EMIF06-HSD04F3 6-line low capacitance IPAD for micro-SD card with EMI filtering and ESD protection Datasheet production data Features Very low line capacitance to compensate long PCB tracks (4.5 pF typ.) 208 MHz clock frequency compliant with SD3.0 UHS-1 SDR 104 standard High ESD robustness: up to 12 kV contact )OLS &KLS EXPSV Lead-free package in 400 m pitch Package thickness: 500 m typ. Figure 1. Pin configuration (bump side) Very low PCB space consumption High reliability offer by the monolithic integration % Complies with the following standards: IEC 61000-4-2 level 4 & 15 kV (air discharge) 8 kV (contact discharge) Application Where ESD protection for sensitive equipment is required: Smartphones and Tablets Camera, Printers, Laptops and desktops Description The EMIF06-HSD04F3 chip is a highly integrated device designed to protect the application against ESD event during the insertion of the micro-SD card. The EMIF06-HSD04F3 must be placed close to the micro-SD card connector for efficient ESD protection. TM: IPAD is a trademark of STMicroelectronics November 2014 DocID027072 Rev 1 1/8 This is information on a product in full production. www.st.com 8Characteristics EMIF06-HSD04F3 1 Characteristics Table 1. Absolute maximum ratings (T = 25 C) amb Symbol Parameter Value Unit ESD discharge IEC 61000-4-2, level 4 (on pins Vcc, SDclk, SDcmd, SDdat0, SDdat1, SDdat2, SDdat3 15 Air discharge Contact discharge, external pins 12 V kV PP ESD discharge IEC 61000-4-2, level 1 (on pins clk, dat0, dat1,dat2, dat3, cmd) Air discharge 15 Contact discharge, internal pins 10 T Maximum junction temperature 125 C j T Operating temperature range - 40 to + 85 C op T Storage temperature range - 55 to + 150 C stg Figure 2. EMIF06-HSD04F3 Schematic Table 2. Pin configuration Pin Signal Pin Signal A1 dat0 C1 Cmd A2 dat1 A3 SDdat1 C3 GND A4 SDdat0 C4 SDcmd B1 clk D1 dat3 B2 V D2 dat2 cc B3 GND D3 SDdat2 B4 SDclk D4 SDdat3 2/8 DocID027072 Rev 1