TLP2766(F) Toshiba

TLP2766F Photocouplers GaAAs Infrared LED & Photo IC TLP2766FTLP2766FTLP2766FTLP2766F 1. 1. ApplicationsApplications 1. 1. ApplicationsApplications Factory Networking High-Speed Digital Interfacing for Instrumentation and Control Devices Plasma Display Panels (PDPs) 2. 2. 2. 2. GeneralGeneralGeneralGeneral The Toshiba TLP2766F consists of a high-output GaAAs light-emitting diode coupled with a high-speed photo- diode-transistor chip. The TLP2766 guarantees operation at up to 125 and on supplies from 2.7 V to 5.5 V. It is offered in the SDIP6 package. The TLP2766 has an internal Faraday shield that provides a guaranteed common- mode transient immunity of 20 kV/s. 3. 3. FeaturesFeatures 3. 3. FeaturesFeatures (1) Inverter logic type (Totem pole output) (2) Package: SDIP6 (3) Operating temperature: -40 to 125 (4) Supply voltage: 2.7 to 5.5 V (5) Data transfer rate: 20 MBd (typ.) (NRZ) (6) Threshold input current: 3.5 mA (max) (7) Supply current: 3 mA (max) (8) Common-mode transient immunity: 20 kV/s (min) (9) Isolation voltage: 5000 Vrms (min) (10) Safety standards UL-approved: UL1577, File No.E67349 cUL-approved: CSA Component Acceptance Service No.5A File No.E67349 (Note 1) VDE-approved: EN60747-5-5 (Note 1)(Note 1)(Note 1) Option (D4) Note 1: When an EN60747-5-5 approved type is needed, please designate the Option (D4)Option (D4)Option (D4). 4. 4. 4. 4. Packaging and Pin ConfigurationPackaging and Pin ConfigurationPackaging and Pin ConfigurationPackaging and Pin Configuration 1: Anode 2: N.C. 3: Cathode 4: GND 5: V (Output) O 6: V CC 11-5J101S 2016 Toshiba Corporation 2016-01-14 1 Rev.4.0TLP2766F 5. 5. 5. 5. Internal Circuit (Note)Internal Circuit (Note)Internal Circuit (Note)Internal Circuit (Note) Note: A 0.1F bypass capacitor must be connected between pin 6 and pin 4. 6. 6. 6. 6. Principle of OperationPrinciple of OperationPrinciple of OperationPrinciple of Operation 6.1. 6.1. Truth TableTruth Table 6.1. 6.1. Truth TableTruth Table Input LED M1 M2 Output H ON OFF ON L L OFF ON OFF H 6.2. 6.2. 6.2. 6.2. Mechanical ParametersMechanical ParametersMechanical ParametersMechanical Parameters 10.16-mm Pitch Characteristics Unit TLP2766F Creepage distances 8.0 (min) mm Clearance distances 8.0 (min) Internal isolation thickness 0.4 (min) 2016 Toshiba Corporation 2016-01-14 2 Rev.4.0