0.1) 1000 h., T=24 hours/cycle MIL-STD-202 F: (1% + 0.05) Moisture Resistance Notes: Steps 7a & 7b not required. Method 106 J: (2% + 0.1) Unpowered. 1000 h. 85C / 85% RH. Note: Specified MIL-STD-202 conditions: 10% of operating power. F: (3% + 0.1) Biased Humidity Method 103 Measurement at 24 2 hours after test J: (3% + 0.1) conclusion 1000 h. TA=125C at rated power. MIL-STD-202 Measurement at 24 2 hours after test F: (1% + 0.05) Operational Life Method 108 J: (3% + 0.1) conclusion. Remark: Mounted quantity: Mounted 2 pc. on 1 PCB Resistance to Soldering MIL-STD-202 Condition B: Immerse the specimens in an F: (0.5% + 0.05) Heat Method 210 eutectic solder at 260 5C for 10 1s. J: (1% + 0.1) 245 5C solder, 2 0.5 s. dwell Solderability J-STD-002 >95% area covered with tin Solder: Sn96.5 / Ag3.0 / Cu0.5 F: (0.5% + 0.05) Board Flex (Bending) AEC-Q200-005 3mm deflection J: (1% + 0.1) Pressure X kgf a R0.5 pressure rod for 60 s. F: (0.5% + 0.05) 0201: NA Terminal Strength (SMD) AEC-Q200-006 0402: 0.5Kg 0805: 1.0Kg J: (1% + 0.1) 0603: 0.5Kg 1206: 1.8Kg Power Derating Curve: -55C 70C 100 80 60 40 20 155C 0 0 20 40 60 80 100 120 140 160 180 -60 Ambient Temperature (C) Rev Date: 07/05/2017 2 www.seielect.com This specification may be changed at any time without prior notice marketing seielect.com Please confirm technical specifications before you order and/or use. Power Load (%)

Tariff Desc

8533.10.00 17 No Fixed carbon resistors, composition or film types Free

ELECTRICAL RESISTORS (INCLUDING RHEOSTATS AND POTENTIOMETERS)
SEI ELECTRONICS
SEI Stackpole
SEI Stackpole Electronics
SEI(Stackpole Elec)
Stackpole Elec
STACKPOLE ELECTRONICS
Stackpole Electronics Inc
Stackpole Electronics Inc.
STK

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