Product Information

THGAF8T1T83BAIR

THGAF8T1T83BAIR electronic component of Toshiba

Datasheet
Universal Flash Storage (UFS) 256GB 1166MB/s Gen 6 UFS 2.1

Manufacturer: Toshiba
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



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N/A

Obsolete
Availability Price Quantity
0 - Global Stock

MOQ : 1
Multiples : 1
1 : USD 136.3635
10 : USD 122.7555
25 : USD 120.0679
N/A

Obsolete
     
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RoHS - XON
Icon ROHS
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NAND FLASH MEMORY UFS Universal Flash Storage High Performance Mass Storage Toshibas Flash memories with an integrated controller provide error correction, wear leveling, bad-block CAPACITIES management, etc. They have an interface compliant with JEDEC/UFS Version 2.1, eliminating the need for users to 32 64 128 256 perform NAND-specific control. The new full duplex serial GB GB GB GB high speed interface offers superior performance. FEATURES ADVANTAGES BENEFITS APPLICATIONS 32 GB 256 GB High speed up to 1160 MB/sec Easy to integrate storage solution Consumer Electronics TM BiCS Flash Technology Managed memory due to established standards Multimedia Applications (3D NAND) Cost efficient design in Package, interface, features, Industrial Applications Conforms to JEDEC Version 2.1 commands etc. are standard Optimal relation between price, density and performance Integrated memory Utilizing high quality Toshiba TM management: BiCS Flash memory in combi- Reliable storage solution based nation with a Toshiba origin on high quality NAND memory Error correction code developed controller and optimized controller Bad block management Produced in the worlds largest, Extended production capacity to Wear-leveling leading edge technology flash fulfil customers demand Garbage collection factory Standard temperature range 153 ball BGA FBGA package High Speed Serial interface SPECIFICATIONS FEATURES UFS UNIVERSAL FLASH STORAGE Density 32 GB 256 GB Technology BiCS 3D NAND JEDEC Version 2.1 (UniPro 1.6 / M-PHY 3.0) Temperature -25 C to 85 C 2 Package 153 ball FBGA (11.5 x 13 mm ) UFS PRODUCT LIST DENSITY PART NUMBER TECHNOLOGY JEDEC STANDARD TEMPERATURE PACKAGE 32 GB THGAF8G8T23BAIL BiCS 3D NAND JEDEC 2.1 -25 C to 85 C 153FBGA 11.5 x 13 64 GB THGAF8G9T43BAIR BiCS 3D NAND JEDEC 2.1 -25 C to 85 C 153FBGA 11.5 x 13 128 GB THGAF8T0T43BAIR BiCS 3D NAND JEDEC 2.1 -25 C to 85 C 153FBGA 11.5 x 13 256 GB THGAF8T1T83BAIR BiCS 3D NAND JEDEC 2.1 -25 C to 85 C 153FBGA 11.5 x 13 Copyright 2018 TOSHIBA Memory Corporation. Product specifications are all subject to change without notice. Product design specifications and colours are subject to change without notice and may vary from those shown. Errors and omissions excepted. global.toshiba-memory.com FAB 2018 11X-ON Electronics Largest Supplier of Electrical and Electronic Components Click to view similar products for Universal Flash Storage - UFS category: Click to view products by Toshiba manufacturer: Other Similar products are found below : SDINDDH6-16G-ZA SDINDDH6-32G-I SDINDDH6-64G-I

Tariff Desc

8542.32.00 33 No ..Memory cards (other than "smart" cards and SIMM), which incorporate E2PROM, SRAM, DRAM or flash memory (for example, for PCMCIA applications)
Toshiba Memory
Toshiba Memory Corporation
Toshiba Semiconductor and Storage
TOSHIBA SEMICONDUCTORS
TS4

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