Product Information

TLV74328PDBVR

Product Image X-ON

Datasheet
LDO Voltage Regulators 300-mA low-IQ low-dropout (LDO) voltage regulator with enable 5-SOT-23 -40 to 125

Manufacturer: Texas Instruments
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 0.3537 ea
Line Total: USD 0.3537

5875 - Global Stock
Ships to you between
Mon. 19 Jun to Wed. 21 Jun
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
10 - Global Stock


Ships to you between
Tue. 20 Jun to Fri. 23 Jun

MOQ : 10
Multiples : 10

Stock Image

TLV74328PDBVR
Texas Instruments

10 : USD 0.0868
100 : USD 0.0716
300 : USD 0.0639
3000 : USD 0.0559
6000 : USD 0.0513
9000 : USD 0.049

5875 - Global Stock


Ships to you between Mon. 19 Jun to Wed. 21 Jun

MOQ : 1
Multiples : 1

Stock Image

TLV74328PDBVR
Texas Instruments

1 : USD 0.3537
10 : USD 0.2848
100 : USD 0.1287
500 : USD 0.0925
1000 : USD 0.0638
3000 : USD 0.0512
9000 : USD 0.0432
24000 : USD 0.0396
48000 : USD 0.036

     
Manufacturer
Texas Instruments
Product Category
LDO Voltage Regulators
RoHS - XON
y Icon ROHS
Mounting Style
smd/smt
Package / Case
SOT - 23 - 5
Output Voltage
2.8 V
Output Current
300 mA
Number of Outputs
1 output
Polarity
positive
Quiescent Current
34 uA
Input Voltage MIN
1.4 V
Input Voltage MAX
5.5 V
PSRR / Ripple Rejection - Typ
50 db
Output Type
fixed
Minimum Operating Temperature
- 40 C
Maximum Operating Temperature
+ 125 C
Dropout Voltage
122 mV
Series
tlv743p
Packaging
Cut Tape
Operating Temperature Range
- 40 C to + 125 C
Product
ldo regulators
Type
linear ldo regulator
Brand
Texas Instruments
Dropout Voltage - Max
260 mV
Output Voltage Range
-
Voltage Regulation Accuracy
1 %
Line Regulation
1 mv
Load Regulation
16 mv
Product Type
ldo voltage regulators
Factory Pack Quantity :
3000
Subcategory
Pmic-Power Management Ics
Cnhts
8542319000
Hts Code
8542390001
Mxhts
85423901
Category
LDO Voltage Regulators
Brand Category
Texas Instruments
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Support & Product Order Tools & Technical Community Folder Now Documents Software TLV743P SBVS310CJULY 2017REVISED JUNE 2019 TLV743P 300-mA, Low-Dropout Regulator 1 Features 3 Description The TLV743P low-dropout linear regulator (LDO) is 1 Input Voltage Range: 1.4 V to 5.5 V an ultra-small, low quiescent current LDO that Stable Operation With 1-F Ceramic Output sources 300 mA with good line and load transient Capacitor performance. The device provides a typical accuracy Foldback Overcurrent Protection of 1%. Packages: The TLV743P is designed to be stable with a small SOT-23 (5) output capacitor with a value of 1 F. The TLV743P device provides foldback current control during device X2SON (4) power up and enabling. This functionality is especially Very Low Dropout: 125 mV at 300 mA (3.3 V ) OUT important in battery-operated devices. Accuracy: 1% (Typical), 1.4% (Maximum) The TLV743P provides an active pulldown circuit to Low I : 34 A Q quickly discharge output loads when the device is Available in Fixed-Output Voltages: disabled. 1 V to 3.3 V The TLV743P is available in standard DBV (SOT-23) High PSRR: 50 dB at 1 kHz and DQN (X2SON) packages. Active Output Discharge (1) Device Information PART NUMBER PACKAGE BODY SIZE (NOM) 2 Applications SOT-23 (5) 2.90 mm 1.60 mm Tablets TLV743P X2SON (4) 1.00 mm 1.00 mm Smartphones (1) For all available packages, see the package option addendum Notebook and Desktop Computers at the end of the data sheet. Portable Industrial and Consumer Products WLAN and Other PC Add-On Cards Camera Modules Typical Application Circuit Dropout Voltage vs Output Current 180 V = 3.3 V OUT IN OUT 160 V = 1.8 V OUT 140 TLV743P C COUT IN 120 EN GND Optional 100 ON 80 OFF 60 40 20 0 0 30 60 90 120 150 180 210 240 270 300 I (mA) OUT D020 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. V (mV) DO TLV743P SBVS310CJULY 2017REVISED JUNE 2019 www.ti.com Table of Contents 1 Features.................................................................. 1 8 Application and Implementation........................ 16 8.1 Application Information............................................ 16 2 Applications........................................................... 1 8.2 Typical Application.................................................. 18 3 Description............................................................. 1 9 Power Supply Recommendations...................... 19 4 Revision History..................................................... 2 10 Layout................................................................... 19 5 Pin Configuration and Functions......................... 4 10.1 Layout Guidelines................................................. 19 6 Specifications......................................................... 5 10.2 Layout Examples................................................... 19 6.1 Absolute Maximum Ratings...................................... 5 11 Device and Documentation Support................. 20 6.2 ESD Ratings.............................................................. 