Product Information

CES388,L3F

CES388,L3F electronic component of Toshiba

Datasheet
Schottky Diodes & Rectifiers SM Sig Schotky Diode 40 VR 0.1A 1 Circuit

Manufacturer: Toshiba
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

8000: USD 0.0272 ea
Line Total: USD 217.6

0 - Global Stock
MOQ: 8000  Multiples: 1
Pack Size: 1
Availability Price Quantity
0 - WHS 1


Ships to you between Thu. 23 May to Wed. 29 May

MOQ : 8000
Multiples : 8000

Stock Image

CES388,L3F
Toshiba

8000 : USD 0.0352
16000 : USD 0.0347
24000 : USD 0.0344
40000 : USD 0.0341
48000 : USD 0.0338
80000 : USD 0.0334
200000 : USD 0.0331
400000 : USD 0.0327
2000000 : USD 0.0324

0 - WHS 2


Ships to you between Wed. 29 May to Fri. 31 May

MOQ : 1
Multiples : 1

Stock Image

CES388,L3F
Toshiba

1 : USD 0.3592
10 : USD 0.2822
100 : USD 0.0551
1000 : USD 0.0287
2500 : USD 0.0267
8000 : USD 0.0216
48000 : USD 0.0216
96000 : USD 0.0195

     
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Product
Mounting Style
Package / Case
Technology
If - Forward Current
Vrrm - Repetitive Reverse Voltage
Ifsm - Forward Surge Current
Series
Packaging
Brand
Forward Continuous Current
Max Surge Current
Peak Reverse Voltage
Factory Pack Quantity :
Cnhts
Hts Code
Mxhts
Product Type
Subcategory
Taric
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CES388 Schottky Barrier Diode Silicon Epitaxial CES388CES388CES388CES388 1. 1. 1. 1. ApplicationsApplicationsApplicationsApplications High-Speed Switching 2. 2. FeaturesFeatures 2. 2. FeaturesFeatures (1) Low forward voltage : V = 0.54 V (typ). F(3) (2) Low reverse current : I = 1 A (max). R(1) (3) Small and compact ESC package, equivalent to SOD-523 and SC-79 packages. 3. 3. 3. 3. Packaging and Internal CircuitPackaging and Internal CircuitPackaging and Internal CircuitPackaging and Internal Circuit 1: Cathode 2: Anode ESC Start of commercial production 2011-10 2014-04-07 1 Rev.2.0CES388 4. 4. 4. 4. Absolute Maximum Ratings (Note) (Unless otherwise specified, TAbsolute Maximum Ratings (Note) (Unless otherwise specified, TAbsolute Maximum Ratings (Note) (Unless otherwise specified, TAbsolute Maximum Ratings (Note) (Unless otherwise specified, T = 25 = 25 = 25 = 25)))) aaaa Characteristics Symbol Note Rating Unit Peak reverse voltage V 45 V RM Reverse voltage V 40 R Peak forward current I 300 mA FM Average rectified current I 100 O Non-repetitive peak forward surge current I (Note 1) 1 A FSM Power dissipation P (Note 2) 150 mW D Junction temperature T 125 j Storage temperature T -55 to 125 stg Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook Handling PrecautionDerating Concept and Method) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Note 1: Measured with a 10ms pulse. Note 2: Mounted on a glass-epoxy circuit board of 20 mm 20 mm, Pad dimension of 4 mm 4 mm. 5. 5. 5. 5. Electrical Characteristics (Unless otherwise specified, TElectrical Characteristics (Unless otherwise specified, TElectrical Characteristics (Unless otherwise specified, TElectrical Characteristics (Unless otherwise specified, T = 25 = 25 = 25 = 25)))) aaaa Characteristics Symbol Test Condition Min Typ. Max Unit Forward voltage V I = 1 mA 0.21 V F(1) F V I = 10 mA 0.30 F(2) F V I = 100 mA 0.54 0.60 F(3) F Reverse current I V = 10 V 1 A R(1) R I V = 40 V 5 R(2) R Total capacitance C V = 0 V, f = 1 MHz 11 25 pF t R 6. Marking 6. 6. 6. MarkingMarkingMarking Fig. Fig. Fig. Fig. 6.16.16.16.1 MarkingMarkingMarkingMarking Marking Code Part Number R3 CES388 7. 7. Usage ConsiderationsUsage Considerations 7. 7. Usage ConsiderationsUsage Considerations Schottky barrier diodes (SBDs) have reverse leakage greater than other types of diodes. This makes SBDs more susceptible to thermal runaway under high-temperature and high-voltage conditions. Thus, both forward and reverse power losses of SBDs should be considered for thermal and safety design. 2014-04-07 2 Rev.2.0

Tariff Desc

8541.10.00 15 No - Diodes, other than photosensitive or light emitting diodes Free
Toshiba Memory
Toshiba Memory Corporation
Toshiba Semiconductor and Storage
TOSHIBA SEMICONDUCTORS
TS4

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