333 3 PHP www.vishay.com Vishay Dale Thin Film High Power Thin Film Wraparound Chip Resistor FEATURES High purity ceramic substrate Power rating to 2.5 W Resistance range 10 to 30.1 k Resistor tolerance to 0.1 % TCR to 25 ppm/C Flame resistant UL 94 V-0 APPLICATIONS ADDITIONAL RESOURCES Power supplies Power switching Braking system 3D Models Test and measurement equipment PHP series chip resistors are designed with enlarged Motor deflection circuits backside terminations to reduce the thermal resistanc e TYPICAL PERFORMANCE between the topside resistor layer and the solder joint on the end users circuit board. ABSOLUTE Actual power handling capability is limited by the end user mounting process. As with any high power chip resistor the TCR 25 ability to remove the generated heat is critical to the overall TOL. 0.1 performance of the device. STANDARD ELECTRICAL SPECIFICATIONS TEST SPECIFICATIONS CONDITIONS Material Nichrome - Resistance Range 10 to 30.1 k - 25 ppm/C, 50 ppm/C (standard) TCR: Absolute -55 C to +125 C and, 100 ppm/C Tolerance: Absolute 0.1 %, 0.5 %, 1.0 % and, 5.0 % +25 C (1) Power Rating: Resistor 0.375 W - 2.5 W Maximum at +70 C Stability: Absolute R 0.1 % 2000 h at +70 C Stability: Ratio Not applicable - Voltage Coefficient < 0.1 ppm/V - Working Voltage 75 V to 200 V - Operating Temperature Range -55 C to +155 C - Storage Temperature Range -55 C to +155 C - Noise < -30 dB - Shelf Life Stability: Absolute 0.01 % 1 year at +25 C COMPONENT RATINGS CASE SIZE POWER RATING (mW) WORKING VOLTAGE (V) RESISTANCE RANGE () (1) 0603 375 75 10 to 30.1K (1) 0805 625 100 10 to 30.1K (1) 1206 1000 200 10 to 30.1K (1) 2512 2500 200 10 to 30.1K Note (1) Dependent on component mounting by user ENVIRONMENTAL TESTS (Vishay Performance vs. MIL-PRF-55342 Requirements) LIMITS MIL-PRF-55342 ENVIRONMENTAL TEST TYPICAL VISHAY PERFORMANCE CHARACTERISTIC E Resistance Temperature Characteristic 25 ppm/C 15 ppm/C Maximum Ambient Temperature at Rated Wattage +70 C +70 C Maximum Ambient Temperature at Power Derating +150 C +150 C Thermal Shock 0.1 % 0.04 % Low Temperature Operation 0.1 % 0.001 % Short Time Overload 0.1 % 0.003 % High Temperature Exposure 0.1 % 0.030 % Resistance to Soldering Heat 0.2 % 0.007 % Moisture Resistance 0.2 % 0.002 % Life at +70 C for 2000 h 0.5 % 0.100 % Revision: 23-Oct-2019 Document Number: 60076 1 For technical questions, contact: thinfilm vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc 91000 DDD D PHP www.vishay.com Vishay Dale Thin Film DIMENSIONS in inches D W T E L WIDTH THICKNESS TOP PAD BOTTOM PAD CASE SIZE LENGTH W ( 0.005) MIN./MAX. D ( 0.005) E ( 0.005) 0603 0.064 0.006 0.032 0.020 max. 0.012 0.021 0805 0.080 0.006 0.050 0.015/0.033 0.016 0.025 1206 0.126 0.008 0.063 0.015/0.033 0.020 + 0.005/- 0.010 0.040 2512 0.259 + 0.009/- 0.015 0.124 0.015/0.033 0.02 0.050 LAND PATTERN DIMENSIONS in inches 0603 Land Pattern 1206 Land Pattern 0.0920 0.1730 0.0340 0.0710 0.0140 0.0390 0.0220 0.0755 0805 Land Pattern 2512 Land Pattern 0.1050 0.2910 0.0520 0.1260 0.0200 0.0425 0.1090 0.0910 STANDARD MATERIAL SPECIFICATIONS Resistive Element Nichrome Substrate Material Alumina (Al O ) 2 3 Terminations (Tin/Lead) Tin/lead solder over nickel barrier Terminations (Lead (Pb)-free) Tin/silver/copper (Sn96.5Ag3.0Cu0.5) solder over nickel barrier Revision: 23-Oct-2019 Document Number: 60076 2 For technical questions, contact: thinfilm vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc 91000