Product Information

527-24AB-MS4

527-24AB-MS4 electronic component of Wakefield

Datasheet
Heat Sink Passive Horizontal Aluminum 5.8C/W Black Anodized
Manufacturer: Wakefield
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

5: USD 10.0012 ea
Line Total: USD 50.01

295 - Global Stock
Ships to you between
Fri. 17 May to Thu. 23 May
MOQ: 5  Multiples: 5
Pack Size: 5

 More Buying Options & Price Grid(s)

Availability Price Quantity
295 - WHS 1


Ships to you between Fri. 17 May to Thu. 23 May

MOQ : 5
Multiples : 5

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527-24AB-MS4
Wakefield

5 : USD 10.0012
25 : USD 8.4919
100 : USD 7.455
250 : USD 7.0875
500 : USD 6.8512
1000 : USD 4.3837
2500 : USD 3.8456
5000 : USD 3.675

295 - WHS 2


Ships to you between Fri. 17 May to Thu. 23 May

MOQ : 10
Multiples : 5

Stock Image

527-24AB-MS4
Wakefield

10 : USD 13.5258
25 : USD 11.1792
100 : USD 9.6433
250 : USD 9.011

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Additional Infomation About Product

Extruded Heat Sinks EXTRUDED HEAT SINKS FOR POWER SEMICONDUCTORS 621 AND 623 SERIES Low-Profile Heat Sinks for All Metal-Case Power Semiconductors TO-3 Footprint Thermal Performance at Typical Load Standard Dimensions Height Mounting Natural Forced Weight P/N in. (mm) in. (mm) Hole Pattern Convection Convection lbs. (grams) 621A 4.750 (120.6) x 1.500 (38.1) 0.461 (11.7) (1) TO-3 75C 15W 2.0C/W 250 LFM 0.1000 (45.36) 621K 4.750 (120.6) x 1.500 (38.1) 0.461 (11.7) None 75C 15W 2.0C/W 250 LFM 0.1000 (45.36) 623A 4.750 (120.6) x 3.000 (76.2) 0.461 (11.7) (1) TO-3 52C 15W 1.5C/W 250 LFM 0.2100 (95.26) 623K 4.750 (120.6) x 3.000 (76.2) 0.461 (11.7) None 52C 15W 1.5C/W 250 LFM 0.210O (95.26) A general purpose yet efficient heat dissipator for TO-3 and virtually all other styles of metal case in width, accommodating many types of packages. Mounting hole pattern is predrilled for the power semiconductor package types, the 621 and 623 Series low-profile flat back heat sinks find standard TO-3 package. Material: Aluminum Alloy, Black Anodized. a wide variety of applications. The central channel between fins measures 1.300 in. (33.0) (min.) 621 AND 623 SERIES (EXTRUSION PROFILE 1327) MECHANICAL NATURAL AND FORCED DIMENSIONS CONVECTION CHARACTERISTICS SEMICONDUCTOR MOUNTING HOLES A K Dimensions: in. (mm) 301/302/303 SERIES Compact Heat Sinks for Dual Stud-Mounted Semiconductor Cases STUD-MOUNT Outline Mounting Thermal Performance at Typical Load Standard Dimensions Length A Hole (s) Natural Forced Weight P/N in. (mm) in. (mm) Pattern and Number Convection Convection lbs. (grams) 301K 2.000 (50.8) x 2.000 (50.8) 0.750 (19.1) None 70C 15W 2.5C/W 250 LFM 0.0580 (26.31) 301M 2.000 (50.8) x 2.000 (50.8) 0.750 (19.1) (1) 10-32UNF, 0.625 in. thread depth 70C 15W 2.5C/W 250 LFM 0.0580 (26.31) 1 301N 2.000 (50.8) x 2.000 (50.8) 0.750 (19.1) (1) 4 -28UNF, 0.625 in. thread depth 70C 15W 2.5C/W 250 LFM 0.0580 (26.31) 302M 2.000 (50.8) x 2.000 (50.8) 1.500 (38.1) (1) 10-32UNF, 0.625 in. thread depth 50C 15W 1.8C/W 250 LFM 0.1330 (60.33) 302MM 2.000 (50.8) x 2.000 (50.8) 1.500 (38.1) (2) 10-32UNF, 0.625 in. thread depth 50C 15W 1.8C/W 250 LFM 0.1330 (6033) 1 302N 2.000 (50.8) x 2.000 (50.8) 1.500 (38.1) (1) 4 -28UNF, 0.625 in. thread depth 5OC 15W 1.8C/W 250 LFM 0.1330 (60.33) 1 302NN G 2.000 (50.8) x 2.000 (50.8) 1.500 (38.1) (2) 4 -28UNF, 0.625 in. thread depth 50C 15W 1.8C/W 250 LFM 0.1330 (60.33) 303M 2.000 (50.8) x 2.000 (50.8) 3.000 (76.2) (1) 10-32UNF, 0.625 in. thread depth 37C 15W 1.3C/W 250 LFM 0.2680 (121.56) 303MM 2.000 (50.8) x 2.000 (50.8) 3.000 (76.2) (2) 10-32UNF, 0.625 in. thread depth 37C 15W 1.3C/W 250 LFM 0.2680 (121.56) 1 303N G 2.000 (50.8) x 2.000 (50.8) 3.000 (76.2) (1) 4 -28UNF, 0.625 in. thread depth 37C 15W 1.3C/W 250 LFM 0.2680 (121.56) 1 303NN 2.000 (50.8) x 2.000 (50.8) 3.000 (76.2) (2) 4 -28UNF, 0.625 in. thread depth 37C 15W 1.3C/W 250 LFM 0.2680 (121.56) The large fin area in minimum total volume provided by the radial design of the 301/302/303 302 and 303 Series offer maximum cost savings with dual mounting locations (MM and Series offers maximum heat transfer efficiency in natural convection. All types are available NN mounting hole patterns) for two stud-mount devices. Material: Aluminum Alloy, Black with one tapped mounting hole for rectifiers and other stud-mounting semiconductors the Anodized. NATURAL AND FORCED MECHANICAL CONVECTION CHARACTERISTICS DIMENSIONS SEMICONDUCTOR MOUNTING HOLES K M N 302 AND 303 SERIES SERIES 301 302 Dimensions: in. (mm) 301 SERIES 303 641 SERIES Maximum Performance Natural Convection Heat Sink for all Metal-Case Semiconductors TO-3 Outline Mounting Thermal Performance at Typical Load Standard Dimensions Height Hole Natural Forced Weight P/N in. (mm) in. (mm) Pattern Convection Convection lbs. (grams) 641A G 4.125 (104.8) x 3.000 (76.2) 1.000 (25.4) (1) TO-3 36C 15W 0.9C/W 250 LFM 0.2900 (131.54) 641K G 4.125 (104.8) x 3.000 (76.2) 1.000 (25.4) None 36C 15W 0.9C/W 250 LFM 0.2900 (131.54) Available with a standard TO-3 mounting hole pattern predrilled for cost-effective mounting in 1.300 in. (33.0) and no predrilled mounting holes can be adapted to meet mounting require- limited-height applications, the 641 Series provides maximum performance in natural convec- ments for most metal case power semiconductor types. Material: Aluminum Alloy, Black tion with an optimized heat sink surface area. The 641K type with an open channel area of Anodized. 641 SERIES NATURAL AND FORCED MECHANICAL (EXTRUSION PROFILE 1371) CONVECTION CHARACTERISTICS DIMENSIONS SEMICONDUCTOR MOUNTING HOLES A K Dimensions: in. (mm) All other products, please contact factory for price, delivery, and minimums. G Normally stocked 50Extruded Heat Sinks EXTRUDED HEAT SINKS FOR POWER SEMICONDUCTORS 401 AND 403 SERIES Double-Surface Heat Sinks for TO-3 Case Styles TO-3 Stud-Mount Standard Width Overall Dimensions Height Semiconductor Thermal Performance at Typical Load Weight P/N in. (mm) in. (mm) in. (mm) Mounting Hole Pattem Natural Convection Forced Convection lbs. (grams) 401A G 4.750 (120.7) 1.500 (38.1) 1.250 (31.8) (1) TO-3 80C 30W 1.5C/W 250 LFM 0.1500 (68.04) 401F 4.750 (120.7) 1.500 (38.1) 1.250 (31.8) 0.270 in. (6.9)-Dia Hole 80C 30W 1.5C/W 250 LFM 0.1500 (68.04) 401K G 4.750 (120.7) 1.500 (38.1) 1.250 (31.8) None 80C 30W 1.5C/W 250 LFM 0.1500 (68.04) 403A G 4.750 (120.7) 3.000 (76.2) 1.250 (31.8) (1) TO-3 55C 30W 0.9C/W 250 LFM 0.3500 (158.76) 403F G 4.750 (120.7) 3.000 (76.2) 1.250 (31.8) 0.270 in. (6.9)-Dia Hole 55C 30W 0.9C/W 250 LFM 0.3500 (158.76 403K G 4.750 (120.7) 3.000 (76.2) 1.250 (31.8) None 55C 30W 0.9C/W 250 LFM 0.3500 (158.76) With