Product Information

ECMF02-2BF3

ECMF02-2BF3 electronic component of STMicroelectronics

Datasheet
STMicroelectronics EMI Filter Beads, Chips & Arrays Dual Line IPAD ESD 5GHz 23dB at 900MHz

Manufacturer: STMicroelectronics
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

695: USD 0.1211 ea
Line Total: USD 84.16

674 - Global Stock
Ships to you between
Mon. 27 May to Thu. 30 May
MOQ: 695  Multiples: 1
Pack Size: 1
Availability Price Quantity
674 - WHS 1


Ships to you between
Mon. 27 May to Thu. 30 May

MOQ : 695
Multiples : 1

Stock Image

ECMF02-2BF3
STMicroelectronics

695 : USD 0.1211

242 - WHS 2


Ships to you between
Mon. 27 May to Thu. 30 May

MOQ : 1
Multiples : 1

Stock Image

ECMF02-2BF3
STMicroelectronics

1 : USD 0.2981
10 : USD 0.2659
30 : USD 0.2506
100 : USD 0.2345
500 : USD 0.2256
1000 : USD 0.2209

9700 - WHS 3


Ships to you between Mon. 20 May to Fri. 24 May

MOQ : 5000
Multiples : 5000

Stock Image

ECMF02-2BF3
STMicroelectronics

5000 : USD 0.1664

     
Manufacturer
Product Category
Series
Product Type
Vesd - Voltage ESD Contact
Vesd - Voltage ESD Air Gap
Polarity
Number of Channels
Termination Style
Breakdown Voltage
Working Voltage
Clamping Voltage
Ipp - Peak Pulse Current
Cd - Diode Capacitance
Package / Case
Pppm - Peak Pulse Power Dissipation
Minimum Operating Temperature
Maximum Operating Temperature
Packaging
Hts Code
LoadingGif

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ECMF02-2BF3 Dual line IPAD, common mode filter with ESD protection for high speed serial interface Datasheet - production data Description The ECMF02-2BF3 is a highly integrated common mode filter designed to suppress EMI/RFI common mode noise on high speed differential serial buses like MIPI D-PHY, MDDI, USB 2.0 and HDMI. The ECMF02-2BF3 can protect and filter one Flip Chip differential lane. 5 bumps Figure 1. Pin configuration (bump side) Features 2 1 Very large differential bandwidth above 5 GHz OUT1 A IN1 High common mode attenuation: - 23 dB at 900 MHz. OUT2 IN2 B High common mode attenuation: - 20 dB between 800 MHz and 2.2 GHz. GND C 2 Very low PCB space consumption: <1.1mm Thin package: 0.50 mm max. after reflow Lead-free package Figure 2. Schematic High reduction of parasitic elements through integration GND Complies with the following standard: IEC 61000-4-2 level 4 input and output pins: OUT1 IN1 15 kV (air discharge) OUT2 IN2 8 kV (contact discharge) Application GND High speed serial interfaces such as USB 2.0, MIPI D-PHY, MDDI and HDMI. TM: IPAD is a trademark of STMicroelectronics. March 2014 DocID018656 Rev 2 1/13 This is information on a product in full production. www.st.comCharacteristics ECMF02-2BF3 1 Characteristics Table 1. Absolute maximum ratings (T = 25 C) amb Symbol Parameter Value Unit IEC 61000-4-2 contact discharge 10 (1) V Peak pulse voltage kV PP IEC 61000-4-2 air discharge 20 T Maximum junction temperature 125 C j T Operating temperature range - 30 to + 85 C op T Storage temperature range - 55 to 150 C stg 1. Measurements done on IEC 61000-4-2 test bench. For further details see Application note AN3353. Figure 3. Electrical characteristics (definitions) I Symbol Parameter V = Breakdown voltage BR I = Leakage current V R BR IR V = Stand-off voltage RM IRM VBR VRM V I = Leakage current V IRM RM RM VRM VBR IR Table 2. Electrical characteristics (values, T = 25 C) amb Symbol Test conditions Min. Typ. Max. Unit V I = 1 mA 6 V BR R I V = 3 V per line 100 nA RM RM R DC serial resistance 3 4 DC 2/13 DocID018656 Rev 2

Tariff Desc

8541.10.00 15 No - Diodes, other than photosensitive or light emitting diodes Free

DIODES, TRANSISTORS AND SIMILAR SEMICONDUCTOR DEVICES; PHOTOSENSITIVE SEMICONDUCTOR DEVICES, INCLUDING PHOTOVOLTAIC CELLS WHETHER OR NOT ASSEMBLED IN MODULES OR MADE UP INTO PANELS
C-Max
C-Max (VA)
SG3
ST
ST MICROELECTRONICS
ST2
ST7
STM
STMICRELECTRONICS
STN

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