New Product SiSA10DN Vishay Siliconix N-Channel 30 V (D-S) MOSFET FEATURES PRODUCT SUMMARY TrenchFET Gen IV Power MOSFET a, g V (V) R () (Max.) Q (Typ.) I (A) DS DS(on) g D 100 % R and UIS Tested g 0.0037 at V = 10 V 30 GS Material categorization: 30 15.4 nC 0.0050 at V = 4.5 V 30 For definitions of compliance please see GS www.vishay.com/doc 99912 PowerPAK 1212-8 APPLICATIONS D High Power Density DC/DC Synchronous Rectification S 3.30 mm 3.30 mm VRMs and Embedded DC/DC 1 S 2 S 3 G G 4 D 8 D 7 D S 6 D 5 N-Channel MOSFET Bottom View Ordering Information: SiSA10DN-T1-GE3 (Lead (Pb)-free and Halogen-free) ABSOLUTE MAXIMUM RATINGS (T = 25 C, unless otherwise noted) A Parameter Symbol LimitUnit Drain-Source Voltage V 30 DS V V Gate-Source Voltage + 20, - 16 GS g T = 25 C C 30 g T = 70 C C 30 Continuous Drain Current (T = 150 C) I J D b, c T = 25 C A 25 b, c T = 70 C A 20 A I Pulsed Drain Current (t = 300 s) DM 80 g T = 25 C C 30 Continuous Source-Drain Diode Current I S b, c T = 25 C A 3 I Single Pulse Avalanche Current 20 AS L = 0.1 mH E mJ Single Pulse Avalanche Energy 20 AS T = 25 C 39 C T = 70 C 25 C Maximum Power Dissipation P W D b, c T = 25 C A 3.6 b, c T = 70 C A 2.4 T , T Operating Junction and Storage Temperature Range - 55 to 150 J stg C d, e Soldering Recommendations (Peak Temperature) 260 THERMAL RESISTANCE RATINGS Parameter Symbol TypicalMaximumUnit b, f t 10 s R 26 34 Maximum Junction-to-Ambient thJA C/W Maximum Junction-to-Case (Drain) Steady State R 2.4 3.2 thJC Notes: a. Based on T = 25 C. C b. Surface mounted on 1 x 1 FR4 board. c. t = 10 s. d. See solder profile (www.vishay.com/doc 73257). The PowerPAK 1212-8 is a leadless package. The end of the lead terminal is exposed copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not required to ensure adequate bottom side solder interconnection. e. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components. f. Maximum under steady state conditions is 81 C/W. g. Package limited. Document Number: 63819 For technical support, please contact: pmostechsupport vishay.com www.vishay.com S12-0806-Rev. A, 16-Apr-12 1 This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc 91000New Product SiSA10DN Vishay Siliconix SPECIFICATIONS (T = 25 C, unless otherwise noted) J Parameter Symbol Test Conditions Min. Typ.Max.Unit Static Drain-Source Breakdown Voltage V V = 0 V, I = 250 A 30 V DS GS D V Temperature Coefficient V /T 17 DS DS J I = 250 A mV/C D V Temperature Coefficient V /T - 5 GS(th) GS(th) J V V = V , I = 250 A Gate-Source Threshold Voltage 1.1 2.2 V GS(th) DS GS D I V = 0 V, V = + 20, - 16 V Gate-Source Leakage 100 nA GSS DS GS V = 30 V, V = 0 V 1 DS GS I Zero Gate Voltage Drain Current A DSS V = 30 V, V = 0 V, T = 55 C 10 DS GS J a I V 5 V, V = 10 V 25 A On-State Drain Current D(on) DS GS V = 10 V, I = 10 A 0.0028 0.0037 GS D a R Drain-Source On-State Resistance DS(on) V = 4.5 V, I = 7 A 0.0041 0.0050 GS D a g V = 10 V, I = 10 A 52 S Forward Transconductance fs DS D b Dynamic C Input Capacitance 2425 iss C Output Capacitance 730 pF oss V = 15 V, V = 0 V, f = 1 MHz DS GS C Reverse Transfer Capacitance 65 rss C /C Ratio 0.027 0.054 rss iss V = 15 V, V = 10 V, I = 10 A 34 51 DS GS D Q Total Gate Charge g 15.4 23.1 Q V = 15 V, V = 4.5 V, I = 10 A Gate-Source Charge 5.8 nC gs DS GS D Q Gate-Drain Charge 2.6 gd Output Charge Q V = 15 V, V = 0 V 20 oss DS GS R Gate Resistance f = 1 MHz 0.3 1.7 3.4 g t Turn-On Delay Time 10 20 d(on) Rise Time t 10 20 r V = 15 V, R = 1.5 DD L I 10 A, V = 10 V, R = 1 t Turn-Off Delay Time D GEN g 27 50 d(off) Fall Time t 10 20 f ns t Turn-On Delay Time 20 40 d(on) t Rise Time V = 15 V, R = 1.5 15 30 r DD L I 10 A, V = 4.5 V, R = 1 Turn-Off Delay Time t 25 50 D GEN g d(off) t Fall Time 10 20 f Drain-Source Body Diode Characteristics I T = 25 C Continuous Source-Drain Diode Current 30 S C A a I 80 Pulse Diode Forward Current SM Body Diode Voltage V I = 10 A 0.8 1.2 V SD S t Body Diode Reverse Recovery Time 31 62 ns rr Q Body Diode Reverse Recovery Charge I = 10 A, dI/dt = 100 A/s, 19 40 nC rr F T = 25 C t Reverse Recovery Fall Time J 14 a ns t Reverse Recovery Rise Time 17 b Notes: a. Pulse test pulse width 300 s, duty cycle 2 %. b. Guaranteed by design, not subject to production testing. Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. www.vishay.com For technical support, please contact: pmostechsupport vishay.com Document Number: 63819 2 S12-0806-Rev. A, 16-Apr-12 This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc 91000