Manufacturing
ES1DL is a state-of-the-art manufacturing process technology developed by Taiwan Semiconductor Manufacturing Company (TSMC). It is based on the company's 40-nanometer (nm) low-power (LP) process and enables a wide range of applications, such as ultra-low-power transistor logic, low-power digital signal processing and storage circuits, embedded memory, and analog-mixed signal components. The process uses embedded memory functionality and smaller dimensions to provide significant power savings. Additionally, the process utilizes copper dual-damascene interconnect technology to provide further improvements in power and performance. The process also features innovative back-end-of-line (BEOL) integration technologies, including copper metallization, low-k intermetal dielectrics (IMDs), and surrounding gate stress (SGS) features to further enhance yields and performance.