Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 2 Surface Mount Heat Sinks D PAK, TO-220, SOT-223, SOL-20 217 SERIES Compatible with surface mount technology (SMT) automated production techniques for ease of assembly and a vari- ety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area, increas- ing the power dissipation of surface mount devices (SMDs) while maintaining and improving manufacturers component thermal specifications. FEATURES AND BENEFITS: No interface material is needed Copper with matte tin plating for improved solderability and assembly Both the component and the heat sink are installed on the PC-board utilizing standard SMT assembly equipment for Tape & Reel and Tube formats EIA standards and ESD protection are specified Can be used with water soluble or no clean SMT solder creams or other pastes Height Above Footprint Thermal Performance at Typical Load Standard PC Board Dimensions Package Package Natural Forced P/N in. (mm) in. (mm) Format Quantity Convection Convection) 217-36CTE6 .360 (9.1) .600 (15.2) x .740 (18.8) Bulk 1 55C 1W 16.0C/W 200 LFM 217-36CTTE6 .360 (9.1) .600 (15.2) x .740 (18.8) Tube 20 55C 1W 16.0C/W 200 LFM 217-36CTRE6 .360 (9.1) .600 (15.2) x .740 (18.8) Tape & Reel 250 55C 1W 16.0C/W 200 LFM Material: Copper, Matte Tin Plated MECHANICAL DIMENSIONS 217 HEAT SINK WITH THERMAL PERFORMANCE DDPAK DEVICE 6 LAYER BOARD, D PAK 125C LEAD, 40C AMBIENT 217-36CT6 Device Power Dissipation. W KEY: Device only, NC Device + HS, NC Device + HS, 100 lfm Device + HS, 200 lfm Device + HS, 300 lfm SECTION A-A NOTES TAPE DETAILS 1. Material to be ESD 2. Approximately 6 Meters per Reel 3. 250 Pieces per Reel. 217-36CTR6 REEL DETAILS Dimensions: in. 22 Device Tab dT, CBoard Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 2 Surface Mount Heat Sinks 217 SERIES D PAK, TO-220, SOL-20 MECHANICAL DIMENSIONS BOARD LAYOUT RECOMMENDATIONS 217 SERIES TUBE DETAILS TUBE: 16.25 Inches Long, Min. ESD Material with Nail Stops 20 Pieces per Tube 217-36CTT6 SOL 20 REF: JEDEC TO-263 (DD PAK) 217-36CT6 REF: JEDEC MO-169 (DD PAK) Dimensions: in. Surface Mount Heat Sink 218 SERIES SMT Devices Height Above Maximum Standard PC Board Footprint Thermal Performance at Typical Load P/N in. (mm) in. (mm) Natural Convection Forced Convection 218-40CTE3 .40 (10.2) .90 (22.9) x .315 (8.0) 62C rise 2W 21C/W 200LFM 218-40CTE5 .40 (10.2) 1.03 (26.2) x .50 (12.7) 62C rise 2W 21C/W 200LFM Material: Copper, Matte Tin Plated MECHANICAL DIMENSIONS NATURAL AND FORCED CONVECTION CHARACTERISTICS AIR VELOCITY (LFM) AIR VELOCITY (LFM) 0 200 400 600 800 1000 0 200 400 600 800 1000 100 25 100 25 80 20 80 20 60 15 60 15 40 10 40 10 20 5 20 5 0 0 0 0 0 200 400 600 800 1000 0.5 1.0 1.5 2.0 2.5 0 200 400 600 800 1000 0.5 1.0 1.5 2.0 2.5 HEAT DISSIPATED (WATTS) HEAT DISSIPATED (WATTS) Solid line = 218-40CT5 Dashed Line = 218-40CT3 218-40CT3 218-40CT5 AIR VELOCITY (LFM) AIR VELOCITY (LFM) 0 200 400 600 800 1000 0 200 400 600 800 1000 23 100 10 100 20 18 80 8 80 16 14 60 6 60 12 10 40 8 40 4 6 20 2 20 4 2 0 0 0 0 1 2 3 4 5 1 2 3 4 5 0 200 400 600 800 1000 0 200 400 600 800 1000 HEAT DISSIPATED (WATTS) HEAT DISSIPATED (WATTS) AIR VELOCITY (LFM) AIR VELOCITY (LFM) 0 200 400 600 800 1000 0 200 400 600 800 1000 100 10 100 10 80 8 80 8 60 6 60 6 40 4 40 4 20 2 20 2 0 0 0 0 0 200 400 600 800 1000 2 4 6 8 10 2 1 4 6 8 0 0 200 400 600 800 1000 HEAT DISSIPATED (WATTS) HEAT DISSIPATED (WATTS) HEAT SINK TEMPERATURE RISE HEAT SINK TEMPERATURE RISE HEAT SINK TEMPERATURE RISE ABOVE AMBIENT AIR (C) ABOVE AMBIENT AIR (C) ABOVE AMBIENT AIR (C) THERMAL RESISTANCE SINK TO THERMAL RESISTANCE SINK TO THERMAL RESISTANCE SINK TO AMBIENT (C) AMBIENT (C) AMBIENT (C) HEAT SINK TEMPERATURE RISE HEAT SINK TEMPERATURE RISE HEAT SINK TEMPERATURE RISE ABOVE AMBIENT AIR (C) ABOVE AMBIENT AIR (C) ABOVE AMBIENT AIR (C) THERMAL RESISTANCE SINK TO THERMAL RESISTANCE SINK TO THERMAL RESISTANCE SINK TO AMBIENT (C) AMBIENT (C) AMBIENT (C)