HDMI2C2-14HD STMicroelectronics

HDMI2C2-14HD ESD protection and signal booster for HDMI 1.4 sink interface Datasheet production data Protection of ultra-sensitive HDMI ASICs Low power consumption in stand-by mode Wake-up from stand-by through CEC bus Improved HDMI interface ruggedness and user experience Long and/or poor quality cable support Companion chip for STMicroelectronics STixxxx HDMI decoders. Complies with the following standards HDMI 1.4 version IEC 61000-4-2 level 4 QFN 36L JESD22-A114D level 2 3.5 X 6.5 Applications Features Consumer and computer electronics HDMI HDMI 1.3 and 1.4 compliant: from -40 to 85 C sink device such as: 8 kV contact ESD protection on connector side HD set-top boxes DVD and Blu-Ray Disk systems Supports direct connection to low-voltage HDMI ASIC and/or CEC driver (down to 1.8 V) Home theater Game console High integration level in 1 package TMDS high bandwidth ESD protection Description DDC (I2C) link protection, bi-directional signal conditioning circuit, and dynamic pull-up The HDMI2C2-14HD is a fully integrated ESD CEC bus protection, bi-directional level-shifter, protection and signal conditioning device for backdrive protection, and independent control links and TMDS data video channels of structure from main power supply HDMI receivers (Sink). HEAC/HPD link protection and line matching The HDMI2C2-14HD is a simple solution that provides HDMI designers with an easy and fast Proposed in QFN 36 leads 500 m pitch way to reach full compliancy with the stringent HDMI 1.4 CTS on a wide temperature range. Benefits Speed-up hardware design and certification of HDMI 1.4 application Pin map sequence compliant with HDMI connector type A TM: HDMI: the HDMI logo and High-Definition Minimal PCB footprint in consumer area Multimedia Interface are trademarks or registered trademarks of HDMI Licensing LLC. August 2014 DocID024813 Rev1 1/31 This is information on a product in full production. www.st.comContents HDMI2C2-14HD Contents 1 Functional description . 3 2 Application information 5 2.1 CEC line description 5 2.2 DDC functional block description 6 2.3 HEAC link and HPD line protection 9 2.4 TMDS channels ESD protection 10 2.5 Application block diagrams 10 3 Electrical characteristics 15 4 Package information 24 5 Recommendation on PCB assembly . 27 5.1 Stencil opening design . 27 5.2 Solder paste . 28 5.3 Placement 29 5.4 PCB design preference 29 5.5 Reflow profile 29 6 Ordering information . 30 7 Revision history . 30 2/31 DocID024813 Rev1