Product Information

906-31-2-23-2-B-0

906-31-2-23-2-B-0 electronic component of Wakefield

Datasheet
Heat Sinks Chipset Heat Sink with Clip, Pin Fin, 31mm Chip Size, 22.6mm Height, Aluminum
Manufacturer: Wakefield
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 9.346 ea
Line Total: USD 9.35

7 - Global Stock
Ships to you between
Mon. 03 Jun to Wed. 05 Jun
MOQ: 1  Multiples: 1
Pack Size: 1

 More Buying Options & Price Grid(s)

Availability Price Quantity
269 - WHS 1


Ships to you between Mon. 03 Jun to Wed. 05 Jun

MOQ : 1
Multiples : 1
1 : USD 9.5151
10 : USD 9.2615
25 : USD 8.851
50 : USD 8.3318
90 : USD 7.6797
270 : USD 7.6435
540 : USD 7.6314
1080 : USD 7.5952

Read More Specifications

     
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RoHS - XON
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Mounting Style
Heatsink Material
Fin Style
Thermal Resistance
Height
Designed for
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Additional Infomation About Product

901-910 SERIES CHIPSET HEAT SINKS PIN FIN & ELLIPTICAL HEAT SINKS Wakefield-Vettes 901-910 Series Heat Sinks for Chipset can match up to devices from Intel, Broadcom, Xilinx. TI, Motorola and many more These heat sinks are designed Wakefield-Vette heat sink assembles onto for air flow applications. Enclosed pages chip set using the space that is between the have thermal performance data for natural PCB and the substrate of the solder balls. forced convection values. The solder balls provide a minimal gap of .5mm to .7mm. Attachment feature is below a .4mm thickness. The clipping system will not interfere or damage chip. Contact area is the edge of chip. 4 Springs at each corner Thermal Cooling Solutions from SMART to FINISH901-910 SERIES CHIPSET HEAT SINKS Material: AL 6063 Finish: Black Anodize All dimensions in millimeters (mm) Part Numbering System * *Note: When selecting part number chip set thickness (CST) relates to spring selection Thermal Cooling Solutions from SMART to FINISH

HS Compliance

Tariff Desc

7612.90.00 -Other Aluminium structures (excluding prefabricated buildings of heading no. 94.06) and parts of structures (for example, bridges and bridge-sections, towers, lattice masts, roofs, roofing frameworks, doors and windows and their frames and thresholds for doors, balustrades, pillars and columns); aluminium plates, rods, profiles, tubes and the like, prepared for use in structures:

Wakefield may also be referenced as

WAK
Wakefield Engineering
WAKEFIELD SOLUTIONS
WAKEFIELD THERMAL
Wakefield Thermal Solutions
Wakefield Thermal Solutions, Inc.
Wakefield-Vette
Wakefield-Vette, Inc

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