TLV74328PDBVR

Support & Product Order Tools & Technical Community Folder Now Documents Software TLV743P SBVS310CJULY 2017REVISED JUNE 2019 TLV743P 300-mA, Low-Dropout Regulator 1 Features 3 Description The TLV743P low-dropout linear regulator (LDO) is 1 Input Voltage Range: 1.4 V to 5.5 V an ultra-small, low quiescent current LDO that Stable Operation With 1-F Ceramic Output sources 300 mA with good line and load transient Capacitor performance. The device provides a typical accuracy Foldback Overcurrent Protection of 1%. Packages: The TLV743P is designed to be stable with a small SOT-23 (5) output capacitor with a value of 1 F. The TLV743P device provides foldback current control during device X2SON (4) power up and enabling. This functionality is especially Very Low Dropout: 125 mV at 300 mA (3.3 V ) OUT important in battery-operated devices. Accuracy: 1% (Typical), 1.4% (Maximum) The TLV743P provides an active pulldown circuit to Low I : 34 A Q quickly discharge output loads when the device is Available in Fixed-Output Voltages: disabled. 1 V to 3.3 V The TLV743P is available in standard DBV (SOT-23) High PSRR: 50 dB at 1 kHz and DQN (X2SON) packages. Active Output Discharge (1) Device Information PART NUMBER PACKAGE BODY SIZE (NOM) 2 Applications SOT-23 (5) 2.90 mm 1.60 mm Tablets TLV743P X2SON (4) 1.00 mm 1.00 mm Smartphones (1) For all available packages, see the package option addendum Notebook and Desktop Computers at the end of the data sheet. Portable Industrial and Consumer Products WLAN and Other PC Add-On Cards Camera Modules Typical Application Circuit Dropout Voltage vs Output Current 180 V = 3.3 V OUT IN OUT 160 V = 1.8 V OUT 140 TLV743P C COUT IN 120 EN GND Optional 100 ON 80 OFF 60 40 20 0 0 30 60 90 120 150 180 210 240 270 300 I (mA) OUT D020 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. V (mV) DO TLV743P SBVS310CJULY 2017REVISED JUNE 2019 www.ti.com Table of Contents 1 Features.................................................................. 1 8 Application and Implementation........................ 16 8.1 Application Information............................................ 16 2 Applications........................................................... 1 8.2 Typical Application.................................................. 18 3 Description............................................................. 1 9 Power Supply Recommendations...................... 19 4 Revision History..................................................... 2 10 Layout................................................................... 19 5 Pin Configuration and Functions......................... 4 10.1 Layout Guidelines................................................. 19 6 Specifications......................................................... 5 10.2 Layout Examples................................................... 19 6.1 Absolute Maximum Ratings...................................... 5 11 Device and Documentation Support................. 20 6.2 ESD Ratings.............................................................. 5 11.1 Device Support .................................................... 20 6.3 Recommended Operating Conditions....................... 5 11.2 Documentation Support........................................ 20 6.4 Thermal Information.................................................. 5 11.3 Receiving Notification of Documentation Updates 20 6.5 Electrical Characteristics........................................... 6 11.4 Community Resources.......................................... 20 6.6 Typical Characteristics.............................................. 8 11.5 Trademarks........................................................... 21 7 Detailed Description............................................ 13 11.6 Electrostatic Discharge Caution............................ 21 7.1 Overview................................................................. 13 11.7 Glossary................................................................ 21 7.2 Functional Block Diagram....................................... 13 12 Mechanical, Packaging, and Orderable 7.3 Feature Description................................................. 14 Information........................................................... 21 7.4 Device Functional Modes........................................ 15 4 Revision History Changes from Revision B (March 2018) to Revision C Page Changed description of EN pin in Pin Functions table........................................................................................................... 4 Deleted typical specification from V and V parameters ......................................................................................... 6 EN(HI) EN(LO) Added maximum specification to I parameter ................................................................................................................... 7 LIM Added condition to 1-V Load Regulation vs I and Temperature figure............................................................................. 8 OUT Added condition to 1.8-V Load Regulation vs I and Temperature figure.......................................................................... 8 OUT Added condition to 3.3-V Load Regulation vs I and Temperature figure ......................................................................... 8 OUT Added condition to 1.2-V Dropout Voltage vs I and Temperature figure ......................................................................... 9 OUT Added condition to 1.8-V Dropout Voltage vs I and Temperature figure ......................................................................... 9 OUT Added condition to 3.3-V Dropout Voltage vs I and Temperature figure ......................................................................... 9 OUT Added and Output Enable to title and changed first paragraph of Shutdown and Output Enable section.......................... 14 Added DBV package to Maximum Ambient Temperature vs Device Power Dissipation figure and text reference............. 17 Added (3) to Device Nomenclature table............................................................................................................................. 20 Changes from Revision A (January 2018) to Revision B Page Changed X2SON package from preview to production data (active) .................................................................................... 1 Changes from Original (July 2017) to Revision A Page Added X2SON package to Features list ................................................................................................................................ 1 Added DQN (X2SON) package to Description section ......................................................................................................... 1 Added X2SON package to Device Information table............................................................................................................. 1 Added DQN (X2SON) package pinout drawing and pin functions table to Pin Configuration and Functions section .......... 4 Deleted thermal pad from DBV pinout drawing and Pin Functions table .............................................................................. 4 Changed format of I/O column contents and order of packages in Pin Functions table ....................................................... 4 Added DQN (X2SON) thermal information to Thermal Information table ............................................................................. 5 Changed condition text for Figure 31 .................................................................................................................................. 17 2 Submit Documentation Feedback Copyright 20172019, Texas Instruments Incorporated Product Folder Links: TLV743P