X-On Electronics has gained recognition as a prominent supplier of MS583702BA01-50 Board Mount Pressure Sensors across the USA, India, Europe, Australia, and various other global locations. MS583702BA01-50 Board Mount Pressure Sensors are a product manufactured by TE Connectivity. We provide cost-effective solutions for Board Mount Pressure Sensors, ensuring timely deliveries around the world.

MS583702BA01-50 TE Connectivity

MS583702BA01-50 electronic component of TE Connectivity
MS583702BA01-50 TE Connectivity
MS583702BA01-50 Board Mount Pressure Sensors
MS583702BA01-50  Sensors

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Part No. MS583702BA01-50
Manufacturer: TE Connectivity
Category: Board Mount Pressure Sensors
Description: Board Mount Pressure Sensors MS5837-02BA01 MICRO ALTIM. T&R
Datasheet: MS583702BA01-50 Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
100: USD 14.8969 ea
Line Total: USD 1489.69 
Availability - 41563
Ship by Thu. 15 May to Wed. 21 May
MOQ: 100  Multiples: 500
Pack Size: 500
Availability Price Quantity
41563
Ship by Thu. 15 May to Wed. 21 May
MOQ : 100
Multiples : 500
100 : USD 14.8969
250 : USD 14.6738
500 : USD 15.1331
625 : USD 14.4637
1250 : USD 7.6256
1875 : USD 5.25
2500 : USD 5.145

   
Manufacturer
Product Category
Operating Pressure
Pressure Type
Accuracy
Output Type
Mounting Style
Operating Supply Voltage
Port Type
Interface Type
Resolution
Minimum Operating Temperature
Maximum Operating Temperature
Series
Packaging
Hts Code
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Notes:- Show Stocked Products With Similar Attributes.

We are delighted to provide the MS583702BA01-50 from our Board Mount Pressure Sensors category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the MS583702BA01-50 and other electronic components in the Board Mount Pressure Sensors category and beyond.

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MS5837-02BA Gel-filled, ultra-compact, water resistant digital pressure and temperature sensor Take your devices to the next level with our MS5837-02BA pressure and temperature sensor module. This ultra-compact (3.3 x 3.3 x 2.75 mm), gel-filled sensor is optimized for consumer devices such as fitness trackers, drones and wearables, providing a robust sensor package to withstand the harsh environments often encountered in these applications. Expanding on TE Connectivity s (TE) MS5837 series of ultra- compact, digital altimeters, our 2 bar models offers options for shielding and high chemical endurance. This MEMS based sensor includes a high-linearity pressure 2 sensor with low power (0.6A), 24-bit digital output (I C) and an altitude resolution at sea level of 13 cm. This enables high resolution measurements such as counting flights of stairs. The board level design delivers sensing accuracy for both pressure (0.5mbar) and temperature (2C) measurements. Lid shield option reduces signal noise and interference that may be experienced with sensors installed in plastic housings or high electrical noise environments with integrated shielding. (Non-shielded models should only be recommended for use in applications with metal housings.) APPLICATIONS Our MS5837-02BA provides exceptional performance, reliability Fitness Trackers and accurate performance from a brand you can trust. Drones Bike Computers FEATURES Mobile Altimeter/Barometer Systems E-cigarettes Ceramic and metal package: 3.3 x 3.3 x 2.75mm Wearables High resolution module: 13 cm Supply voltage: 1.5 to 3.6 V Low power: 0.6 A (standby 0.1 A at 25C) Integrated digital pressure sensor (24 bit ADC) Operating range: 300 to 1,200 mbar, -20 to +85 C 2 I C interface No external components (internal oscillator) Water resistant sealing with 1.8 x 0.8mm O-ring Shielded metal lid option TE CONNECTIVITY SENSORS /// MS5837-02BA REV A8 12/2019 Page 1 MS5 8 37- 02B A Gel-filled, ultra-compact, water resistant digital pressure and temperature sensor PREFORMANCE SPECIFCIATIONS ABSOLUTE MAXIMUM RATINGS Parameter Symbol Conditions Min. Typ. Max Unit Supply voltage V -0.3 +4 V DD Storage temperature T -40 +85 C S (1) Overpressure P ISO 22810 10 bar max Maximum Soldering T 40 sec. max 250 C max (2) Temperature ESD rating (lid to GND version) Human Body Model -2 +2 kV JEDEC JESD78 Latch up -100 +100 mA standard (1) Pressure ramp up/down min 60s (2) Refer to application note 808 ELECTRICAL CHARACTERISTICS Parameter Symbol Conditions Min. Typ. Max Unit Operating Supply voltage VDD 1.5 3.0 3.6 V Operating Temperature T -20 +25 +85 C 8192 20.09 4096 10.05 Supply current 2048 5.02 IDD OSR A (1 sample per sec.) 1024 2.51 512 1.26 256 0.63 Peak supply current during conversion 1.25 mA at 25C Standby supply current 0.01 0.1 A (V = 3.0 V) DD Power supply hold off for (3) internal reset VDD < 0.1V 200 ms VDD Capacitor from VDD to GND 100 470 nF Resistor value between the lid Version 02BA2x 1000 and the GND only (3) Supply voltage power up must be continuous from GND to VDD without any step ANALOG DIGITAL CONVERTER (ADC) Parameter Symbol Conditions Min. Typ. Max Unit Output Word 24 bit 8192 16.44 17.2 4096 8.22 8.61 2048 4.13 4.32 (4) ADC Conversion time tc OSR ms 1024 2.08 2.17 512 1.06 1.10 256 0.54 0.56 (4) 2 Maximum values must be used to determine waiting times in I C communication TE CONNECTIVITY SENSORS /// MS5837-02BA REV A8 12/2019 Page 2

Tariff Desc

8542.31.20 No ..Linear/analogue and peripheral integrated circuits, timers, voltage regulators, A/D and D/A converters, telecommunication and modem integrated circuits, other than board level products
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