VS6451R0BA/TR STMicroelectronics

VS6451 Ultra small CIF+ reflowable camera module Data Brief Features CIF+ resolution sensor (384x320 or 320x384) Electrical and logical interface fully SMIA compliant Video data interface - CCP2.0 Command interface - CCI 2.8 V/1.8 V operation On-board 10 bit ADC Small physical size Integral EMC shielding device can be incorporated in the phone system to run the algorithms in hardware. The STV0984 Ultra low power standby mode processor can support 2 cameras. The On-chip PLL specifications of these devices are contained in a Lead free reflowable module separate document. The module design is optimized to provide an Applications ultra small footprint and height, and is designed to be reflowable at lead-free solder profiles. The Mobile phone product is lead free. PDA The lens design is optimized for video conferen- Videophone cing and maintains its performance even after the high temperatures of lead-free reflow. Description VS6451 offers an ultra low power consumption hardware standby mode consuming less than This data brief outlines an ultra small reflowable 30 W. CIF+ camera module (VS6451) for use across a range of mobile phone handsets and accessories. It is primarily designed to be used as a second camera in video conferencing applications, but could equally be used as a primary camera. The camera silicon device is SMIA class 2 profile 0 compliant and is capable of generating raw bayer CIF+ images up to 30 fps. The VS6451 supports the CCI control and CCP2.0 data interfaces. As different phone platforms have different baseband processors with varying capabilities, it may not be possible for all phones to support the associated image processing algorithms. Where the baseband cannot support this processing load, a separate hardware accelerator (STV0984) March 2007 Rev 2 1/4 For further information contact your local STMicroelectronics sales office. www.st.com 4VS6451 Figure 1. Application diagram Figure 2. Block diagram VS6451 STV0984 Baseband CLK CLK CIF+ or or PDN PDN VS6451 STV0976 Application camera Processor Processor I2C PLL and Clock Management module EXTCLK CCI VDIG Power Mgmt Power-On Reset XSHUTDOWN DGND CCP2.0 CCP2.0 or Sensor CIF+ ITU Control Pixel array VANA Registers SCL 1152 x 864 AGND CLK SDA PDN Baseband VS6451 or CIF+ SMIA Application CCI CLKP profile 0 camera Processor Column ADC CLKN frame module X Decoder DATAP formatter CCP2.0 SMIA Rxer DATAN Line SRAM Table 1. Technical specifications Parameter Values Pixel array CIF+ portrait and landscape Sensor technology 0.18 m HCMOS8i shrink Pixel size 3.6m x 3.6m Exposure control +8 dB Analogue gain +24 dB (max) Dynamic range 61 dB Signal to noise 34 dB ( 100 lux) Minimum illumination < 7lux Analogue: 2.4V to 2.9V Supply voltage Digital: 1.8V 0.1V Average power consumption 30fps <60 mW Module size (XYZ) max 4.5 mm x 4.5 mm x 3.55 mm Lens HFOV 45+/- 2 (CIF+, CIF equiv. 45) F number 2.8 On axis 45% (typ) Lens SFR Horizontal field (70%) 25% (typical) Lens TV distortion < 5% Relative illumination 60% (typ) System connectivity Lead free reflowable BGA Storage temperature -40 +85 C Functional operating temperature -30 +70 C Normal operating temperature -25 +55 C Optimal operating temperature +5 +30 C 2/4 CCP2.0 CCI Transmitter Receiver Readout Y Decoder