5 11.1 Device Support .................................................... 20 6.3 Recommended Operating Conditions....................... 5 11.2 Documentation Support........................................ 20 6.4 Thermal Information.................................................. 5 11.3 Receiving Notification of Documentation Updates 20 6.5 Electrical Characteristics........................................... 6 11.4 Community Resources.......................................... 20 6.6 Typical Characteristics.............................................. 8 11.5 Trademarks........................................................... 21 7 Detailed Description............................................ 13 11.6 Electrostatic Discharge Caution............................ 21 7.1 Overview................................................................. 13 11.7 Glossary................................................................ 21 7.2 Functional Block Diagram....................................... 13 12 Mechanical, Packaging, and Orderable 7.3 Feature Description................................................. 14 Information........................................................... 21 7.4 Device Functional Modes........................................ 15 4 Revision History Changes from Revision B (March 2018) to Revision C Page Changed description of EN pin in Pin Functions table........................................................................................................... 4 Deleted typical specification from V and V parameters ......................................................................................... 6 EN(HI) EN(LO) Added maximum specification to I parameter ................................................................................................................... 7 LIM Added condition to 1-V Load Regulation vs I and Temperature figure............................................................................. 8 OUT Added condition to 1.8-V Load Regulation vs I and Temperature figure.......................................................................... 8 OUT Added condition to 3.3-V Load Regulation vs I and Temperature figure ......................................................................... 8 OUT Added condition to 1.2-V Dropout Voltage vs I and Temperature figure ......................................................................... 9 OUT Added condition to 1.8-V Dropout Voltage vs I and Temperature figure ......................................................................... 9 OUT Added condition to 3.3-V Dropout Voltage vs I and Temperature figure ......................................................................... 9 OUT Added and Output Enable to title and changed first paragraph of Shutdown and Output Enable section.......................... 14 Added DBV package to Maximum Ambient Temperature vs Device Power Dissipation figure and text reference............. 17 Added (3) to Device Nomenclature table............................................................................................................................. 20 Changes from Revision A (January 2018) to Revision B Page Changed X2SON package from preview to production data (active) .................................................................................... 1 Changes from Original (July 2017) to Revision A Page Added X2SON package to Features list ................................................................................................................................ 1 Added DQN (X2SON) package to Description section ......................................................................................................... 1 Added X2SON package to Device Information table............................................................................................................. 1 Added DQN (X2SON) package pinout drawing and pin functions table to Pin Configuration and Functions section .......... 4 Deleted thermal pad from DBV pinout drawing and Pin Functions table .............................................................................. 4 Changed format of I/O column contents and order of packages in Pin Functions table ....................................................... 4 Added DQN (X2SON) thermal information to Thermal Information table ............................................................................. 5 Changed condition text for Figure 31 .................................................................................................................................. 17 2 Submit Documentation Feedback Copyright 20172019, Texas Instruments Incorporated Product Folder Links: TLV743P

Tariff Desc

8542.31.00 51 No ..Application Specific (Digital) Integrated Circuits (ASIC)

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits:
A/NSC
NAT SEMI
NATIONAL SEMI
NATIONAL SEMICONDUCT
National Semiconductor
NS4
NSC
TEXAS
TEXAS INST
TEXAS INST / KLIXON
TEXAS INSTRUMENT
TEXAS INSTRUMENTS
TI
TI9