VA10800-CQ12803ECA Vorago

VA10800-CQ12803ECA electronic component of Vorago
VA10800-CQ12803ECA Vorago
VA10800-CQ12803ECA ARM Microcontrollers - MCU
VA10800-CQ12803ECA  Semiconductors
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X-On Electronics has gained recognition as a prominent supplier of VA10800-CQ12803ECA ARM Microcontrollers - MCU across the USA, India, Europe, Australia, and various other global locations. VA10800-CQ12803ECA ARM Microcontrollers - MCU are a product manufactured by Vorago. We provide cost-effective solutions for ARM Microcontrollers - MCU, ensuring timely deliveries around the world.

Part No. VA10800-CQ12803ECA
Manufacturer: Vorago
Category: ARM Microcontrollers - MCU
Description: ARM Microcontrollers - MCU VA10800 - ARM Cortex M0 MCU
Datasheet: VA10800-CQ12803ECA Datasheet (PDF)
Price (USD)
1: USD 1031.4439 ea
Line Total: USD 1031.44 
Availability : 0
  
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1$ 1031.4439

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5$ 1841.6625


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5$ 1742.213


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1$ 1903.935


Availability 0
Ship by Fri. 08 Aug to Thu. 14 Aug
MOQ : 1
Multiples : 1
QtyUnit Price
1$ 1073.832


Availability 0
Ship by Fri. 08 Aug to Thu. 14 Aug
MOQ : 1
Multiples : 1
QtyUnit Price
1$ 1031.4439

   
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We are delighted to provide the VA10800-CQ12803ECA from our ARM Microcontrollers - MCU category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the VA10800-CQ12803ECA and other electronic components in the ARM Microcontrollers - MCU category and beyond.

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VA10800 VA10800 6.4.2 Leakage Current non-I2C pads 24 Table of Contents 6.4.3 VOL, VOH non-I2C pads ....... 24 6.4.4 I2C Pads .................................. 25 1 Functional Description ....................... 4 6.4.5 Input Leakage Current and 1.1 Related Documentation ................... 4 Output Voltage I2C Pads ...................... 25 1.2 Feature Summary ............................. 4 6.5 DC Operating Current 1.3 Power-Up Sequence ......................... 8 Consumption .............................................. 26 1.4 Power-Up and Reset Behavior of 6.5.1 Typical Operating Current pins 8 Curves 27 1.5 Other Resets ..................................... 8 6.6 DC Standby Current Consumption 1.6 Support for in system programming 28 of the SPI ROM ............................................ 9 2 6.7 Internal Weak Pull-up/Pull-down.. 28 1.7 I C pins .............................................. 9 6.8 128 pin QFP Pin Capacitance ...... 29 1.8 eFuse Writing ................................. 10 7 AC Electrical Characteristics ........... 30 2 Block Diagram ................................. 11 7.1 AC Timing Conditions .................... 30 3 Pin Descriptions ................................ 12 7.1.1 Output delay derating for loads 30 4 Package Options ............................. 14 7.2 Internal Nominal 1 MHz Oscillator 4.1 128 Pin Plastic LQFP ...................... 14 31 4.2 128 Pin Ceramic LQFP .................. 15 7.3 Clock Signal .................................... 31 5 Die Options ...................................... 16 7.4 GPIO PORTA/PORTB..................... 31 2 5.1 Table of Die Pad Coordinates from 7.5 I C pins ............................................ 32 Center of Die in Microns .......................... 16 2 7.5.1 I C Pin Timing ............................... 34 5.2 Pad Layout with Marking in Upper 7.6 SPI ROM.......................................... 35 Left Corner of Die ...................................... 20 7.7 JTAG ................................................ 37 6 Ratings Tables .................................. 21 8 Thermal Characteristics ................... 38 6.1 Absolute Maximum Ratings .......... 21 9 Electrostatic Discharge (ESD) 6.2 Recommended Supply Operating Protection Charcteristics ......................... 39 Condition .................................................... 21 6.3 Recommended Supply Conditions 10 Package Mechanical Information 21 40 6.4 Signal Pads Operating Conditions 10.1 128 Pin Plastic LQFP Nominal 23 Package Dimensions (mm) ....................... 40 2 6.4.1 Non- I C Pads .......................... 23 www.voragotech.com Rev2.1 page 1 VA10800 VA10800 10.2 128 Pin Ceramic LQFP Nominal Package Dimensions (mm) ....................... 41 11 Ordering Information .................. 42 9.1 Part Marking ....................................... 42 12 Development kit Ordering Information .............................................. 42 13 Errata ............................................. 43 14 Revision History ............................ 44 www.voragotech.com Rev2.1 page 2

Tariff Desc

8542.31.00 52 No ..CMOS and MOS Microprocessors (MPU), Microcontrollers (MCU) and Digital Signal Processors (DSP)

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits Digital.
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