L373S-150-2.0 T-Global Technology

Thermal Interface Materials TGlobal - Thermal gap fillers from 1.5 W/m K to 4.8 W/m K with and without PSA adhesive. - Soft materials highly compressible, easy to assemble, and provide good electrical insulation. - Shock and vibration absorber - Typically used on electrical components, : IC, CPU and MOS, and connection between boards to enclosure walls to help heat conduction. - Typical applications include heat dissipation from LEDs, motherboards, power supplies, LCD TVs, notebooks, hubs, hand sets, memory modules, hard drives PIC03.jpg Technical specifications: Width Thickness Thermal Insulation Shore & (mm) Conductivity Strength Hardness Length (W/m K) (kV / mm) A Part Number (mm) 150 0.5 1.6 7 15 L37-5-150-0.5A 150 1.0 1.6 7 15 L37-5-150-1.0A 150 1.5 1.6 7 15 L37-5-150-1.5A 150 2.0 1.6 7 15 L37-5-150-2.0A 150 0.5 2.2 5 10 H482-150-0.5A 150 1.0 2.2 5 10 H482-150-1.0A 150 1.5 2.2 5 10 H482-150-1.5A 150 2.0 2.2 5 10 H482-150-2.0A 150 0.5 1.7 10 5 L373-150-0.5A 150 1.0 1.7 10 5 L373-150-1.0A 150 1.5 1.7 10 5 L373-150-1.5A 150 2.0 1.7 10 5 L373-150-2.0A 150 0.5 1.4 10 5 L373S-150-0.5 150 1.0 1.4 10 5 L373S-150-1.0 150 1.5 1.4 10 5 L373S-150-1.5 150 2.0 1.4 10 5 L373S-150-2.0 150 0.5 3.2 7 20 H486-150-0.5A 150 1.0 3.2 7 20 H486-150-1.0A 150 1.5 3.2 7 20 H486-150-1.5A 150 2.0 3.2 7 20 H486-150-2.0A 150 0.5 4.0 5 20 H486A-150-0.5 150 1.0 4.0 5 20 H486A-150-1.0 150 0.5 4.8 5 30 H486R-150-0.5 150 1.0 4.8 5 30 H486R-150-1.0 PIC07.jpg