Product Information

GT60J323(Q)

GT60J323(Q) electronic component of Toshiba

Datasheet
Trans IGBT Chip N-CH 600V 60A 3-Pin(3+Tab) TO-3P(LH)

Manufacturer: Toshiba
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

3: USD 10.0825 ea
Line Total: USD 30.25

0 - Global Stock
MOQ: 3  Multiples: 1
Pack Size: 1
Availability Price Quantity
0 - WHS 1


Ships to you between Mon. 20 May to Fri. 24 May

MOQ : 3
Multiples : 1

Stock Image

GT60J323(Q)
Toshiba

3 : USD 10.0825

     
Manufacturer
Product Category
Configuration
Continuous Collector Current at 25 C
Maximum Operating Temperature
Collector Current Dc Max
Collector-Emitter Voltage
Mounting
Package Type
Pin Count
Operating Temperature Min
Operating Temperature Classification
Channel Type
Gate To Emitter Voltage Max
Rad Hardened
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GT60J323 TOSHIBA Insulated Gate Bipolar Transistor Silicon N Channel IGBT GT60J323 Current Resonance Inverter Switching Application Unit: mm Enhancement mode type High speed : t = 0.16 s (typ.) (I = 60A) f C Low saturation voltage: V = 1.9 V (typ.) (I = 60A) CE (sat) C FRD included between emitter and collector Fourth generation IGBT TO-3P(LH) (Toshiba package name) Absolute Maximum Ratings (Ta = 25C) Characteristics Symbol Rating Unit Collector-emitter voltage V 600 V CES Gate-emitter voltage V 25 V GES @ Tc = 100C 33 Continuous collector I A C current @ Tc = 25C 60 Pulsed collector current I 120 A CP DC I 30 F Diode forward current A JEDEC Pulsed I 120 FP @ Tc = 100C 68 JEITA Collector power P W C dissipation @ Tc = 25C 170 TOSHIBA 2-21F2C Junction temperature T 150 C j Weight: 9.75 g (typ.) Storage temperature range T 55 to 150 C stg Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (Handling Precautions/Derating Concept and Methods) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Thermal Characteristics Characteristics Symbol Max Unit Thermal resistance (IGBT) R 0.74 C/W th (j-c) Thermal resistance (diode) R 1.56 C/W th (j-c) Equivalent Circuit Marking Collector Part No. (or abbreviation code) TOSHIBA GT60J323 Gate Lot No. JAPAN Emitter A line indicates lead (Pb)-free package or lead (Pb)-free finish. 1 2006-11-01 GT60J323 Electrical Characteristics (Ta = 25C) Characteristics Symbol Test Condition Min Typ. MaxUnit Gate leakage current I V = 25 V, V = 0 500 nA GES GE CE Collector cut-off current I V = 600 V, V = 0 1.0 mA CES CE GE Gate-emitter cut-off voltage V I = 60 mA, V = 5 V 3.0 6.0 V GE (OFF) C CE Collector-emitter saturation voltage V I = 60 A, V = 15 V 1.9 2.5 V CE (sat) C GE Input capacitance C V = 10 V, V = 0, f = 1 MHz 4800 pF ies CE GE t 0.17 Rise time Resistive Load r Turn-on time t V = 300 V, I = 60 A 0.23 CC C on Switching time s V = 15 V, R = 30 Fall time t GG G 0.16 0.26 f (Note 1) Turn-off time t 0.41 off Diode forward voltage V I = 30 A, V = 0 1.4 2.0 V F F GE Reverse recovery time t I = 30 A, di/dt = 100 A/s 0.1 0.2 s rr F Note 1: Switching time measurement circuit and input/output waveforms V GE 90% 10% 0 R G R L I C 0 90% 90% V CC V 10% 10% CE 0 t d (off) t f t r t t off on 2 2006-11-01

Tariff Desc

8541.21.00 16 No - - With a dissipation rate of less than 1 W Free

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