Series GRF172 DPDT Non-Latching Surface Mount 2.5GHz RF Relay SURFACE MOUNT CENTIGRID 2.5 GHz RF RELAYS DPDT SERIES RELAY TYPE GRF172 DPDT Surface mount, RF Centigrid relay GRF172D DPDT Surface mount, RF Centigrid relay with coil transient suppression DESCRIPTION The GRF172 surface-mount Centigrid relay is an ultraminiature, Unique construction features and manufacturing techniques hermetically sealed, armature relay for 2.5 GHz RF applications. provide overall high reliability and excellent resistance to Its low profile height (.330) and .100 grid spaced terminals make it environmental extremes: an ideal choice where extreme packaging density and/or close PC All welded construction. board spacing are required. Unique uni-frame design providing high magnetic efficiency and mechanical rigidity. The GRF172 features a unique ground shield that isolates and High force/mass ratios for resistance to shock and vibration. shields each lead to ensure excellent contact-to-contact and Advanced cleaning techniques provide maximum assurance of pole-to-pole isolation. This ground shield provides a ground internal cleanliness. interface that results in improved highfrequency performance as Precious metal alloy contact material with gold plating assures well as parametric repeatability. The GRF172 extends performance excellent high current and dry circuit switching capabilities. advantages over similar RF devices that simply offer formed leads for surface mounting. Applications include telecommunications, test instruments, mobile communications, attenuators, and automatic test equipment. ENVIRONMENTAL AND INTERNAL CONSTRUCTION PHYSICAL SPECIFICATIONS Temperature 65C to +125C (Ambient) Vibration 10 gs to 500 Hz (General Note I) Shock 30 gs, (General Note I) 6ms half sine Enclosure Hermetically sealed Weight 0.15 oz. (4.3g) max. 2019 TELEDYNE RELAYS (800) 284-7007 www.teledynerelays.com GRF172 Page 1 GRF172 112019 Q4Series GRF172 DPDT Non-Latching Surface Mount 2.5GHz RF Relay SERIES GRF172 GENERAL ELECTRICAL SPECIFICATIONS ( 25C Notes 2 & 5) Contact Arrangement 2 Form C (DPDT) Rated Duty Continuous Contact Resistance 0.15 max. Before life 0.3 ohm max. After life at 1A/28Vdc (measured 1/8 from header Resistive: 1 A/ 28 Vdc Inductive: 200 mA/ 28 Vdc (320mH) Contact Load Rating Lamp: 100 mA / 28 Vdc Low level: 10 to 50 A 10 to 50 mV 5,000,000 cycles (typical) at low level Contact Life Ratings 500,000 cycles (typical) at 0.5 A / 28 Vdc resistive 100,000 cycles min. at all other loads speci ed above Contact Overload Rating 2 A / 28 Vdc Resistive (100 cycles min.) Contact Carry Rating Contact Factory Operate Time 6.0 msec max. at nominal rated coil voltage Release Time GRF172: 3.0 ms max. GRF172D: 6.0 ms max. Intercontact Capacitance 0.4 pf typical Insulation Resistance 1,000 M min. between mutually isolated terminals Dielectric Strength 300 Vrms (60 Hz) atmospheric pressure Negative Coil Transient (Vdc) 2.0 Vdc Max. Diode P.I.V. (Vdc) 60 Vdc Min. DETAILED ELECTRICAL SPECIFICATIONS ( 25C) GRF172-5 GRF172-12 GRF172-26 BASE PART NUMBERS (GRF172, GRF172D) GRF172D-5 GRF172D-12 GRF172D-26 Nom. 5.0 12.0 26.5 Coil Voltage, Nominal (Vdc) Max. 5.8 16.0 32.0 Coil Resistance (Ohms 25%) 64 400 1600 Pick-up Voltage (Vdc, Max.) Pulse Operation 3.8 9.0 18.0 Coil Operating Power at Nominal Voltage (mW) 405 360 440 OUTLINE DIMENSIONS NOTES: 1. DIMENSIONS ARE IN INCHES. METRIC EQUIVALENTS IN MILLIMETERS ARE SHOWN IN ( ). 2. UNLESS OTHERWISE SPECIFIED, TOLERANCES ON DIMENSIONS ARE .010 INCH (0.025 mm). 3. FOR OPTIMAL RF PERFORMANCE, SOLDER BOTTOM OF GROUND SHIELD TO PCB RF GROUND PLANE. GRF172 Page 2 SPECIFICATIONS ARE SUBJECT TO CHANGE WITHOUT NOTICE 2019 TELEDYNE RELAYS GRF172 112019 Q4