SYDACP (Signal, Yield, and Defect Analysis and Characterization Program) is a software suite developed by TE Connectivity that helps optimize the performance and manufacturing of electronic parts. The software allows users to identify and minimize process-related defects, reduce product yields, and improve product performance—ultimately leading to higher-quality end products. SYDACP's suite of tools allows users to collect and analyze a variety of design, manufacturing and product data sets, giving them the ability to quickly identify and troubleshoot potential problems before they cause any serious manufacturing or performance issues.