CMG03(TE12L,Q,M)

CRG03 TOSHIBA Rectifier Silicon Diffused Type CRG03 General Purpose Rectifier Applications Unit: mm Average forward current: I = 1.0 A F (AV) Repetitive peak reverse voltage: V = 400 V RRM Suitable for compact assembly due to small surface-mount package TM SFLAT (Toshiba package name) Absolute Maximum Ratings (Ta = 25C) Characteristics Symbol Rating Unit Repetitive Peak Reverse Voltage V 400 V RRM Average Forward Current I 1.0Note A F (AV) 15.0 (50Hz) Peak One Cycle Surge Forward I A FSM Current (NonRepetitive) 16.5 (60Hz) Junction Temperature T 40~150 C j Storage Temperature Range T 40~150 C stg JEDEC Note: 1 Ta = 56C JEITA Device mounted on a ceramic board board size: 50 mm 50 mm TOSHIBA 3-2A1A soldering land: 2 mm 2 mm Weight: 0.013 g (typ.) board thickness 0.64t Note 2: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (Handling Precautions/Derating Concept and Methods) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Electrical Characteristics (Ta = 25C) Characteristics Symbol Test Condition Min Typ. MaxUnit V I = 0.1 A (Pulse test) 0.86 V FM(1) FM Peak forward voltage V I = 0.7 A (Pulse test) 0.97 1.1 V FM(2) FM V I = 1.0 A (Pulse test) 1.0 V FM(3) FM Repetitive peak reverse current I V = 400 V (Pulse test) 10 A RRM RRM Device mounted on a ceramic board Board size: 50 mm 50 mm 65 Soldering land: 2 mm 2 mm Board thickness: 0.64t R C/W th (j-a) Device mounted on a glass-epoxy Thermal resistance board Board size: 50 mm 50 mm 130 Soldering land: 6 mm 6 mm Board thickness: 1.6t R 20 C/W th (j-) 2006-11-06 1CRG03 Marking Abbreviation Code Part No. G3 CRG03 Standard Soldering Pad Unit: mm 1.2 1.2 2.8 Handling Precaution The absolute maximum ratings denote the absolute maximum ratings, which are rated values and must not be exceeded during operation, even for an instant. The following are the general derating methods that we recommend when you design a circuit with a device. VRRM: We recommend that the worst case voltage, including surge voltage, be no greater than 80% of the absolute maximum rating of VRRM for a DC circuit and be no greater than 50% of that of VRRM for an AC circuit. VRRM has a temperature coefficient of 0.1%/. Take this temperature coefficient into account designing a device at low temperature. IF(AV): We recommend that the worst case current be no greater than 80% of the absolute maximum rating of IF(AV). Carry out adequate heat design. If you cant design a circuit with excellent heat radiation, set the margin by using an allowable Tamax-IF (AV) curve. This rating specifies the non-repetitive peak current in one cycle of a 50-Hz sine wave, condition angle 180. Therefore, this is only applied for an abnormal operation, which seldom occurs during the lifespan of the device. We recommend that a device be used at a Tj of below 120 under the worst load and heat radiation conditions. Thermal resistance between junction and ambient fluctuates depending on the devices mounting condition. When using a device, design a circuit board and a soldering land size to match the appropriate thermal resistance value. Please refer to the Rectifiers databook for further information. 2006-11-06 2