fins oriented vertically in cabinet sidewall applications, 401 and 403 Series heat sinks 0.270 in. (6.9)-diameter mounting hole (with a 0.750 in. (19.1)-diameter area free of anodize) are recommended for critical space applications where maximum heat dissipation is required for mounting stud-type diodes and rectifiers. Hole pattem available upon request. for high-power TO-3 case styles. Forced convection performance is also exemplary with these Material: Aluminum Alloy, Black Anodized. double surface fin types. Semiconductor mounting hole style F offers a single centered MECHANICAL DIMENSIONS NATURAL AND FORCED CONVECTION CHARACTERISTICS 401 SERIES 403 SERIES Dimensions: in. (mm) SEMICONDUCTOR MOUNTING HOLES A F K V 401 AND 403 SERIES (EXTRUSION PROFILE 1024) 413/421/423 SERIES Low-Height Double-Surface Heat Sinks for TO-3 Case Styles and Diodes TO-3 DO-5 Stud-Mount Nominal Dimensions Standard Width Length Height A Semiconductor Thermal Performance at Typical Load Weight P/N in. (mm) in. (mm) in. (mm) Mounting Hole Pattern Natural Convection Forced Convection lbs. (grams) 413A 4.750 (120.7) 3.000 (76.2) 1.875 (47.6) (1) TO-3 72C 50W 0.85C/W 250 LFM 0.6300 (285.77) 413F 4.750 (120.7) 3.000 (76.2) 1.875 (47.6) 0.270 in. (6.9)-Dia Hole 72C 50W 0.85C/W 250 LFM 0.6300 (285.77) 413K G 4.750 (120.7) 3.000 (76.2) 1.875 (47.6) None 72C 50W 0.85C/W 250 LFM 0.6300 (285.77) 421A 4.750 (120.7) 3.000 (76.2) 2.625 (66.7) (1) TO-3 58C 50W 0.7C/W 250 LFM 0.6300 (285.77) 421F 4.750 (120.7) 3.000 (76.2) 2.625 (66.7) 0.270 in. (6.9)-Dia Hole 58C 50W 0.7C/W 250 LFM 0.6300 (285.77) 421K G 4.750 (120.7) 3.000 (76.2) 2.625 (66.7) None 58C 50W 0.7C/W 250 LFM 0.6300 (285.77) 423A 4.750 (120.7) 5.500 (140.2) 2.625 (66.7) (1) TO-3 47C 50W 0.5C/W 250 LFM 1.1700 (530.71) 423K G 4.750 (120.7) 5.500 (140.2) 2.625 (66.7) None 47C 50W 0.5C/W 250 LFM 1.1700 (530.71) Space-saving double surface 413, 421, and 423 Series utilize finned surface Wakefield Type 126 silicone-free thermal compound or Wakefield DeltaPad area on both sides of the power semiconductor mounting surface to provide interface materials for maximum performance. Material: Aluminum Alloy, Black maximum heat dissipation in a compact profile. Ready to install on popular Anodized. power components in natural and forced convection applications. Apply MECHANICAL DIMENSIONS NATURAL AND FORCED CONVECTION CHARACTERISTICS 423 SERIES 413 SERIES (EXTRUSION PROFILE 1025) (EXTRUSION PROFILE 2276 421 SERIES SEMICONDUCTOR MOUNTING HOLES (EXTRUSION PROFILE 1025) A F K V SERIES 413 421 Dimensions: in. (mm) All other products, please contact factory for price, delivery, and minimums. G Normally stocked 51

HS Compliance

Tariff Desc

7612.90.00 -Other Aluminium structures (excluding prefabricated buildings of heading no. 94.06) and parts of structures (for example, bridges and bridge-sections, towers, lattice masts, roofs, roofing frameworks, doors and windows and their frames and thresholds for doors, balustrades, pillars and columns); aluminium plates, rods, profiles, tubes and the like, prepared for use in structures:

Wakefield may also be referenced as

WAK
Wakefield Engineering
WAKEFIELD SOLUTIONS
WAKEFIELD THERMAL
Wakefield Thermal Solutions
Wakefield Thermal Solutions, Inc.
Wakefield-Vette
Wakefield-Vette, Inc

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