Product Information

604-60ABT5

604-60ABT5 electronic component of Wakefield

Datasheet
Heat Sinks Omnidirectional Pin Fin Heat Sink for BGA, Aluminum, Black Anodized, 21.6x15.2mm, Chomerics T411

Manufacturer: Wakefield
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

10: USD 2.172 ea
Line Total: USD 21.72

0 - Global Stock
MOQ: 10  Multiples: 1
Pack Size: 1
Availability Price Quantity
0 - WHS 1


Ships to you between Tue. 07 May to Mon. 13 May

MOQ : 10
Multiples : 1

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604-60ABT5
Wakefield

10 : USD 2.172
300 : USD 1.9277

     
Manufacturer
Product Category
RoHS - XON
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Thermal Management Solutions for BGAs BGA THERMAL SOLUTIONS MATRIX The following table represents Wakefields recommendations for a variety of standard BGA sizes. However, this is by no means a complete list of components that can be used with these heat sinks. To determine suitability for your particular component, request a BGA heat sink evaluation kit. BGA Heat Sink Heat Sink Height Recommended Attachment Sizes (mm) Footprint (mm) (inches) Series # Method 17 17 x 17 .40 D10650 Adhesive 19 19 x 19 1.00 602 Adhesive 21 21 x 21 .40 D10850 Adhesive 21 21 x 21 .25 .35 .45 .60 624 Adhesive 23 22 x 22 .40 .60 604 Adhesive 23 22 x 22 .75 605 Adhesive 25 25 x 25 .25 .35 .45 .60 625 Adhesive 27 28 x 28 .25 .35 .45 .60 658 Adhesive 29 30 x 30 .77 606 Adhesive 31 31 x 28 .65 607 Adhesive 31 31 x 31 .80 611 Adhesive 33 32 x 32 .35 .40 610 Adhesive 35 35 x 35 .65 612 Adhesive 35 35 x 35 .25 .35 .45 .60 642 Adhesive 35 35 x 35 .25 .35 .45 .60 630 Adhesive 37.5 37 x 37 .50 613 Adhesive 37.5 37 x 37 .65 659 Adhesive 45.7 x 35.5 37 x 47 .80 617 Adhesive 40 38 x 38 .30 .50 1.00 614 Adhesive 37.5 38 x 38 .29 660 Adhesive 40 40 x 28 .35 643 Clip 40 40 x 40 .26 .53 655 Adhesive 42.5 41 x 41 .41 615 Adhesive 45 43 x 43 .20 .25 .35 .45 .60 628 Adhesive 45 43 x 43 .15 662 Adhesive 47.5 47 x 47 .80 616 Adhesive 50 50 x 50 .40 .65 .80 1.00 698 Adhesive 50 51 x 51 .20 1.00 618 Adhesive 50 52 x 51 .80 622 Adhesive 50 53 x 47 .40 .65 .80 1.00 798 Adhesive 50 64 x 51 .24 620 Adhesive up to 45 73 x 50 .50 1.00 609 Clip up to 45 73 x 50 .95 619 Clip RoHS COMPLIANCE Please note that Wakefield part numbers designated with an E in this catalog denote new parts in compliance with the RoHS ini- tiative, with the exception of our Precision Clamps. Wakefield will still continue to offer non-RoHS compliant versions of these parts. Please be aware that many Wakefield Standard parts have always been compliant since their design inception and therefore will not carry the E designation. Wakefield requests that you refer to the RoHS compliance tool on our website at www.wakefield.com to verify RoHS compliance. If you require further clarification or information regarding RoHS, please contact the factory. 2Thermal Interface THERMAL INTERFACE MATERIAL PART NUMBER GUIDE All of the heat sinks shown in this catalog are available with any of the following thermal tape and interface materials, pre-applied at the factory. Use the T series, thermally enhanced, pressure sensitive adhesives to attach the heat sink to the electronic package and provide a good thermal link to the heat sink. The S series interface materials have adhesives on only one side, for pre-attachment to the heat sink, and provide superior thermal performance. Specify these materials in applications where the heat sink will be fixed to the electronic package by some mechanical means other than a tape. Please note that none of these materials are for use in applications requiring elec- trical isolation from the electronic device. All options other than -T1 and -T4 are RoHS compliant. Note: To obtain the estimated thermal resistance of the interface material in your application, divide the thermal impedance value by the area of the pad in square inches. For example, a 2 x 2 piece of T4 has a resistance of 1.10 C-in^2/W  4 in^2=0.275 C/W T SERIES THERMALLY ENHANCED PRESSURE SENSITIVE ADHESIVES Manufacturer Thermal Impedance Thickness, Suffix Product C-in^2/W Inches Package Surface, Comments -T1 Chomerics, T405 0.47 0.006 Metal/ceramic; aluminum carrier -T1E Chomerics, T405R 0.47 0.006 RoHS-compliant version of -T1 -T3 Chomerics, T412 0.25 0.009 Metal/ceramic; very good performance and conformity -T4 Chomerics, T410 1.10 0.007 Plastic -T4E Chomerics, T410R 1.10 0.007 RoHS-compliant version of -T4 -T5 Chomerics, T411 1.00 0.011 Plastic; conforms to out-of-flat packages -T6 3M, 8810 0.88 0.010 Metal/ceramic; very good adhesion and conformity -T7 Bergquist, BP 108 1.28 0.008 Metal/ceramic; electrically insulating S SERIES THERMAL INTERFACE PADS Manufacturer Thermal Impedance Thickness, Suffix Product C-in^2/W Inches Package Surface, Comments -S4 Berquist Softface 0.06 0.005 All surfaces; requires mechanical fasteners ORDERING INFORMATION Once you have chosen heat sink and thermal interface material that meets your thermal & mechanical requirements it is easy to designate the part number. Simply add the interface material suffix referenced on the chart above to the base part number for the heat sink. The base part number already includes information regarding its size and finish. Example: To order the 658 Series heat sink at .350 tall with the T5 thermal interface material, specify part number: 658-35AB - T5 From Catalog Page ?? From Table on Page ?? 3

Tariff Desc

7612.90.00 -Other Aluminium structures (excluding prefabricated buildings of heading no. 94.06) and parts of structures (for example, bridges and bridge-sections, towers, lattice masts, roofs, roofing frameworks, doors and windows and their frames and thresholds for doors, balustrades, pillars and columns); aluminium plates, rods, profiles, tubes and the like, prepared for use in structures:
WAK
Wakefield Engineering
WAKEFIELD SOLUTIONS
WAKEFIELD THERMAL
Wakefield Thermal Solutions
Wakefield Thermal Solutions, Inc.
Wakefield-Vette
Wakefield-Vette, Inc

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