Product Information

EMIF06-MSD01F2

EMIF06-MSD01F2 electronic component of STMicroelectronics

Datasheet
EMI Filter Circuits Mini/mcro SD Crd EMI 17pF -14db @ 900MHz

Manufacturer: STMicroelectronics
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

5000: USD 0.318 ea
Line Total: USD 1590

4850 - Global Stock
Ships to you between
Thu. 23 May to Wed. 29 May
MOQ: 5000  Multiples: 5000
Pack Size: 5000
Availability Price Quantity
4850 - WHS 1


Ships to you between Thu. 23 May to Wed. 29 May

MOQ : 5000
Multiples : 5000

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EMIF06-MSD01F2
STMicroelectronics

5000 : USD 0.3301

     
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EMIF06-mSD01F2 IPAD Mini and micro SD Card - EMI filtering and 25 kV ESD protection Main application Mini and micro (T-Flash) Secure Digital memory card in mobile phones and communication systems Description The EMIF06-mSD01F2 is a highly integrated device based on IPAD technology with the following functions: Flip-Chip ESD protection to comply with IEC standard (16 Bumps) EMI Filtering to reject mobile phone frequencies Pin configuration (bump side) Benefits 4 3 2 1 EMI Low-pass-filter A ESD protection 25 kV (IEC 61000-4-2) Integrated pull up resistors to prevent bus B floating when no card is connected 50 Mhz clock frequency compatibility with C C < 20 pF line Low power consumption D Easy Layout thanks to smart pin-out configuration A1 DATA0 C1 CMD Very low PCB space consuming A2 DATA1 C2 Vss High reliability offered by monolithic integration A3 SDDATA1 C3 Vss Reduction of parasitic elements thanks to CSP integration A4 SDDATA0 C4 SDCMD Lead free package B1 CLK D1 DATA3/CD Coated version option upon request B2 Vcc D2 DATA2 Complies with the following standards: B3 Vss D3 SDDATA2 IEC 61000-4-2 B4 SDCLK D4 SDDATA3/CD level 4 15 kV (air discharge) 8 kV (contact discharge) Order code MIL STD 883G - Method 3015-7 Class 3A Part Number Marking SD Card Specification Ver. 1.01 MicroSD Card Specification Ver. 1.0 EMIF06-mSD01F2 HJ Physical layer specification, Part 1 vesion 1.1 TM: IPAD is a trademeark of STMicroelectronics February 2007 Rev 1 1/7 www.st.com 7Characteristics EMIF06-mSD01F2 1 Characteristics Table 1. Absolute ratings (limiting values) Symbol Parameter and test conditions Value Unit ESD discharge IEC 61000-4-2, air discharge 25 V kV PP ESD discharge IEC 61000-4-2, contact discharge 25 V Maximum input voltage 5.5 V in T Maximum junction temperature 125 C j T Operating temperature range - 40 to + 85 C op T Storage temperature range 125 C stg Figure 1. EMIF06-mSD01F2 configuration Vcc R9 R10 R11 R12 R13 R1 Clk SDClk R2 CMD SDCMD R3 Data0 SDData0 R4 Host Card Data1 SDData1 R5 Data2 SDData2 R6 Data3/CD SDData3/CD Vss Vss Table 2. Electrical characteristics Symbol Test conditions Min. Typ. Max. Unit V I = 1 mA 14 16 V BR R I V = 3 V 0.1 A RM RM R1, R2, R3, R4, R5, R6 Tolerance 20% 40 R9, R10, R11, R12, R13 Tolerance 30% 25 k C V = 0 V, F = 1 MHz V = 30 mV 17 20 pF line osc 2/7

Tariff Desc

8504.50.10 Electrical transformers, static converters (for example, rectifiers) and inductors.

8504.50 COILS, toroidal, having ALL of the following: (a) winding wire dia NOT exceeding 0.25 mm; (b) internal window dia NOT exceeding 40 mm; (c) external dia NOT exceeding 55 mm Op. 17.06.1985 Dec. 13.01.1986 - TC 8532473

8504.90 CORES AND SHAPES, ferrite, iron powder or molybdenum permalloy powder Op. 13.03.1984 Dec. 13.03.1984 - TC 8342777

8547.9 TC 8535449 SHEETING OR SHAPES, electrically insulating, thermally conductive,
being combinations of two OR more of the following:
(a) silicone rubber;
(b) glass fibre;
(c) boron nitride;
(d) polyimide;
(e) copper
C-Max
C-Max (VA)
SG3
ST
ST MICROELECTRONICS
ST2
ST7
STM
STMICRELECTRONICS
STN

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