TCK101G/102G TOSHIBA CMOS Linear Integrated Circuit Silicon Monolithic TCK101G, TCK102G 1A Load Switch IC with Slew Rate Control Driver The TCK101G and TCK102G are load switch ICs for power management with slew rate control driver featuring wide input voltage operation from 1.1 to 5.5 V. Switch ON resistance is only 55 m typical at 3.3 V, 500 mA load condition and these feature a slew rate control driver and thermal shutdown. TCK101G has output auto-discharge function. Maximum Output current type is available up to 1 .0A (DC). This device is available in 0.4 mm pitch ultra small package WCSP6B (0.8 mm x 1.2 mm, t: 0.64 mm (max)). Thus this device is ideal for portable applications that require high-density board WCSP6B assembly such as cellular phone. Weight: 1 mg (typ.) Feature Wide input voltage operation: V = 1.1 to 5.5 V IN Low ON resistance : R = 50 m (typ.) at V = 5.0 V, 500 mA ON IN R = 55 m (typ.) at V = 3.3 V, 500 mA ON IN R = 75 m (typ.) at V = 1.8 V, 500 mA ON IN R = 120 m (typ.) at V = 1.2 V, 500 mA ON IN Low Quiescent Current: I = 8 A (typ.) at V = V = 5.5 V, I = 0 mA Q IN CT OUT Low standby current: I = 0.07 A (typ.) at OFF state Q(OFF) Inrush current reduction circuit Thermal Shutdown function Auto-discharge (TCK101G) Pull down connection between CONTROL and GND Ultra small package : WCSP6B (0.8mm x 1.2mm, t: 0.64mm(max)) Start of commercial production 2012-08 1 2014-03-01 TCK101G/102G Absolute Maximum Ratings (Ta = 25C) Characteristics Symbol Rating Unit Input voltage V -0.3 to 6.0 V IN Control voltage V -0.3 to 6.0 V CT Output voltage V -0.3 to V +0.3 V OUT IN Output current I DC 1.0 A OUT Power dissipation P 800 (Note 1) mW D Operating temperature range T 40 to 85 C opr Junction temeperature Tj 150 C Storage temperature T 55 to 150 C stg Note : Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings and the operating ranges. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (Handling Precautions/Derating Concept and Methods) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Note1: Rating at mounting on a board (Glass epoxy board dimension : 40mm x 40mm, both sides of board Metal pattern ratio : a surface approximately 50%, the reverse side approximately 50% Through hole: diameter 0.5mm x 28) Pin Assignment(Top view) Top marking 1 2 Index A A1: V OUT Lot trace code B1: V OUT C1: GND B P: TCK101G A2: V IN R: TCK102G B2: V IN C2: CONTROL C 2 2014-03-01