Other Busses STD SUBRACK 3U Subrack with 16-slot backplane (photo) 3U Subrack with 8 slot backplane (CCK13-HT8/90) CCK13-16/90 EXTENDER BOARD STD 3690-16 Length: 6.5 (165.1mm) Height: 4.5 (114.3mm) Contacts: 56 .125 Ctrs Ni/Gold o Current Rating: 5 amps at 10 F. rise Voltage Rating: 200 RMS or 300 VDC Material: FR4 Epoxy Glass 2 oz. Cu. BACKPLANES 8 and 16-slot Fully assembled and tested, Vector Backplanes for STD Bus applica- tions. 8 or 16-slot versions avail- able, connector spacing is on 0.75 centers. Ample positions for decoupling capacitors. Meets all STD Bus specifications, including interrupt priority lines. Featuring: Faraday shield lines reduce cross-talk Wiring pads on board to con nect RESET switch for front panel controls High reliability connectors with Specifications: gold/plated contacts and 10- Material: FR4 Epoxy Glass093 thick, UL94-V-0 compliant position power connector o Operating Temp.: 0 to 60 C Wago power blocks o Storage: -20 to 60 C Rel. Humidity: 0-95%, non condensing Dimensions Connector Accessories Part No. Description Width Length Thickness Spacing Plugbord Series Extender Card Racks/Enclosure 4610-8-1A 8-slot assembled 4.35 7.00 1/16 .750 4610 Series 3690-16 CCK 13 Series 4610-16-1A 16-slot assembled 4.35 13.00 1/16 .750 4610 Series 3690-16 CCK 13 Series Specifications subject to change without notice. ELECTRONIC COMPANY Other BusesOther Buses Prototyping Boards STD Bus 4610 STD Circuit Pattern: 3-Hole Solder Pad Contacts: 28/56 .125 Ctrs, I/O mounting area for ribbon Ni/Gold cable header Solder pads on wiring side: Width/Thick: 6.5 /.062 component side has contacts Height: 4.5 only 16-Pin DIP Capacity: 20 Layout paper and instructions Material: CEM-1 included V/G Terminals: T44, T46, T49, T68 Pad and bus surfaces solder- Wire-Wrap Socket Pins: R32 coated for user convenience Extender: 3690-16 Solder Connector: R656-1 Wire-Wrap Connector: R656 Rec. Card Cage: Series 13 Hole Diameter: .042 4610-1 STD Circuit Pattern: Contacts Only Contacts: 28/56 .125 Ctrs, Ni/Gold Unrestricted component Width/Thick: 6.5 /.062 placement over entire board Height: 4.5 surface 16-Pin DIP Capacity: 59 Layout paper and instructions included Material: CEM-1 Wire-Wrap Terminals: T44, T46, T49, T68 Wire-Wrap Socket Pins: R32 Solder Connector: R656-1 Extender: 3690-16 Rec. Card Cage: Series 13 Wire-Wrap Connector: R656 Hole Diameter: .042 4610-2 STD Circuit Pattern: Interleaved Buses Contacts: 28/56 .125 Ctrs, Ni/Gold Width/Thick: 9.6 /.062 Power and ground buses on wiring side only, component side Height: 4.5 has contacts only 16-Pin DIP Capacity: 35 I/O mounting area for ribbon Material: CEM-1 cable connector Wire-Wrap Terminals: T44, T46, T49, T68 Layout paper and instructions Wire-Wrap Socket Pins: R32 included Solder Connector: R656-1 Extender: 3690-16 Rec. Card Cage: Series 13 Wire-Wrap Connector: R656 Hole Diameter: .042 4610-3 STD Circuit Pattern: Pad-Per-Hole Contacts: 28/56 .125 Ctrs Layout paper and instructions Ni/Gold included Width/Thick: 6.5 /.062 Row and column legends Height: 4.5 w provided 0.042 plated -thru holes on 16-Pin DIP Capacity: 52 on 0.1 grid Material: FR4 Epoxy Glass V/G Terminals: T44, T46, T49, T68 Socket Pins: R32 Solder Connector: R656-1 Extender: 3690-16 Rec. Card Cage: Series 13 Wire-Wrap Connector: R656 Hole Diameter: .042 11115 Vanowen St., North Hollywood, CA 91605 Phone(818)985-8208 Fax(818)985-7708 Toll-Free (800) 423-5659 Web site: