Product Information

CUS10F30,H3F

CUS10F30,H3F electronic component of Toshiba

Datasheet
Schottky Diodes & Rectifiers 30V Vrrm 1.0A IF 20A .045V VFM

Manufacturer: Toshiba
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 0.0799 ea
Line Total: USD 0.08

5529 - Global Stock
Ships to you between
Fri. 17 May to Thu. 23 May
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
5529 - WHS 1


Ships to you between Fri. 17 May to Thu. 23 May

MOQ : 1
Multiples : 1

Stock Image

CUS10F30,H3F
Toshiba

1 : USD 0.0831
10 : USD 0.0661
100 : USD 0.0545
1000 : USD 0.0518
3000 : USD 0.0486
9000 : USD 0.0476
24000 : USD 0.0476
45000 : USD 0.0476

4840 - WHS 2


Ships to you between Fri. 17 May to Thu. 23 May

MOQ : 5
Multiples : 5

Stock Image

CUS10F30,H3F
Toshiba

5 : USD 0.1976
25 : USD 0.0806
100 : USD 0.0715
265 : USD 0.0611
725 : USD 0.0585

5529 - WHS 3


Ships to you between Fri. 17 May to Thu. 23 May

MOQ : 184
Multiples : 1

Stock Image

CUS10F30,H3F
Toshiba

184 : USD 0.0545
1000 : USD 0.0518
3000 : USD 0.0485
9000 : USD 0.0476

     
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Product
Mounting Style
Package / Case
Configuration
Technology
If - Forward Current
Vrrm - Repetitive Reverse Voltage
Vf - Forward Voltage
Ifsm - Forward Surge Current
Ir - Reverse Current
Minimum Operating Temperature
Maximum Operating Temperature
Series
Packaging
Brand
Cnhts
Hts Code
Mxhts
Product Type
Factory Pack Quantity :
Subcategory
Taric
Vr - Reverse Voltage
LoadingGif

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CUS10F30 Schottky Barrier Diode Silicon Epitaxial CUS10F30CUS10F30CUS10F30CUS10F30 1. 1. 1. 1. ApplicationsApplicationsApplicationsApplications High-Speed Switching 2. 2. FeaturesFeatures 2. 2. FeaturesFeatures (1) Low forward voltage: V = 0.43 V (typ.) F(3) (2) General-purpose USC package, equivalent to SOD-323 and SC-76 packages. 3. 3. 3. 3. Packaging and Internal CircuitPackaging and Internal CircuitPackaging and Internal CircuitPackaging and Internal Circuit 1: Cathode 2: Anode USC 4. 4. 4. 4. Absolute Maximum Ratings (Note) (Unless otherwise specified, TAbsolute Maximum Ratings (Note) (Unless otherwise specified, TAbsolute Maximum Ratings (Note) (Unless otherwise specified, TAbsolute Maximum Ratings (Note) (Unless otherwise specified, T = 25 = 25 = 25 = 25)))) aaaa Characteristics Symbol Note Rating Unit Reverse voltage V 30 V R Average rectified current I (Note 1) 1 A O Non-repetitive peak forward surge current I (Note 2) 5 FSM Junction temperature T 125 j Storage temperature T -55 to 125 stg Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook Handling PrecautionDerating Concept and Method) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Note 1: Mounted on a ceramic circuit board of 25 mm 25 mm, Pad dimension of 2 mm 2 mm. Note 2: Measured with a 10 ms pulse. Start of commercial production 2010-12 2014-04-14 1 Rev.5.0CUS10F30 5. 5. 5. 5. Electrical Characteristics (Unless otherwise specified, TElectrical Characteristics (Unless otherwise specified, TElectrical Characteristics (Unless otherwise specified, TElectrical Characteristics (Unless otherwise specified, T = 25 = 25 = 25 = 25)))) aaaa Characteristics Symbol Note Test Condition Min Typ. Max Unit Forward voltage V I = 10 mA 0.22 V F(1) F V I = 100 mA 0.28 F(2) F V I = 1 A 0.43 0.5 F(3) F Reverse current I V = 30 V 50 A R(1) R Total capacitance C V = 0 V, f = 1 MHz 170 pF t R 6. 6. MarkingMarking 6. 6. MarkingMarking Fig. Fig. Fig. Fig. 6.16.16.16.1 MarkingMarkingMarkingMarking Marking Code Part Number FR CUS10F30 7. 7. Usage ConsiderationsUsage Considerations 7. 7. Usage ConsiderationsUsage Considerations Schottky barrier diodes (SBDs) have reverse leakage greater than other types of diodes. This makes SBDs more susceptible to thermal runaway under high-temperature and high-voltage conditions. Thus, both forward and reverse power losses of SBDs should be considered for thermal and safety design. 8. 8. 8. 8. Land Pattern Dimensions for Reference OnlyLand Pattern Dimensions for Reference OnlyLand Pattern Dimensions for Reference OnlyLand Pattern Dimensions for Reference Only Fig. Fig. Fig. Fig. 8.18.18.18.1 Land Pattern Dimensions for Reference Only (Unit: mm)Land Pattern Dimensions for Reference Only (Unit: mm)Land Pattern Dimensions for Reference Only (Unit: mm)Land Pattern Dimensions for Reference Only (Unit: mm) 2014-04-14 2 Rev.5.0

Tariff Desc

8541.10.00 15 No - Diodes, other than photosensitive or light emitting diodes Free
Toshiba Memory
Toshiba Memory Corporation
Toshiba Semiconductor and Storage
TOSHIBA SEMICONDUCTORS
TS4

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